Abstract: Performance of a link apparatus is improved. A link mechanism (11C) included in the link apparatus includes, for example, a roller (110A) fixed to a link shaft (40A) via a bracket (100A), the roller (110A) being contactable with a link retainer (70).

Abstract: A capacitive micromachined ultrasonic transducer 111A includes: a silicon substrate 101; an insulating film 102 formed over the silicon substrate 101; a lower electrode 103; insulating films 104 and 106; a cavity 105 constituted by a void formed in a portion of the insulating film 106; an upper electrode 107; insulating films 108 and 114; and a protective film 109. In addition, the insulating film 106, upper electrode 107, insulating film 108 and insulating film 114 above the cavity 105 configure a vibration film 110, and the protective film 109 above the vibration film 110 is divided into a plurality of isolated patterns regularly arranged with a gap 115 having a constant spacing formed therebetween.

Abstract: The present invention addresses the problem of enlarging a sensing area in an ultrasonic probe so as to achieve a higher definition. This ultrasonic diagnostic equipment is provided with an ultrasonic probe that comprises: a CMUT chip (2a) that has drive electrodes (3e)-(3j), etc., arranged in a grid-like configuration on a rectangular CMUT element section (21); and a CMUT chip (2b) that has drive electrodes (3p)-(3u), etc., arranged in a grid-like configuration on the rectangular CMUT element section (21), that is adjacent to the CMUT chip (2a), and in which the drive electrodes (3e)-(3j) of the adjacent CMUT chip (2a) are electrically connected to the respective drive electrodes (3p)-(3u) via bonding wires (4f)-(4i), etc.

Abstract: A structure that prevents a substrate from being warped is provided on a region or a location other than a membrane that determines the characteristics of a CMUT. In a CMUT in a structure in which a first conductive layer and a second conductive layer are provided sandwiching a cavity on a substrate, for example, as a warpage prevention structure, a warpage prevention layer that prevents the substrate from being warped is provided between the substrate and the first conductive film. When the insulating film disposed between the cavity and the first conductive film and the insulating film disposed between the cavity and the second conductive film are silicon oxide films, the warpage prevention layer includes a silicon nitride film.

Abstract: The present invention addresses the problem of enlarging a sensing area in an ultrasonic probe so as to achieve a higher definition. This ultrasonic diagnostic equipment is provided with an ultrasonic probe that comprises: a CMUT chip (2a) that has drive electrodes (3e)-(3j), etc., arranged in a grid-like configuration on a rectangular CMUT element section (21); and a CMUT chip (2b) that has drive electrodes (3p)-(3u), etc., arranged in a grid-like configuration on the rectangular CMUT element section (21), that is adjacent to the CMUT chip (2a), and in which the drive electrodes (3e)-(3j) of the adjacent CMUT chip (2a) are electrically connected to the respective drive electrodes (3p)-(3u) via bonding wires (4f)-(4i), etc.

Abstract: A generating apparatus according to an embodiment of the present application includes an obtaining unit and a generating unit. The obtaining unit obtains intermediate images in an intermediate layer of a neural network that recognizes the quantity of objects contained in an image. The generating unit generates a combination image by combining together the intermediate images obtained by the obtaining unit. For example, the generating unit generates the combination image by combining together the intermediate images to which a weight has been applied on the basis of a change in the recognition of the quantity of objects corresponding to a process applied to each of the intermediate images.

Abstract: A capacitive micromachined ultrasonic transducer 111A includes: a silicon substrate 101; an insulating film 102 formed over the silicon substrate 101; a lower electrode 103; insulating films 104 and 106; a cavity 105 constituted by a void formed in a portion of the insulating film 106; an upper electrode 107; insulating films 108 and 114; and a protective film 109. In addition, the insulating film 106, upper electrode 107, insulating film 108 and insulating film 114 above the cavity 105 configure a vibration film 110, and the protective film 109 above the vibration film 110 is divided into a plurality of isolated patterns regularly arranged with a gap 115 having a constant spacing formed therebetween.

Abstract: Both controlling damage when assembling an ultrasonic probe using a chip formed with a capacitive ultrasonic transducer and securing operational reliability are achieved. In a semiconductor substrate on which the capacitive ultrasonic transducer (CMUT) is formed on a first primary surface, a protective film is formed on the surface of the ultrasonic transducer which is formed on the first primary surface of the semiconductor substrate which is then thinned by polishing a second primary surface opposite to the first primary surface of the semiconductor substrate, an ultrasonic transducer chip is cutout of the semiconductor substrate, a sound absorbing material is provided on the surface opposite to the surface formed with the ultrasonic transducer, and the protective film formed on the surface of the ultrasonic transducer is removed.

Abstract: A generating apparatus according to an embodiment of the present application includes an obtaining unit and a generating unit. The obtaining unit obtains intermediate images in an intermediate layer of a neural network that recognizes the quantity of objects contained in an image. The generating unit generates a combination image by combining together the intermediate images obtained by the obtaining unit. For example, the generating unit generates the combination image by combining together the intermediate images to which a weight has been applied on the basis of a change in the recognition of the quantity of objects corresponding to a process applied to each of the intermediate images.

Abstract: A structure that prevents a substrate from being warped is provided on a region or a location other than a membrane that determines the characteristics of a CMUT. In a CMUT in a structure in which a first conductive layer and a second conductive layer are provided sandwiching a cavity on a substrate, for example, as a warpage prevention structure, a warpage prevention layer that prevents the substrate from being warped is provided between the substrate and the first conductive film. When the insulating film disposed between the cavity and the first conductive film and the insulating film disposed between the cavity and the second conductive film are silicon oxide films, the warpage prevention layer includes a silicon nitride film.

Abstract: An information processing apparatus according to an embodiment includes an extraction unit, an analysis unit, and a display processing unit. The extraction unit detects switching between scenes in a video content and extracts images of the respective scenes from the video content. The analysis unit analyzes temporal transition of acoustic information contained in the video content. The display processing unit displays a list of the images of the respective scenes extracted by the extraction unit and an image indicating the temporal transition of acoustic information analyzed by the analysis unit on a display unit.

Abstract: Both controlling damage when assembling an ultrasonic probe using a chip formed with a capacitive ultrasonic transducer and securing operational reliability are achieved. In a semiconductor substrate on which the capacitive ultrasonic transducer (CMUT) is formed on a first primary surface, a protective film is formed on the surface of the ultrasonic transducer which is formed on the first primary surface of the semiconductor substrate which is then thinned by polishing a second primary surface opposite to the first primary surface of the semiconductor substrate, an ultrasonic transducer chip is cutout of the semiconductor substrate, a sound absorbing material is provided on the surface opposite to the surface formed with the ultrasonic transducer, and the protective film formed on the surface of the ultrasonic transducer is removed.

Abstract: The present invention provides an imprinting apparatus or an imprint transfer method in which uniformity of curing quality by UV light is maintained and a uniform application thickness of a UV curable resin is achieved, even if glass is contaminated with dust and/or smudges or has a flaw.

Abstract: In a method for transcripting fine patterns and an apparatus for transcripting fine patterns, the ingress of bubbles is prevented and patterns are transcripted with a high throughput by a relatively compact apparatus. For this purpose, a back surface of a stamper is vacuum sucked and the stamper is brought into close contact with a target of transcription with its surfaces coated with resist and pressure is applied thereto. At this time, the stamper is deformed into a spherical shape or bent to expand the close contact face from a central area to a peripheral area to prevent the ingress of air bubbles into between the target of transcription and the stamper.

Abstract: The purpose of the present invention provides a disk transfer unit and inspection apparatus that can transfer a plurality of disks and increase throughput. The present invention includes: a supply/discharge/transfer portion fetching disks from a disk supply portion and discharging inspected disks to a predetermined place; an inspection unit transfer portion transferring the disks within an inspection unit; and a delivery/transfer portion transferring the disks between the disk supply/discharge/transfer portion and the inspection unit transfer portion. The delivery/transfer portion comprises: a base having a rotational center and is formed in an arc-like shape with center at the rotational center and providing with even numbers of disk mounting portions for mounting the disks and a driving portion for moving the base up and down and rotating the base about the rotational center, and transfers the disks between the supply/discharge/transfer portion and the inspection unit transfer portion.

Abstract: A fine-structure transfer apparatus has a base plate, a first post and a second post erected on the upper surface of the base plate, an elongated stamper that is fixed at one end to the upper end face of the first post. The stamper is supported at the other end in a vertically movable manner by means of an ascending/descending unit provided on the second post. A transfer element holding stage is provided on the upper surface of the base plate between the first and second posts in a position that corresponds to the position of the lower surface of the elongated stamper where a fine pattern is formed. A pressure-applying unit is provided to reciprocate on the upper surface of the elongated stamper along a longitudinal direction thereof. The transfer apparatus is characterized by the ease with which the stamper can be detached from the transfer element.

Abstract: A method for removing foreign matters attaching on a surface of a fine pattern of a mold, having the fine pattern being convexo-concave, at least on one surface thereof, thereby cleaning the fine pattern surface of the mold, and an imprinting device applying that method therein, without removing, comprises the following steps of: applying a photo-curable resin on a surface of a body to be transcribed, onto which the mold is suppressed, and thereby forming a photo-curable resin layer; suppressing the mold on the photo-curable resin, which is applied on the surface of the body to be transcribed; separating the photo-curable resin cured from the mold, after curing the photo-curable resin, and whereby taking the foreign matters attaching on the surface of the fine pattern into the photo-curable resin cured to remove them, wherein the photo-curable resin to be formed on the surface of the body to be transcribed is formed with such thickness that it can remove the foreign matters attaching on the fine pattern, and

Abstract: The fine structure transfer apparatus is provided with a pattern transfer mechanism having a resin applying mechanism, a substrate handling mechanism, an aligning mechanism, a pressurizing mechanism, and a peeling mechanism, and the pressurizing mechanism is configured of an upper head section and a lower stage section, the molding die having the fine pattern formed thereon is fixed on the lower surface of the upper head section, and after pressurization and transfer, the lower stage section retracts from a position below the substrate in the state wherein the substrate is adhered to the molding die, then, after the peeling mechanism is moved to a position below the substrate, the substrate adhered to the molding die is peeled.

Abstract: A fine-structure transfer method in which a fine-featured pattern formed on one of the two surfaces of a stamper is pressed against a coating of a resist on one of the two surfaces of a transfer element so as to transfer the fine-featured pattern to the resist coating, wherein the atmosphere in the space between the stamper and the transfer element is replaced by the vapor of the resist before the stamper is pressed against the transfer element.

Abstract: A double-sided imprinting device includes a top-side stamper device supported by a going up and down mechanism, and a bottom-side stamper device and a transferred body detachment device firmly provided on a moving table placed on a guide rail, in which the moving table can be moved back and forth on the guide rail by a movement driving mechanism, with a position of the top-side stamper device as a center, the bottom-side stamper device and the transferred body detachment device can move alternately to a position opposing the top-side stamper device. A bottom-side stamper provided at the bottom-side stamper device has a rectangular shape and a top-side stamper provided at the top-side stamper device has a rectangular shape so that the rectangular-shaped bottom-side stamper and the rectangular-shaped top-side stamper are provided so as to oppose in a cross shape.