Patents by Inventor Naoaki Sakurai

Naoaki Sakurai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040200500
    Abstract: An ultrasonic-wave washing unit comprising an ultrasonic-wave vibrating plate to which an ultrasonic-wave vibrator is fixed by adhesive bonding, an ultrasonic-wave transmission plate opposed to the vibrating plate, a liquid supply means which supplies a liquid to a space defined between the vibrating plate and the transmission plate, and a liquid discharge means for discharging the liquid from the space.
    Type: Application
    Filed: May 22, 2003
    Publication date: October 14, 2004
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Naoaki Sakurai, Hiroshi Fujita
  • Publication number: 20040045580
    Abstract: This invention provides a cleaning method of silicon wafer for obtaining a silicon wafer in which micro roughness thereof under spatial frequency of 20/&mgr;m is 0.3 to 1.5 nm3 in terms of power spectrum density, by passing a process of oxidizing the silicon wafer with ozonized water and a process of cleaning said oxidized silicon wafer with hydrofluoric acid. Consequently, it is possible to remove surface adhering pollutant such as particles and metallic foreign matter with the surface structure of silicon wafer flattened up to atomic level by annealing maintained.
    Type: Application
    Filed: August 22, 2003
    Publication date: March 11, 2004
    Applicant: TOSHIBA CERAMICS CO.,LTD.
    Inventors: Hisatsugu Kurita, Manabu Hirasawa, Hiromi Nagahama, Koji Izumome, Takao Ino, Jyunsei Yamabe, Naoya Hayamizu, Naoaki Sakurai
  • Publication number: 20030199230
    Abstract: There is disclosed a polishing cloth having an abrasive layer containing a polymer material which is a hydrolyzable with an aqueous medium and being capable of exhibiting a stable polishing performance for a relatively long period of time without necessitating a dressing treatment.
    Type: Application
    Filed: April 14, 2003
    Publication date: October 23, 2003
    Applicants: KABUSHIKI KAISHA TOSHIBA, NOF CORPORATION
    Inventors: Hideaki Hirabayashi, Akiko Saito, Naoaki Sakurai, Yoshihiro Oshibe, Masahiro Ishidoya
  • Patent number: 6521574
    Abstract: A copper-based metal polishing solution comprises a water-soluble organic acid capable of reaction with copper to form a copper complex compound which is unlikely to be dissolved in water and has a mechanical strength lower than that of copper. The polishing solution also contains polishing abrasive grains and water. The polishing solution of the particular composition does not dissolve at all copper or a copper alloy when a copper or copper alloy film is immersed in the polishing solution, and permits polishing the copper or copper alloy film at a practical rate in the polishing step.
    Type: Grant
    Filed: April 14, 1999
    Date of Patent: February 18, 2003
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hideaki Hirabayashi, Naoaki Sakurai
  • Publication number: 20020160608
    Abstract: The copper-based metal polishing composition causes Cu or Cu alloy not to be dissolved at all in immersing Cu or Cu alloy therein, and makes it possible to polish Cu or Cu alloy at a high rate in polishing treatment. Such a copper-based metal polishing composition comprises a water-soluble first organic acid capable of reaction with copper to produce a copper complex compound which is substantially insoluble in water and has a mechanical strength lower than that of copper, at least one second organic acid selected from an organic acid having a single carboxyl group and a single hydroxyl group and oxalic acid, an abrasive grain, an oxidizing agent, and water.
    Type: Application
    Filed: April 18, 2002
    Publication date: October 31, 2002
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Hideaki Hirabayashi, Naoaki Sakurai, Toshitsura Cho, Shumpei Shimizu, Katsuhiro Kato, Akiko Saito
  • Patent number: 6444255
    Abstract: An electrode substrate is brush cleaned with a hydrogen gas dissolved water, which has an oxidation-reduction potential of −860 mV to −400 mV and a pH of 8 to 12, before applying an alignment layer material on the electrode substrate. Thus, it is possible to decrease the manufacturing costs without decreasing the detergency.
    Type: Grant
    Filed: February 13, 2001
    Date of Patent: September 3, 2002
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshiyuki Nagahara, Naoya Hayamizu, Naoaki Sakurai, Noriko Okoshi, Toshitaka Nonaka, Hiroaki Furuya
  • Patent number: 6426294
    Abstract: The copper-based metal polishing composition causes Cu or Cu alloy not to be dissolved at all in immersing Cu or Cu alloy therein, and makes it possible to polish Cu or Cu alloy at a high rate in polishing treatment. Such a copper-based metal polishing composition comprises a water-soluble first organic acid capable of reaction with copper to produce a copper complex compound which is substantially insoluble in water and has a mechanical strength lower than that of copper, at least one second organic acid selected from an organic acid having a single carboxyl group and a single hydroxyl group and oxalic acid, an abrasive grain, an oxidizing agent, and water.
    Type: Grant
    Filed: October 1, 1999
    Date of Patent: July 30, 2002
    Assignees: Kabushiki Kaisha Toshiba, Tama Chemicals Co., Ltd.
    Inventors: Hideaki Hirabayashi, Naoaki Sakurai, Toshitsura Cho, Shumpei Shimizu, Katsuhiro Kato, Akiko Saito
  • Publication number: 20010012544
    Abstract: An electrode substrate is brush cleaned with a hydrogen gas dissolved water, which has an oxidation-reduction potential of −860 mV to −400 mV and a pH of 8 to 12, before applying an alignment layer material on the electrode substrate. Thus, it is possible to decrease the manufacturing costs without decreasing the detergency.
    Type: Application
    Filed: February 13, 2001
    Publication date: August 9, 2001
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yoshiyuki Nagahara, Naoya Hayamizu, Naoaki Sakurai, Noriko Okoshi, Toshitaka Nonaka, Hiroaki Furuya
  • Patent number: 6235186
    Abstract: An apparatus for producing electrolytic water in which the yielded electrolytic water does not suffer quality deterioration caused by chemical species, e.g., hydrogen ions, moving to the counter-electrode chamber. A diaphragm 4 of a two-chamber type electrolytic cell comprises two or more ion-exchange membranes 3, and a noble-metal layer 2 or another layer may be formed in the diaphragm. Use of the ion-exchange membranes produces an enhanced physical screening effect, while formation of the noble-metal layer produces catalytic effect to decompose chemical species. Both the ion-exchange membranes and the anode-metal layer are effective in diminishing the movement of chemical species to the counter-electrode chamber.
    Type: Grant
    Filed: May 21, 1999
    Date of Patent: May 22, 2001
    Assignee: Permelec Elctrode Ltd.
    Inventors: Masashi Tanaka, Yoshinori Nishiki, Naoya Hayamizu, Naoaki Sakurai
  • Patent number: 6210748
    Abstract: An electrode substrate is brush cleaned with a hydrogen gas dissolved water, which has an oxidation-reduction potential of −860 mV to −400 mV and a pH of 8 to 12, before applying an alignment layer material on the electrode substrate. Thus, it is possible to decrease the manufacturing costs without decreasing the detergency.
    Type: Grant
    Filed: June 17, 1998
    Date of Patent: April 3, 2001
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshiyuki Nagahara, Naoya Hayamizu, Naoaki Sakurai, Noriko Okoshi, Toshitaka Nonaka, Hiroaki Furuya
  • Patent number: 6192903
    Abstract: The present invention provides a spin-processing apparatus less likely to produce a mist when an object to be processed is rotated. The apparatus is characterized in that it comprises a cup body having a lower cup and an upper cup mounted relative to the lower cup to be up/down movable, a rotation body retaining the object mounted within the cup body, a step motor rotationally driving the rotation body, an exhaust tube connected to a bottom of the lower cup to allow a gas in the cup body to be exhausted, and a scatter-proof cover provided within the upper cup and mounted above the rotation body.
    Type: Grant
    Filed: May 3, 1999
    Date of Patent: February 27, 2001
    Assignees: Shibaura Mechatronics Corporation, Kabushiki Kaisha Toshiba
    Inventors: Tsutomu Doi, Yoshiaki Kurokawa, Naoaki Sakurai
  • Patent number: 6143163
    Abstract: A method of water electrolysis for producing acidic water and alkaline water is disclosed, which is effective in preventing the dissolution of electrode material in the acidic water, etc. attributable to a reverse current flowing in a power supply cutoff state and also in preventing electrode deactivation caused by the electrode material dissolution. This enables the electrolytic cell to be operated stably over a long period of time to yield high-purity acidic and alkaline waters. An electrolytic cell 1 partitioned into an anode chamber and a cathode chamber with a cation-exchange membrane 2 as a solid electrolyte is used to electrolytically produce acidic water and alkaline water. A voltage of 1.2 V or higher and/or a current of 20 mA/dm.sup.2 or higher is applied between the anode 7 and the cathode 8 when the electrolytic cell is in a power supply cutoff state.
    Type: Grant
    Filed: July 14, 1998
    Date of Patent: November 7, 2000
    Assignees: Permelec Electrode Ltd., Kabushiki Kaisha Toshiba
    Inventors: Isao Sawamoto, Kuniaki Yamada, Yoshinori Nishiki, Masashi Tanaka, Naoaki Sakurai, Naoya Hayamizu
  • Patent number: 6082373
    Abstract: Provided is a cleaning method for effectively removing particles on the surface of an object to be cleaned. This cleaning method includes dissolving oxygen into deaerated pure water to prepare a cleaning fluid, and cleaning an object to be cleaned by bringing the object into contact with the cleaning fluid to which ultrasonic vibration is being applied.
    Type: Grant
    Filed: July 2, 1998
    Date of Patent: July 4, 2000
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Naoaki Sakurai, Hisashi Nishigaki, Naoya Hayamizu, Hiroshi Fujita
  • Patent number: 6046110
    Abstract: A copper-based metal polishing solution comprises a water-soluble organic acid capable of reaction with copper to form a copper complex compound which is unlikely to be dissolved in water and has a mechanical strength lower than that of copper. The polishing solution also contains polishing abrasive grains and water. The polishing solution of the particular composition does not dissolve at all copper or a copper alloy when a copper or copper alloy film is immersed in the polishing solution, and permits polishing the copper or copper alloy film at a practical rate in the polishing step.
    Type: Grant
    Filed: June 4, 1996
    Date of Patent: April 4, 2000
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hideaki Hirabayashi, Naoaki Sakurai
  • Patent number: 6007638
    Abstract: A detergent composition for cleaning the surface of a substrate prior to or after application of an organic or inorganic thin film thereon, comprises: (A) a compound selected from the compounds represented by the formula: R.sub.1 --O--(A.sub.1 O).sub.n --R.sub.2 (wherein R.sub.1 represents an alkyl or alkenyl group having 1 to 7 carbon atoms or a phenyl group; A.sub.1 represents an alkylene group having 2 to 4 carbon atoms; R.sub.2 represents an alkyl or alkenyl group having 1 to 6 carbon atoms or a hydrogen atom; and n is a numerical value ranging from 1 to 6); (B) a compound selected from at least one of those represented by the formulas: R.sub.3 --O--(A.sub.2 O).sub.m --H and R.sub.4 --O--(A.sub.3 O).sub.m --H (wherein R.sub.3 represents an alkylphenyl or alkenylphenyl group having 12 to 25 carbon atoms; A.sub.2 represents an alkylene group having 2 to 4 carbon atoms; R.sub.4 represents an alkyl or alkenyl group having 8 to 25 carbon atoms; A.sub.
    Type: Grant
    Filed: February 11, 1997
    Date of Patent: December 28, 1999
    Assignee: Lion Corporation
    Inventors: Akira Shinohara, Hirotoshi Ushiyama, Miwa Sugano, Naoaki Sakurai, Noriko Okoshi, Toshiharu Nakagawa
  • Patent number: 5980703
    Abstract: An electrolytic cell for producing acidic water and alkaline water is disclosed. High-purity acidic water and high-purity alkaline water can be produced in a well balanced proportion from ultrapure water which is supplied in the minimum amount necessary for producing the desired acidic and alkaline waters using the minimum amount of electricity. The electrolytic cell includes an electrolytic acidic-water production unit 3 comprising an anode chamber 6 and an auxiliary cathode chamber 7 separated therefrom by a first ion-exchange membrane 5, and an electrolytic alkaline-water production unit 4 comprising a cathode chamber 10 and an auxiliary anode chamber 9 separated therefrom by a second ion-exchange membrane 8. Separately controllable power supplies are also provided for supplying power to each of the two units. The supply amount of pure water and the amount of electricity used can be fixed according to the desired amounts of acidic and alkaline waters.
    Type: Grant
    Filed: April 2, 1998
    Date of Patent: November 9, 1999
    Assignees: Permelec Electrode Ltd., Kabushiki Kaisha Toshiba
    Inventors: Kuniaki Yamada, Seiichi Anzai, Masashi Tanaka, Takayuki Shimamune, Yoshinori Nishiki, Naoaki Sakurai, Naoya Hayamizu, Hiroshi Fujita