Abstract: An improved enclosure for housing communications and electronics equipment comprises a heating element fabricated with a positive temperature coefficient material. The enclosure is particularly useful for housing communications equipment and cell site base stations for cellular telephone systems in the outdoors; it has self-regulating heating capabilities that are not dependent upon voltage parameters, thereby enabling its use in diverse geographic locations. In a preferred embodiment, a plurality of PTC heating elements are used and selectively located adjacent a plurality of circuitry regions. DC power may be used to energize the PTC heaters, and the enclosure may be used for telephone equipment operating with AC or DC power.

Abstract: A protective shutter assembly for a fan of a forced air cooling system includes lightweight shutter members mounted for pivoting motion about vertical axes. When the fan is operative, its shutter members are pivoted in a first direction to expose the fan and allow air to be exhausted therefrom. When a fan is inoperative, its shutter members pivot in a second direction toward the fan and overlap to prevent air from being reversely drawn into the fan.

Abstract: An enclosure for electronic components which is provided with a heater mounted to an exterior wall to maintain a minimum operating temperature for the electronic components without utilizing space within the enclosure.

Abstract: An enclosure according to this invention comprises a thermally conductive wall mountable to a heat source. The enclosure is mounted such that heat transfers from the heat source to the thermally conductive wall. A bracket holds the item to be heated to at least one of the walls of the enclosure, such that the item is warmed by thermal conduction. A thermal pad may be interposed between the item and the mounting wall and, likewise, between the enclosure and the heat source. By this structure, heat is passed from the heat source to the enclosure and then to the item.

Abstract: An enclosure containing heat generating electrical components is provided with exterior heat fins and is enclosed within a perforated cover. The heat fins are generally planar and parallel to define vertical channels between adjacent pairs of fins. The fins are formed with a plurality of aligned notches to define a plurality of horizontal channels. The perforations in the cover are arrayed along a plurality of horizontal lines, with at least one of the horizontal lines overlying each of the horizontal channels.

Abstract: The present invention is an enclosure with a cooling scheme for cooling heat producing devices, such as electronic components, contained within the enclosure. Specifically, the cooling scheme of the present invention shelters the enclosure from solar heat without significantly decreasing the efficiency of the convection process associated with heat sinks. In an embodiment of the present invention, the enclosure comprises a housing and a solar shield. The housing includes a plurality of heat sinks for absorbing and dissipating heat generated by the devices. Each heat sink has an interior side to which the devices are mounted and an exterior side with a plurality of fins that form first and second channels. The first channels are aligned longitudinally with the prevalent direction of airflow, and the second channels are aligned in a contrasting manner to the first channels to allow fresh air to be drawn into the first channels (through the second channels) during the convection process.

Abstract: A non-bleeding thixotropic thermally conductive material finding particular use for enhancing the cooling ability of electrical components which comprises a silicone liquid carrier, a thermal filler powder of lamellar or dendritic shape and silica fibers.