Abstract: A fetal state estimation apparatus estimates a state of a fetus in a maternal body based on a potential signal indicating a change in potential on a surface of the maternal body. The fetal state estimation apparatus is configured to include a rotation angle estimation unit which estimates a rotation angle of the fetus with respect to the maternal body at every beating of a heart of the fetus based on the potential signal and a fetal movement estimation unit which estimates a fetal movement which is a movement of the fetus based on the potential signal and the estimated rotation angle.

Abstract: A fetal state estimation apparatus estimates a state of a fetus in a maternal body based on a potential signal indicating a change in potential on a surface of the maternal body. The fetal state estimation apparatus is configured to include a rotation angle estimation unit which estimates a rotation angle of the fetus with respect to the maternal body at every beating of a heart of the fetus based on the potential signal and a fetal movement estimation unit which estimates a fetal movement which is a movement of the fetus based on the potential signal and the estimated rotation angle.

Abstract: The substrate processing apparatus relating to the present invention comprises a polishing section where wafers are sequentially arranged, and that has multiple polishing platens for polishing a metal film on the wafer surface in stages. The wafers are simultaneously conveyed between the polishing platens by a rotating head mechanism. Further, the wafers polished by the polishing platen for the final stage polishing are sequentially conveyed to a cleaning section and are cleaned. The wafers from the polishing section to the cleaning section are conveyed by a load-unload unit, a post-polishing wafer reversal unit and wet robots. Then, the operation of each part is controlled by an apparatus controller to start the cleaning processing of the polished wafers by the polishing platen for the final stage polishing within a predetermined time period from the completion of polishing by the polishing platen for the final stage polishing.

Abstract: The purpose of the present invention is to stabilize the polishing film thickness during the overpolishing following the removal of barrier metal in Cu-CMP (chemical mechanical polishing). To this end, a table in which the relationship between wire perimeter and overpolishing process polishing rate is created. The polishing time is calculated based on the wire perimeter in determining the overpolishing time after the removal of barrier metal in Cu-CMP to stabilize the overpolishing film thickness.

Abstract: The substrate processing apparatus relating to the present invention comprises a polishing section where wafers are sequentially arranged, and that has multiple polishing platens for polishing a metal film on the wafer surface in stages. The wafers are simultaneously conveyed between the polishing platens by a rotating head mechanism. Further, the wafers polished by the polishing platen for the final stage polishing are sequentially conveyed to a cleaning section and are cleaned. The wafers from the polishing section to the cleaning section are conveyed by a load-unload unit, a post-polishing wafer reversal unit and wet robots. Then, the operation of each part is controlled by an apparatus controller to start the cleaning processing of the polished wafers by the polishing platen for the final stage polishing within a predetermined time period from the completion of polishing by the polishing platen for the final stage polishing.

Abstract: A semiconductor manufacturing apparatus includes: a hot plate that heats an article to be processed; a temperature control section that controls temperature of the hot plate; a main body control section that controls the entirety of the apparatus based on a process recipe; and an elevating mechanism that elevates the article to be processed above the hot plate. The semiconductor manufacturing apparatus further includes: a storage section that stores temperature data of the hot plate; an elevation control section that controls the elevating mechanism and sends elevation timing data to the storage section; a management range calculation section that calculates a management range corresponding to parameter behavior in a transient gradient state based on the temperature data, process recipe data, and the elevation timing data; and an abnormality detection section that detects apparatus abnormality with the use of the management range calculated by the management range calculation section.

Abstract: A semiconductor manufacturing apparatus includes: a hot plate that heats an article to be processed; a temperature control section that controls temperature of the hot plate; a main body control section that controls the entirety of the apparatus based on a process recipe; and an elevating mechanism that elevates the article to be processed above the hot plate. The semiconductor manufacturing apparatus further includes: a storage section that stores temperature data of the hot plate; an elevation control section that controls the elevating mechanism and sends elevation timing data to the storage section; a management range calculation section that calculates a management range corresponding to parameter behavior in a transient gradient state based on the temperature data, process recipe data, and the elevation timing data; and an abnormality detection section that detects apparatus abnormality with the use of the management range calculated by the management range calculation section.

Abstract: An emergency braking system for a vehicle driven by an electric motor. The vehicle includes a manually operable accelerator lever, a displacement detector for detecting displacement of the accelerator lever, an emergency detector disposed in a region of the accelerator lever for detecting an operating force applied to the accelerator lever, a braking device, and a control unit for receiving detection signals from the displacement detector and emergency detector, and outputting control signals to the electric motor and braking device. The control unit outputs the control signal to the braking device to brake the vehicle when the operating force detected by the emergency detector exceeds a predetermined value. In addition or as alternative to the emergency detector, the vehicle may include an emergency detector disposed in a driver's foot rest region for detecting a treading force of the driver.

Abstract: An electric vehicle that runs at a speed controlled by adjusting power supply to an electric motor in response to a speed setting signal from a speed setting device including an accelerator lever and a change speed lever. This vehicle comprises a first control unit for producing a target speed value based on the speed setting signal, a second control unit for controlling the electric motor, and a rotary encoder for detecting an actual vehicle speed from rotation of the electric motor and feeding the vehicle speed back to the first and second control units. The first control unit compares the target speed value and actual vehicle speed and, when a difference therebetween exceeds a predetermined value, varies the target speed value for application to the second control unit. The second control unit compares the target speed value and actual vehicle speed and determines an amount of power supply to the electric motor.