Patents by Inventor Nannaji Saka

Nannaji Saka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11639881
    Abstract: A hydrodynamic bearing fault prediction, detection, diagnosis, and response system for combustion ignition engines, machines and/or coupled components of a combustion ignition engine and/or machine; a plurality of transducers, each disposed proximally or about each of the engine/machine components or engine itself; with at least one transducer with capacitance sensing abilities, each of the transducers disposed to react to changes in the dielectric constant of a nanosuspension circulated about the monitored component.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: May 2, 2023
    Inventors: Carlos A. Rosero, Nannaji Saka
  • Patent number: 8758091
    Abstract: Polishing pad conditioning system. The system includes a first rotatable platen supporting a polishing pad containing asperities having a radius of curvature. A second rotatable platen supports a disk of bulk material having holes therethrough, the second rotatable platen supported for translation as well as rotation. Means are provided for pushing the polishing pad and bulk material into contact at an interface during rotation and translation and means are provided for passing a slurry through the holes in the bulk material to the interface whereby the radius of curvature of the pad asperities is increased. Water may be delivered to the bulk material for cooling. A process for conditioning a polishing pad is also disclosed.
    Type: Grant
    Filed: April 6, 2010
    Date of Patent: June 24, 2014
    Assignee: Massachusetts Institute of Technology
    Inventors: Nannaji Saka, Thor Eusner, Jung-Hoon Chun
  • Publication number: 20110244764
    Abstract: Polishing pad conditioning system. The system includes a first rotatable platen supporting a polishing pad containing asperities having a radius of curvature. A second rotatable platen supports a disk of bulk material having holes therethrough, the second rotatable platen supported for translation as well as rotation. Means are provided for pushing the polishing pad and bulk material into contact at an interface during rotation and translation and means are provided for passing a slurry through the holes in the bulk material to the interface whereby the radius of curvature of the pad asperities is increased. Water may be delivered to the bulk material for cooling. A process for conditioning a polishing pad is also disclosed.
    Type: Application
    Filed: April 6, 2010
    Publication date: October 6, 2011
    Applicant: Massachusetts Institute of Technology
    Inventors: Nannaji Saka, Thor Eusner, Jung-Hoon Chun
  • Patent number: 6798529
    Abstract: A method and apparatus for providing in-situ monitoring of the removal of materials in localized regions on a semiconductor wafer or substrate during chemical mechanical polishing (CMP) is provided. In particular, the method and apparatus of the present invention provides for detecting the differences in reflectance between the different materials within certain localized regions or zones on the surface of the wafer. The differences in reflectance are used to indicate the rate or progression of material removal in each of the certain localized zones.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: September 28, 2004
    Assignees: Aviza Technology, Inc., Massachusetts Institute of Technology
    Inventors: Nannaji Saka, Jamie Nam, Hilario L. Oh
  • Publication number: 20040149084
    Abstract: An apparatus and method of forming fluxless solder balls includes forming solder balls from a supply of solder. A coating is formed on the solder balls for limiting naturally occurring oxide growth on the solder balls before significant natural oxide growth on the solder balls has occurred. The coating allows the solder balls to be soldered without using flux.
    Type: Application
    Filed: September 5, 2002
    Publication date: August 5, 2004
    Applicant: Massachusetts Institute of Technology
    Inventors: Jung-Hoon Chun, Richard F. Foulke, Juan C. Rocha, Nannaji Saka
  • Patent number: 6476921
    Abstract: A method and apparatus for providing in-situ monitoring of the removal of materials in localized regions on a semiconductor wafer or substrate during chemical mechanical polishing (CMP) is provided. In particular, the method and apparatus of the present invention provides for detecting the differences in reflectance between the different materials within certain localized regions or zones on the surface of the wafer. The differences in reflectance are used to indicate the rate or progression of material removal in each of the certain localized zones.
    Type: Grant
    Filed: July 31, 2000
    Date of Patent: November 5, 2002
    Assignees: ASML US, Inc., Massashusetts Institute of Technology
    Inventors: Nannaji Saka, Jamie Nam, Hilario L. Oh
  • Patent number: 6458013
    Abstract: In the Chemical Mechanical Polishing (CMP) process employed for microelectronics manufacturing, three contact regimes between the wafer surface and the polishing pad may be proposed: direct contact, mixed or partial contact, and hydroplaning. However, an effective in situ method for characterizing the wafer/pad contact and a systematic way of relating contact conditions to the process parameters are still lacking. In this work, the interfacial friction force, measured by a load sensor on the wafer carrier, has been employed to characterize the contact conditions. Models that relate the friction coefficient to the applied pressure, relative velocity, and slurry viscosity are developed and verified by experiments. Additionally, a correlation between friction coefficient and the material removal rate (MR) is established and the effects of process parameters on the Preston constant are investigated.
    Type: Grant
    Filed: July 31, 2000
    Date of Patent: October 1, 2002
    Assignees: ASML US, Inc., Massachusetts Institute of Technology
    Inventors: Nannaji Saka, Jiun-Yu Lai, Hilario L. Oh
  • Patent number: 6197178
    Abstract: A process and apparatus for forming oxide coatings on bodies of aluminum and aluminum alloys are described. The process includes forming an electrolyte bath in an inert container. At least two reactive metal bodies are suspended in the bath. The bodies are connected to electrodes which, in turn, are connected to a multiphase AC circuit. A multiphase power (preferably three-phase between three bodies) potential is imposed between each of the bodies. The bodies are moved in the electrolyte bath relative to each other until micro-arcs occur on the surfaces of the bodies, whereby to commence oxidation of the bodies. The imposition of the potential between each of the bodies is continued until the desired thickness of oxide is formed on the bodies.
    Type: Grant
    Filed: April 2, 1999
    Date of Patent: March 6, 2001
    Assignee: Microplasmic Corporation
    Inventors: Jerry L. Patel, Nannaji Saka
  • Patent number: 5673746
    Abstract: A liquid metal/solid metal interface detecting device comprises in general a radiation source for generating gamma radiation, which is directed to pass through a strand extruded from a continuous casting mold. A detector detects the gamma radiation passing through the partially solidified strand to determine a spatial profile for a liquid metal/solid metal interface by relying on the different gamma radiation attenuation characteristics of the solid metal and the liquid metal. Preferably, the gamma radiation is at energies of greater than one million electron volts. In some embodiments, a movable support carries the radiation source and the detector and moves the radiation source and detector along and around the ingot enabling generation of a three-dimensional profile of the liquid metal/solid metal interface by utilizing tomographic imaging techniques.
    Type: Grant
    Filed: April 1, 1996
    Date of Patent: October 7, 1997
    Assignee: Massachusetts Institute of Technology
    Inventors: Jung-Hoon Chun, Richard C. Lanza, Nannaji Saka
  • Patent number: 5509460
    Abstract: A liquid metal/solid metal interface detecting device comprises in general a radiation source for generating gamma radiation, which is directed to pass through a strand extruded from a continuous casting mold. A detector detects the gamma radiation passing through the partially solidified strand to determine a spatial profile for a liquid metal/solid metal interface by relying on the different gamma radiation attenuation characteristics of the solid metal and the liquid metal. Preferably, the gamma radiation is at energies of greater than one million electron volts. In some embodiments, a movable support carries the radiation source and the detector and moves the radiation source and detector along and around the ingot enabling generation of a three-dimensional profile of the liquid metal/solid metal interface by utilizing tomographic imaging techniques.
    Type: Grant
    Filed: August 25, 1994
    Date of Patent: April 23, 1996
    Assignee: Massachusetts Institute of Technology
    Inventors: Jung-Hoon Chun, Richard C. Lanza, Nannaji Saka
  • Patent number: 4687274
    Abstract: A pair of elements for providing slidable electrical contact therebetween wherein the contact surface of at least one of the elements comprises a plurality of contact portions and a plurality of depressed portions in between the contact portions so that wear particles which are generated between their contact surfaces as the elements are moved relative to each other are effectively swept from between the contact surfaces into the depressed portions where they are entrapped. Such operation tends to maintain a low electrical resistance between the elements over many cycles of use.
    Type: Grant
    Filed: May 10, 1984
    Date of Patent: August 18, 1987
    Assignee: Massachusetts Institute of Technology
    Inventors: Nam P. Suh, Nannaji Saka, Ming J. Liou