Abstract: A connector and method for making wherein the connector has a connector body, connector leads extending from the connector body for solder connection to an electronic circuit wherein the connector leads do not extend a uniform distance from the body connector body. A solder paste is formed on each connector lead by stenciling it onto a flat plate that is non-wettable to the solder paste. The solder paste is composed of first solder particles having a first lower melting point and second solder particles having a second higher melting point. The solder paste is heated to the first melting point for adhering the solder paste to the connector leads while planarizing the solder covered electrical leads with the flat plate. The connector leads are soldered to an electrical circuit by removing the flat plate and heating the solder paste to the second higher melting point.

Abstract: A process and apparatus for revealing manufacturing defects in testpieces, such as printed circuit boards, by passing through high-intensity attenuated x-rays (above 150 Kilo-Volts) to reusable photo plates for revealing defects in the testpieces. The x-rays are angled from 35 to 50 degrees for generating images of defects within thick multilayered printed circuit boards. During exposure, a thin lead sheet is placed between the testpiece and a phosphor photographic plate on a side of the testpeice opposite the x-ray gun. The lead sheet uniformly attenuates the high-energy x-rays to the captured image before they reach the phosphor plate to avoid damage to the photographic reuse of the plate and prevent over-exposure without loss of image contrast in the phosphor photograph. The exposed phosphor plate is excited with a low energy monochromatic radiation to visually activate the latent x-ray image in the exposed plate.