Patents by Inventor Nandha Kumar Mohanraj

Nandha Kumar Mohanraj has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE INCLUDING DIFFERENTIAL HEIGHT PCB
    Publication number: 20230223307
    Abstract: A semiconductor device has a differential height substrate including a first section and a second section thinner than the first section. The first section may include contact fingers for electrically coupling the semiconductor device to a connector in a slot of a host device. The second section may include one or more semiconductor dies and other components. Mold compound may encapsulate the semiconductor dies and other components, leaving the contact fingers in the first section of the substrate exposed. A second layer of mold compound may also be applied to a second, uniformly planar surface of the differential height substrate opposite a surface including the one or more semiconductor dies.
    Type: Application
    Filed: January 10, 2022
    Publication date: July 13, 2023
    Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Nandha Kumar Mohanraj, Jegathese Dhanachandra Prakash, Tamilselvan Krishnamoorthy
  • Integrated USB connector and memory device
    Patent number: 10485125
    Abstract: A USB device is disclosed including an integrated memory module and USB connector. Integration of the memory module with the USB connector according to the present technology provides a USB device with a compact footprint and efficient heat transfer to a host device in which the USB device is used.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: November 19, 2019
    Assignee: Western Digital Technologies, Inc.
    Inventors: Hem Takiar, Michael Patterson, Nandha Kumar Mohanraj
  • INTEGRATED USB CONNECTOR AND MEMORY DEVICE
    Publication number: 20190200471
    Abstract: A USB device is disclosed including an integrated memory module and USB connector. Integration of the memory module with the USB connector according to the present technology provides a USB device with a compact footprint and efficient heat transfer to a host device in which the USB device is used.
    Type: Application
    Filed: December 22, 2017
    Publication date: June 27, 2019
    Applicant: Western Digital Technologies, Inc.
    Inventors: Hem Takiar, Michael Patterson, Nandha Kumar Mohanraj