Abstract: A laser processing method involving moving first and second laser beams relative to a workpiece, wherein the first and second laser beams have at least a differing wavelength or intensity. The method including irradiating the first and second laser beams through first and second portions, respectively, of an optical element that directs the first and second laser beams onto the workpiece, wherein irradiating the second laser beam is subsequent to the irradiating the first laser beam. The method including moving the first laser beam and the second laser beam relative to the workpiece along another direction. The method including irradiating the first and second laser beams through third and fourth portions, respectively, of the optical element, wherein the third and fourth portions are dependent on the another direction, wherein irradiating the second laser beam is subsequent to the irradiating the first laser beam.

Abstract: A laser processing apparatus which performs a predetermined processing by irradiating a laser beam (2) emitted from a laser oscillator onto a surface of a workpiece (1) through a condenser lens (3). There are provided microdeformation lenses (4), (5) for changing the beam shape in the vertical direction and the horizontal direction in a laser beam (2), for example, and a lens deformation control device for controlling the amount of deformation of the microdeformation lenses (4), (5) which are to adjust the beam shape of the laser beam (2) to a predetermined shape. The microdeformation lenses (4), (5) have a structure such that they can be caused to change to a desired shape by means of a plurality of actuators (4b), (5b) disposed around the outer periphery of the lenses.

Abstract: In a laser machining system, gas is injected while air is inducted from the rear of a plurality of injection nozzles (9c) disposed in the space between the machining head (3) and the workpiece (M) and disposed at stipulated intervals in the direction in which the laser light passes, so as not to disturb the machining gas, thus preventing the adhesion of dust arising during laser machining to optical components (31, 32) within the head (3). A light receptor (4) that receives light reflected or dispersed due to adhered contamination is disposed upstream of the optical components (31, 32) within the head (3), and a determination part (6) compares the light reception value against a preset threshold value.

Abstract: A laser processing apparatus which performs a predetermined processing by irradiating a laser beam (2) emitted from a laser oscillator onto a surface of a workpiece (1) through a condenser lens (3). There are provided microdeformation lenses (4), (5) for changing the beam shape in the vertical direction and the horizontal direction in a laser beam (2), for example, and a lens deformation control device for controlling the amount of deformation of the microdeformation lenses (4), (5) which are to adjust the beam shape of the laser beam (2) to a predetermined shape. The microdeformation lenses (4), (5) have a structure such that they can be caused to change to a desired shape by means of a plurality of actuators (4b), (5b) disposed around the outer periphery of the lenses.

Abstract: The present invention provides a method and an apparatus for efficiently processing in patterning of an electronic circuit board even when laser beams of differing intensities and wavelengths are irradiated in multiple stages. A laser processing apparatus is provided with first and second laser oscillators for emitting laser beams of which at least the wavelength or the intensities are different from each other; a stage apparatus for moving a workpiece to be processed; and optical systems for guiding the laser beams to prescribed positions of the workpiece. The optical systems can be moved by means of an adjusting device according to the relative moving direction of the laser beams and the workpiece to permit the prescribed position of the subject to be irradiated with laser beams in that order so that the workpiece can be processed by the laser beams.

Abstract: In a laser machining system, gas is injected while air is inducted from the rear of a plurality of injection nozzles (9c) disposed in the space between the machining head (3) and the workpiece (M) and disposed at stipulated intervals in the direction in which the laser light passes, so as not to disturb the machining gas, thus preventing the adhesion of dust arising during laser machining to optical components (31, 32) within the head (3). A light receptor (4) that receives light reflected or dispersed due to adhered contamination is disposed upstream of the optical components (31, 32) within the head (3), and a determination part (6) compares the light reception value against a preset threshold value.