Abstract: An information processing device includes an analyzing unit configured to analyze text data representing claims included in patent document data to identify constituent components of an invention for each claim included in the claims, and a display control unit configured to cause a display device to display texts indicating each claim in the claims, in a form in which the texts indicating each claim are partitioned into the constituent components.

Abstract: An information processing device includes an analyzing unit configured to analyze text data representing claims included in patent document data to identify constituent components of an invention for each claim included in the claims, and a display control unit configured to cause a display device to display texts indicating each claim in the claims, in a form in which the texts indicating each claim are partitioned into the constituent components.

Abstract: The present invention provides a novel drug or food that can produce desired effects. More specifically, the present invention provides: an intestinal microbe having D-psicose-responsive proliferation; a drug or food containing the intestinal microbe having D-psicose-responsive proliferation; a biological function-improving agent containing the intestinal microbe having D-psicose-responsive proliferation; an intestinal microbe culturing method that includes culturing the intestinal microbe in a D-psicose-containing culture medium; a screening method for a biological function-improving agent using the intestinal microbe having D-psicose-responsive proliferation; and the like.

Abstract: A piezoelectric element unit includes a piezoelectric element group, a fixing plate, and a wiring member. The piezoelectric element group includes an array of piezoelectric elements, each piezoelectric element having an external electrode. A rear portion of the piezoelectric element group is fixed to the fixing plate by polymerization such that a tip end portion of the piezoelectric element group protrudes from a tip end surface of the fixing plate. The wiring member has a wiring terminal that is bonded to the external electrode of each of the piezoelectric elements. In this unit, the piezoelectric element group has a wiring connection surface located opposite to a surface thereof fixed to the fixing plate, the wiring connection surface having a solder-bonding region and a resist application region, the resist application region being located at a rear end side of the solder-bonding region.

Abstract: A method for manufacturing a liquid ejecting head that has: positioning an actuator unit, which has a plurality of driving elements, and a line member, which applies a driving signal to the driving element, with an anisotropic electro-conductive material being sandwiched between the actuator unit and the line member in such a manner that the actuator unit and the line member substantially overlap each other when viewed in plan; and applying pressure to an overlapping area where the actuator unit and the line member substantially overlap each other when viewed in plan with the use of a compression bonding device so as to adhere the actuator unit and the line member to each other as a result of compression.

Abstract: There is provided a liquid ejecting head including an piezoelectric element unit equipped with internal electrodes respectively constituting two poles are alternatively laminated to sandwich a piezoelectric material layer, the piezoelectric element unit having an external connecting portion connected to each of the internal electrodes of each pole on an outer surface of the piezoelectric element unit, and an external circuit board on which a driving IC for driving the piezoelectric element unit is provided and in which a connection wiring which is electrically connected to the piezoelectric element unit is provided. The external connecting portion of the piezoelectric element unit and the connection wiring of the wiring substrate are electrically connected via a connection layer made of an anisotropic conductive material.

Abstract: A piezoelectric element unit includes a piezoelectric element group, a fixing plate, and a wiring member. The piezoelectric element group includes an array of piezoelectric elements, each piezoelectric element having an external electrode. A rear portion of the piezoelectric element group is fixed to the fixing plate by polymerization such that a tip end portion of the piezoelectric element group protrudes from a tip end surface of the fixing plate. The wiring member has a wiring terminal that is bonded to the external electrode of each of the piezoelectric elements. In this unit, the piezoelectric element group has a wiring connection surface located opposite to a surface thereof fixed to the fixing plate, the wiring connection surface having a solder-bonding region and a resist application region, the resist application region being located at a rear end side of the solder-bonding region.