Abstract: A method for manufacturing a three-dimensional shaped object includes an nth layer forming step, an n+1th layer forming step, and a curing step. In the nth layer forming step, a cured portion of an nth layer, a first and second portions each of which is an uncured portion of the material are formed. In the n+1th layer forming step, a cured portion of an n+1th layer, and a third portion formed at a region adjacent to the cured portion of the n+1th layer and communicated with the first portion are formed. In the curing step, the second portion is cured prior to the n+1th layer forming step and the first and third portions are cured after the n+1th layer forming step, or the first, second and third portions are cured after the n+1th layer forming step.

Abstract: A method for manufacturing a three-dimensional shaped object includes an nth layer forming step, an n+1th layer forming step, and a curing step. In the nth layer forming step, a cured portion of an nth layer, a first and second portions each of which is an uncured portion of the material are formed. In the n+1th layer forming step, a cured portion of an n+1th layer, and a third portion formed at a region adjacent to the cured portion of the n+1th layer and communicated with the first portion are formed. In the curing step, the second portion is cured prior to the n+1th layer forming step and the first and third portions are cured after the n+1th layer forming step, or the first, second and third portions are cured after the n+1th layer forming step.

Abstract: A top emission organic EL element includes a substrate, an insulating layer including a hole portion, a lower electrode, a light emitting layer, a bank surrounding the lower electrode and the light emitting layer, and an upper transparent electrode. The insulating layer, the lower electrode, the light emitting layer, the bank, and the upper transparent electrode are disposed above the substrate. The bank is arranged on the insulating layer so as to surround the hole portion. The lower electrode is configured to cover an inner side of the hole portion and an area, where the bank is not arranged, of an upper surface of the insulating layer, and a thickness at a center area of the lower electrode is 150 nm or more.

Abstract: An inkjet apparatus includes an inkjet head, a scanning mechanism, a surrounding portion surrounding a predetermined region in which the inkjet head is moved by the scanning mechanism in plan view of the substrate surface and which comprises a height at which a nozzle surface of the inkjet head is disposed in side view of the substrate surface, and a vapor supply portion provided outside the substrate surface and in the region surrounded by the surrounding portion in plan view of the substrate surface. The scanning mechanism is configured to control relative positions of the inkjet head and the substrate surface. The vapor supply portion is configured to supply a vapor of the same material as a component of a solvent contained in the ink to the region surrounded by the surrounding portion.

Abstract: An inkjet apparatus includes an inkjet head, a scanning mechanism, a surrounding portion surrounding a predetermined region in which the inkjet head is moved by the scanning mechanism in plan view of the substrate surface and which comprises a height at which a nozzle surface of the inkjet head is disposed in side view of the substrate surface, and a vapor supply portion provided outside the substrate surface and in the region surrounded by the surrounding portion in plan view of the substrate surface. The scanning mechanism is configured to control relative positions of the inkjet head and the substrate surface. The vapor supply portion is configured to supply a vapor of the same material as a component of a solvent contained in the ink to the region surrounded by the surrounding portion.

Abstract: A top emission organic EL element includes a substrate, an insulating layer including a hole portion, a lower electrode, a light emitting layer, a bank surrounding the lower electrode and the light emitting layer, and an upper transparent electrode. The insulating layer, the lower electrode, the light emitting layer, the bank, and the upper transparent electrode are disposed above the substrate. The bank is arranged on the insulating layer so as to surround the hole portion. The lower electrode is configured to cover an inner side of the hole portion and an area, where the bank is not arranged, of an upper surface of the insulating layer, and a thickness at a center area of the lower electrode is 150 nm or more.

Abstract: A manufacturing method of a top emission organic EL element includes a step of providing an insulating layer on a substrate, a processing step of processing a center area within a region in which the insulating layer is provided, a step of forming a bank on the insulating layer, a lower electrode material applying step, a luminescent material applying step, and an upper transparent electrode forming step. The insulating layer is provided such that a contact angle to a solution to be applied in forming a lower electrode becomes smaller at the center area than the contact angle at a peripheral area within the region.

Abstract: A method for manufacturing a three-dimensional shaped object includes an nth layer forming step, an n+1th layer forming step, and a curing step. In the nth layer forming step, a cured portion of an nth layer, a first and second portions each of which is an uncured portion of the material are formed. In the n+1th layer forming step, a cured portion of an n+1th layer, and a third portion formed at a region adjacent to the cured portion of the n+1th layer and communicated with the first portion are formed. In the curing step, the second portion is cured prior to the n+1th layer forming step and the first and third portions are cured after the n+1th layer forming step, or the first, second and third portions are cured after the n+1th layer forming step.

Abstract: A manufacturing method of a top emission organic EL element includes a step of providing an insulating layer on a substrate, a processing step of processing a center area within a region in which the insulating layer is provided, a step of forming a bank on the insulating layer, a lower electrode material applying step, a luminescent material applying step, and an upper transparent electrode forming step. The insulating layer is provided such that a contact angle to a solution to be applied in forming a lower electrode becomes smaller at the center area than the contact angle at a peripheral area within the region.

Abstract: Providing a manufacturing method of a piezoelectric element which contains at least a substrate, a piezoelectric film and an electrode provided between the substrate and the piezoelectric film. The method includes providing an electrode on a substrate, and baking a piezoelectric film after forming the piezoelectric film on the electrode. The electrode includes a mixture layer having an electroconductive oxide and a metal mixed therein. The concentration of the electroconductive oxide in the substrate side of the mixture layer is higher than that in the piezoelectric film side of the mixture layer, and the concentration of the metal in the piezoelectric film side of the mixture layer is higher than that in the substrate side of the mixture layer.

Abstract: Providing a manufacturing method of a piezoelectric element by which even if an electrode and a piezoelectric film stacked on a substrate are baked at a high temperature, the electrode does not oxidize and mutual diffusion between the substrate, the electrode and the piezoelectric film may be suppressed. The electrode is adapted as a laminated layer body which includes an electroconductive oxide layer, a mixture layer having an electroconductive oxide and electroconductive metal, and an electroconductive metal layer including the electroconductive metal from a substrate side, and the mixture layer above is adapted as a graded composition structure in which a ration of the electroconductive oxide is highest in an interface with the electroconductive oxide layer and lowest in an interface with the electroconductive metal layer.

Abstract: Providing a manufacturing method of a piezoelectric element by which even if an electrode and a piezoelectric film stacked on a substrate are baked at a high temperature, the electrode does not oxidize and mutual diffusion between the substrate, the electrode and the piezoelectric film may be suppressed. The electrode is adapted as a laminated layer body which includes an electroconductive oxide layer, a mixture layer having an electroconductive oxide and electroconductive metal, and an electroconductive metal layer including the electroconductive metal from a substrate side, and the mixture layer above is adapted as a graded composition structure in which a ration of the electroconductive oxide is highest in an interface with the electroconductive oxide layer and lowest in an interface with the electroconductive metal layer.

Abstract: Providing a manufacturing method of a piezoelectric element by which even if an electrode and a piezoelectric film stacked on a substrate are baked at a high temperature, the electrode does not oxidize and mutual diffusion between the substrate, the electrode and the piezoelectric film may be suppressed. The electrode is adapted as a laminated layer body which includes an electroconductive oxide layer, a mixture layer having an electroconductive oxide and electroconductive metal, and an electroconductive metal layer including the electroconductive metal from a substrate side, and the mixture layer above is adapted as a graded composition structure in which a ration of the electroconductive oxide is highest in an interface with the electroconductive oxide layer and lowest in an interface with the electroconductive metal layer.