Patents by Inventor Nanik Bakhru

Nanik Bakhru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Erosion/corrosion resistant diaphragm
    Patent number: 5241131
    Abstract: The present invention relates generally to a new erosion/corrosion resistant diaphragm, and more particularly to an erosion/corrosion resistant diaphragm that can be used in an apparatus for cooling integrated circuit chips. An erosion/corrosion resistant coating can be provided on one side of a metallic foil that will be exposed to fluid impingement. And, a similar erosion/corrosion resistant coating can be provided on the opposite side of the metallic foil where the normal thermal cycling of the chip might damage the unprotected metallic foil.
    Type: Grant
    Filed: April 14, 1992
    Date of Patent: August 31, 1993
    Assignee: International Business Machines Corporation
    Inventors: Nanik Bakhru, Alfred Grill, Gregory S. Hopper, Egidio Marotta, Bernard S. Meyerson, Vishnubhai V. Patel
  • Ceramic substrate having a protective coating thereon and a method for protecting a ceramic substrate
    Patent number: 5196251
    Abstract: Disclosed is a ceramic substrate having a protective coating on at least one surface thereof which includes:a ceramic substrate having at least one electrically conductive via extending to a surface of the substrate;an electrically conductive I/O pad electrically connected to at least one of the vias;an I/O pin brazed to the I/O pad, the brazed pin having a braze fillet; anda protective layer of polymeric material fully encapsulating the I/O pad, wherein the layer of polymeric material protects the I/O pad from corrosion.
    Type: Grant
    Filed: April 30, 1991
    Date of Patent: March 23, 1993
    Assignee: International Business Machines Corporation
    Inventors: Nanik Bakhru, Richard A. Bates, George Czornyj, Nunzio DiPaolo, Ananda H. Kumar, Suryanarayana Mukkavilli, Heinz O. Steimel, Rao R. Tummala
  • Copper device and use thereof with semiconductor devices
    Patent number: 5031029
    Abstract: A device that contains a copper substrate; a rigidizing layer and/or a metal layer, and a non-graphitic hard carbon layer deposited on the rigidizing layer; and use as a heat sink or piston for electronic components.
    Type: Grant
    Filed: April 4, 1990
    Date of Patent: July 9, 1991
    Assignee: International Business Machines Corporation
    Inventors: John Acocella, Nanik Bakhru, Alfred Grill, Egidio Marotta, Bernard S. Meyerson, Vishnubhai V. Patel