Patents by Inventor Nanette Quevedo

Nanette Quevedo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package including an underfill material in a portion of an area between the package and a substrate or another package
    Patent number: 9374902
    Abstract: Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having a substrate or a first package, and a second package coupled to the substrate or the first package, wherein the second package includes at least one die and an underfill material disposed in a portion, but not an entirety, of an area between the package and the substrate or the first package. Other embodiments may be described and claimed.
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: June 21, 2016
    Assignee: Micron Technology, Inc.
    Inventors: Myung Jin Yim, Nanette Quevedo, Richard Strode
  • PACKAGE INCLUDING AN UNDERFILL MATERIAL IN A PORTION OF AN AREA BETWEEN THE PACKAGE AND A SUBSTRATE OR ANOTHER PACKAGE
    Publication number: 20130258578
    Abstract: Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having a substrate or a first package, and a second package coupled to the substrate or the first package, wherein the second package includes at least one die and an underfill material disposed in a portion, but not an entirety, of an area between the package and the substrate or the first package. Other embodiments may be described and claimed.
    Type: Application
    Filed: May 24, 2013
    Publication date: October 3, 2013
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Myung Jin Yim, Nanette Quevedo, Richard Strode
  • Package including an underfill material in a portion of an area between the package and a substrate or another package
    Patent number: 8451620
    Abstract: Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having a substrate or a first package, and a second package coupled to the substrate or the first package, wherein the second package includes at least one die and an underfill material disposed in a portion, but not an entirety, of an area between the package and the substrate or the first package. Other embodiments may be described and claimed.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: May 28, 2013
    Assignee: Micron Technology, Inc.
    Inventors: Myung Jin Yim, Nanette Quevedo, Richard Strode
  • PACKAGE INCLUDING AN UNDERFILL MATERIAL IN A PORTION OF AN AREA BETWEEN THE PACKAGE AND A SUBSTRATE OR ANOTHER PACKAGE
    Publication number: 20110128711
    Abstract: Embodiments include but are not limited to apparatuses and systems including semiconductor packages, e.g. memory packages, having a substrate or a first package, and a second package coupled to the substrate or the first package, wherein the second package includes at least one die and an underfill material disposed in a portion, but not an entirety, of an area between the package and the substrate or the first package. Other embodiments may be described and claimed.
    Type: Application
    Filed: November 30, 2009
    Publication date: June 2, 2011
    Inventors: Myung Jin Yim, Nanette Quevedo, Richard Strode
  • Package on Package Assembly using Electrically Conductive Adhesive Material
    Publication number: 20100148359
    Abstract: Packages are joined together using an anisotropic conductive material that includes an electrically insulative component and a plurality of electrically conductive particles. The electrically conductive particles may complete electrical connection between inter-package connectors and bond pads that may otherwise fail. The electrically insulative component may be cured to act as an underfill to provide mechanical connection between the packages.
    Type: Application
    Filed: December 14, 2008
    Publication date: June 17, 2010
    Inventors: Nanette Quevedo, Myung Jin Yim