Patents by Inventor Naoaki Ogawa

Naoaki Ogawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal Composite Laminate for Producing Flexible Wiring Board and Flexible Wiring Board
    Publication number: 20090317591
    Abstract: A metal composite laminate for producing a flexible wiring board a wiring-forming metal layer for forming a wiring pattern that is laminated on the front surface of a flexible insulating resin layer, a support metal layer that serves as a support is laminated on the back surface of the insulating resin layer. The total thickness (Wt) of the metal composite laminate; the thickness (W0) of the insulating resin layer; the mean surface roughness (Rz-1) of the wiring-forming metal layer facing the front surface of the insulating resin layer; and the mean surface roughness (Rz-2) of the support metal layer facing the back surface of the insulating resin layer are controlled.
    Type: Application
    Filed: September 13, 2007
    Publication date: December 24, 2009
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Tetsuro Sato, Makoto Yamagata, Noriaki Iwata, Toshiaki Ono, Yasuo Komoda, Tatsuo Kataoka, Shuji Chikujo, Naoaki Ogawa