Abstract: A powder containing a resin composition for powder additive manufacturing, wherein the resin composition includes an aromatic polyester-based resin; and a 50% impact brittleness temperature of the resin composition measured by the brittleness temperature test described in JIS K7216 at a holding time of 3 minutes, a temperature ticking interval of 5° C., and a temperature range of ?70° C. to 25° is in a range of ?45° C. or higher and 10° C. or lower.

Abstract: The present invention relates to a filament for three-dimensional printing containing a resin composition. The resin composition contains an aromatic polyester-based resin (A), and the resin composition has a crystal melting temperature (Tm) of 200° C. or more in differential scanning calorimetry and a heat quantity of crystallization (?Hc) of 10 J/g or more and 40 J/g or less in the differential scanning calorimetry.

Abstract: A resin composition with high heat resistance, melt formability, and secondary processability is provided. A resin composition containing: a poly(aryl ether ketone) resin (A); and a poly(ether imide sulfone) resin (B), wherein the poly(aryl ether ketone) resin (A) and the poly(ether imide sulfone) resin (B) are compatibly mixed. The poly(aryl ether ketone) resin (A) is preferably a poly(ether ketone ketone) resin with a repeating unit (a-1) represented by the following formula (1A) and a repeating unit (a-2) represented by the following formula (2A), and the resin composition has one glass transition temperature.

Abstract: A filament for three-dimensional printing of the present invention includes a resin layer (X) containing a polycarbonate resin (A) and a thermoplastic resin (B) other than the polycarbonate resin (A). The resin layer (X) has one loss tangent (tan ?) peak measured by temperature dispersion measurement for dynamic viscoelasticity in JIS K7244-4 at a strain of 0.1%, a frequency of 10 Hz, and a temperature rise rate of 3° C./min in a range of 0 to 200° C., and the peak exists in a range of 100° C. or more and less than 150° C.