Abstract: A light detection device includes: a back-illuminated light receiving element; a circuit element; a connection member; an underfill; and a light shielding mask. The light shielding mask includes a frame having an opening and a light shielding layer formed on an inner surface of the opening. A first opening edge on the side of the circuit element in the opening is located at the outside of an outer edge of the light receiving element. A second opening edge opposite to the circuit element in the opening is located at the inside of the outer edge of the light receiving element. The opening is narrowed from the first opening edge toward the second opening edge. A width of the frame increases from the first opening edge toward the second opening edge. The underfill reaches a gap between the light receiving element and the light shielding layer.

Abstract: An optical semiconductor package includes a first chip, a second chip, a first resin portion formed to cover a side surface of the first chip, a second resin portion formed to cover a side surface of the second chip, a first terminal provided on a first inner surface of the first chip, a second terminal provided on a second inner surface of the second chip, and a first wiring electrically connected to the first terminal, passing through an inside of the first resin portion, and extending from a first inner surface side to a first outer surface side of the first chip in a facing direction in which the first inner surface and the second inner surface face each other. The second chip is an optical element. The first resin portion and the second resin portion are integrally provided or continuously provided via another member.

Abstract: A method of manufacturing a semiconductor substrate according to an embodiment includes a first step of forming a groove having a bottom surface and a side surface on which scallops are formed by performing a process including isotropic etching on a main surface of a substrate, a second step of performing at least one of a hydrophilic treatment on the side surface of the groove and a degassing treatment on the groove, and a third step of removing the scallops formed on the side surface of the groove and planarizing the side surface by performing anisotropic wet etching in a state where the bottom surface of the recess is present.

Abstract: A processing apparatus comprises a processor including hardware. The processor acquires structure data of an organ, acquires an endoscope image from an imager of an endoscope, and acquires an ultrasonic image from a probe of the endoscope. The processor automatically controls a probe position of the endoscope based on the structure data and the distal end position information of the endoscope in a first control mode, and automatically controls the probe position based on the ultrasonic image in a second control mode.

Abstract: An information processing system includes a processor including hardware. The processor acquires an endoscope image from an endoscope in which a papillary portion appears in the endoscope image, corrects the endoscope image based on correction information which is identified by an organ structure, and determines route information of a lumen based on the corrected endoscope image.

Abstract: The damascene wiring structure includes a base including a main surface provided with a groove, an insulating layer including a first portion provided on an inner surface of the groove and a second portion provided on the main surface, a metal layer provided on the first portion, a wiring portion embedded in the groove, and a cap layer provided to cover the second portion and the wiring portion. A surface of a boundary part between the first portion and the second portion includes an inclined surface inclined with respect to a direction perpendicular to the main surface.

Abstract: A light detection device includes: a back-illuminated light receiving element; a circuit element; a connection member; an underfill; and a light shielding mask. The light shielding mask includes a frame having an opening and a light shielding layer formed on an inner surface of the opening. A first opening edge on the side of the circuit element in the opening is located at the outside of an outer edge of the light receiving element. A second opening edge opposite to the circuit element in the opening is located at the inside of the outer edge of the light receiving element. The opening is narrowed from the first opening edge toward the second opening edge. A width of the frame increases from the first opening edge toward the second opening edge. The underfill reaches a gap between the light receiving element and the light shielding layer.

Abstract: The damascene wiring structure includes a base including a main surface provided with a groove, an insulating layer including a first portion provided on an inner surface of the groove and a second portion provided on the main surface, a metal layer provided on the first portion, a wiring portion embedded in the groove, and a cap layer provided to cover the second portion, an end portion of the metal layer, and the wiring portion. A surface of a boundary part between the first portion and the second portion includes an inclined surface inclined with respect to a direction perpendicular to the main surface. The end portion of the metal layer enters between the cap layer and the inclined surface, and in the end portion, a first surface along the cap layer and a second surface along the inclined surface form an acute angle.

Abstract: To improve repulsion performance when a ball is hit by a racket. Grommets each include a strip-shaped portion and a cylinder portion protruding from one surface of the strip-shaped portion. The cylinder portion includes a plurality of ribs extending along an extending direction of a central axis of a cylinder main body. The plurality of ribs is constituted of first ribs protruding from an outer peripheral surface of the cylinder main body toward both sides in the extending direction of the strip-shaped portion, and second ribs protruding from the outer peripheral surface of the cylinder main body toward both sides in a direction orthogonal to the extending direction of the strip-shaped portion. Two or more of the first ribs are formed on each of the both sides in the extending direction of the strip-shaped portion, and one or more of the second ribs are formed on each of the both sides in the direction orthogonal to the extending direction of the strip-shaped portion.

Abstract: A light detection device includes: a back-illuminated light receiving element; a circuit element; a connection member; an underfill; and a light shielding mask. The light shielding mask includes a frame having an opening and a light shielding layer formed on an inner surface of the opening. A first opening edge on the side of the circuit element in the opening is located at the outside of an outer edge of the light receiving element. A second opening edge opposite to the circuit element in the opening is located at the inside of the outer edge of the light receiving element. The opening is narrowed from the first opening edge toward the second opening edge. A width of the frame increases from the first opening edge toward the second opening edge. The underfill reaches a gap between the light receiving element and the light shielding layer.

Abstract: A stent delivery system includes: a stent delivery device configured to carry a stent to a stenosis and indwell the stent, an observation device configured to observe the stenosis, and one or more processors comprising hardware, the one or more processors being configured to: acquire an observation image from the observation device, and determine at least one stent candidate to be placed in the stenosis based on the observation image.

Abstract: A stent delivery system includes: a stent delivery device configured to carry a stent to a stenosis and indwell the stent; an observation device configured to observe the stenosis; and one or more processors, each comprising hardware, the one or more processors being configured to: acquire an observation image from the observation device; and determine a target placement position for placing the stent in the stenosis based on the observation image.

Abstract: A light detection device includes: a back-illuminated light receiving element; a circuit element; a connection member; an underfill; and a light shielding mask. The light shielding mask includes a frame having an opening and a light shielding layer formed on an inner surface of the opening. A first opening edge on the side of the circuit element in the opening is located at the outside of an outer edge of the light receiving element. A second opening edge opposite to the circuit element in the opening is located at the inside of the outer edge of the light receiving element. The opening is narrowed from the first opening edge toward the second opening edge. A width of the frame increases from the first opening edge toward the second opening edge. The underfill reaches a gap between the light receiving element and the light shielding layer.

Abstract: A medical system including: an instrument having a motion that is electrically driven, the motion being forward and backward movement of an insertion section, a bending angle of a bending section of the insertion section, and/or rolling rotation of the insertion section; an operation device performing an operation input of the motion; and a processor. The processor controlling the motion based on the operation input in a motion mode, the motion mode being one of a full auto mode to perform automatic control of the motion and a semi auto mode in which an operator manually controls the motion. When controlling the motion in the semi auto mode, the processor interrupting the semi auto mode by automatic control of the motion to perform intervention, Subsequent to the intervention, the processor switching to one of the full auto mode and the semi auto mode based on a use of the instrument.

Abstract: A light detection device includes: a back-illuminated light receiving element; a circuit element; a connection member; an underfill; and a light shielding mask. The light shielding mask includes a frame having an opening and a light shielding layer formed on an inner surface of the opening. A first opening edge on the side of the circuit element in the opening is located at the outside of an outer edge of the light receiving element. A second opening edge opposite to the circuit element in the opening is located at the inside of the outer edge of the light receiving element. The opening is narrowed from the first opening edge toward the second opening edge. A width of the frame increases from the first opening edge toward the second opening edge. The underfill reaches a gap between the light receiving element and the light shielding layer.

Abstract: A light module includes an optical element and a base on which the optical element is mounted. The optical element has an optical portion which has an optical surface; an elastic portion which is provided around the optical portion such that an annular region is formed; and a pair of support portions which is provided such that the optical portion is sandwiched in a first direction along the optical surface and in which an elastic force is applied and a distance therebetween is able to be changed in accordance with elastic deformation of the elastic portion. The base has a main surface, and a mounting region in which an opening communicating with the main surface is provided. The support portions are inserted into the opening in a state where an elastic force of the elastic portion is applied.

Abstract: A medical system includes a processor. The processor is configured to calculate a presence probability of a lesion in a not-yet-observed region inside a hollow organ of a patient, the not-yet-observed region being specified on the basis of an image that has been captured by an imaging sensor of an endoscope inside the hollow organ, and spatial disposition information of a distal end of an insertion part of the endoscope.

Abstract: A semiconductor device includes a support body including a mount region, a semiconductor chip disposed on the mount region with a predetermined distance therebetween, a bump disposed between the support body and the semiconductor chip, a wall portion disposed between the support body and the semiconductor chip along a part of an outer edge of the semiconductor chip, and an underfill resin layer disposed between the support body and the semiconductor chip. The underfill resin layer covers an outer side surface of the wall portion.

Abstract: Structures with racket performance varied according to the configurations of cylindrical parts can be easily used. A grommet (25-28) includes a cylindrical part (32) which is mounted pierced through a through hole (23) formed in a frame (20) of a racket (10) and through which a string (21) passes. The string is extended in a tensioned state on the frame so as to form front and back faces as hitting faces (22). The cylindrical part includes a first formation section (35) forming both sides of a central axis position (C) of the cylindrical part and a second formation section (36) rotationally shifted with reference to the central axis position by 90 degrees relative to the first formation section and forming both sides of the central axis position. One of the first and second formation sections is disposed on both sides in a front/back direction. The first and second formation sections each have a different rigidity.

Abstract: Provided is a molded article comprising a resin, wherein the resin comprises a methacrylic resin comprising a structural unit derived from a methacrylic acid ester and a structural unit derived from a silica particle having an average primary particle diameter of 1 nm or more and 50 nm or less and comprising at least one polymerizable functional group, and the molded article has an absolute value of degree of orientation in the thickness direction of 0.02 or more and satisfies the requirement (I): (I) When the free induction decay curve (X) obtained by measuring the molded article by a solid echo method at 150° C. using a pulse nuclear magnetic resonance measurement apparatus is approximated by the least square method using the formula (F1), the sum (B+C) of the component fractions of two components having different spin-spin relaxation times in the free induction decay curve (X) is 4% or more.