Abstract: The present invention relates to a substrate for a printed circuit exhibiting particularly an excellent electrical insulating property, as well as an excellent heat dissipating property and heat resistance.In accordance with the present invention, a substrate of a printed circuit comprises a metallic plate, and further comprising on at least one surface of said metallic plate, a synthetic resin layer containing an inorganic filler, a heat-resistant resin film, and a synthetic resin layer, which are successively laminated on said metallic plate.A substrate of the present invention also comprises a metallic plate, at least two synthetic resin layers containing an inorganic filler, a heat-resistant resin film which is laminated between said at least two synthetic resin layers.

Abstract: Electrolytic capacitor anodes are made by sintering metal powder for the anodes in a mold cavity into a continuum of anode bodies and by cutting the continuum into individual bodies. Lead wires for the anodes may either be placed in the mold cavity before the sintering step or welded to predetermined ones of the anode bodies after the sintering step and before the cutting step. A metal support may be attached to the lead wires before the cutting step.