Abstract: A method of manufacturing a thinned wafer by separating a residual wafer from the thinned wafer, the method including: a weak layer forming step of forming a planar weak layer WL along one surface WFA of a semiconductor wafer WF to divide the semiconductor wafer WF into a thinned wafer WF1 and a residual wafer WF2 with the weak layer WL as a boundary; and a separating step of supporting at least one of a thinned wafer WF1 side and a residual wafer WF2 side of the semiconductor wafer WF and separating the thinned wafer WF1 and the residual wafer WF2 from each other, wherein the separation of the thinned wafer WF1 and the residual wafer WF2 gradually progresses from one end WFF in an outer edge of the semiconductor wafer WF toward the other end WFR in the outer edge of the semiconductor wafer WF.

Abstract: A device includes: a separating unit 10 which forms a weak layer WL in a semiconductor wafer WF supported by a base support unit BS to divide the wafer WF into a thinned wafer WF1 and a residual wafer WF2 with the weak layer WL as a boundary, and separates the wafer WF2 from the wafer WF1; a first transfer unit 20 which transfers the wafer WF1 from which the wafer WF2 is separated by the unit 10; a processing unit 30 which applies predetermined processing to the WF1 transferred by the unit 20; a second transfer unit 40 which transfers the wafer WF1 to which the predetermined processing is applied by the unit 30; and a reinforcing member pasting unit 50 which pastes a reinforcing member AS on the wafer WF1 transferred by the unit 40. The unit 20 and the unit 40 transfer the wafer WF1 with the unit BS.

Abstract: A method for producing a chip (13) in which a die bonding adhesive layer (24) and a wafer (1) are laminated on a close-contact layer (31) of a fixing jig (3), the chip is formed by completely cutting the wafer and the die bonding adhesive layer and then the chip is picked up together with the die bonding adhesive layer from the fixing jig by deforming the close-contact layer of the fixing jig. In the method the fixing jig is provided with the close-contact layer and a jig base (30) that is provided with a plurality of protrusions (36) on one side and a sidewall (35) at the outer circumference section of the one side. The close-contact layer is laminated on the surface of the jig base provided with the protrusions and is bonded on the upper surface of the sidewall. On the surface of the jig base provided with the protrusions, a partitioned space is formed by the close-contact layer, the protrusions, and the sidewall.

Abstract: A process for producing a sheet of a circuit substrate which includes (i) providing a sheet for a circuit substrate which contains a layer of a polymer material of an energy ray hardening type for embedding circuit chips and is used for displays, the layer before being hardened by irradiating an energy ray having a storage modulus of 103 Pa or greater and smaller than 107 Pa at a temperature of embedding the circuit chips, (ii) embedding the circuit chips into the layer, and (iii) hardening the layer by irradiating an energy ray onto the layer to obtain the sheet of a circuit substrate, whereby the circuit chips are embedded, fixed and maintained in the resultant hardened layer, wherein the layer after being hardened by irradiating an energy ray has a storage modulus of 107 Pa or greater at 25° C.

Abstract: The method for producing a circuit substrate of the present invention is characterized in that the circuit substrate is produced using as sheet a circuit substrate sheet including an uncured layer a part of which, the part being other than a part at which a circuit chip is disposed, is selectively curable before or after disposal of said circuit chip, wherein the uncured layer has a softness that enables embedding of the circuit chip in the circuit substrate sheet upon pressing the circuit chip that has been disposed on a surface of the uncured layer. According to the method for producing the circuit substrate of the present invention, the circuit chip can be embedded inwards with high accuracy, and the circuit substrate can be produced easily with high accuracy.

Abstract: An object of the present invention is to provide a treating method for brittle member capable of stably holding the brittle member when applying predetermined treatments such as transportation and grinding back surface of a brittle member such as a semi-conductor wafer and separating the brittle member without breakage after finishing required treatment to thereby attaining high thickness accuracy of the brittle member. A treating method for brittle member comprising: a step of removably fixing a brittle member on a flexible glass base plate, a step of treating said brittle member, a step of fixing said brittle member side by holding means, and a step of separating said flexible glass base plate from said brittle member by bending said flexible glass base plate.

Abstract: A method for producing a chip (13) in which a die bonding adhesive layer (24) and a wafer (1) are laminated on a close-contact layer (31) of a fixing jig (3), the chip is formed by completely cutting the wafer and the die bonding adhesive layer and then the chip is picked up together with the die bonding adhesive layer from the fixing jig by deforming the close-contact layer of the fixing jig. In the method the fixing jig is provided with the close-contact layer and a jig base (30) that is provided with a plurality of protrusions (36) on one side and a sidewall (35) at the outer circumference section of the one side. The close-contact layer is laminated on the surface of the jig base provided with the protrusions and is bonded on the upper surface of the sidewall. On the surface of the jig base provided with the protrusions, a partitioned space is formed by the close-contact layer, the protrusions, and the sidewall.

Abstract: The method for producing a circuit substrate of the present invention is characterized in that the circuit substrate is produced using as sheet a circuit substrate sheet including an uncured layer a part of which, the part being other than a part at which a circuit chip is disposed, is selectively curable before or after disposal of said circuit chip, wherein the uncured layer has a softness that enables embedding of the circuit chip in the circuit substrate sheet upon pressing the circuit chip that has been disposed on a surface of the uncured layer. According to the method for producing the circuit substrate of the present invention, the circuit chip can be embedded inwards with high accuracy, and the circuit substrate can be produced easily with high accuracy.

Abstract: (1) A display substrate for embedding pixel-controlling elements comprising an adhesive layer and a thermoplastic film having a thickness of 50 to 500 ?m which are laminated successively to a base plate successively in this order, wherein a storage modulus (E?) of the adhesive layer is 1.0×106 Pa or greater at 100 to 200° C., and (2) a display substrate for embedding pixel-controlling elements comprising an adhesive layer, a gas barrier layer and a thermoplastic film having a thickness of 50 to 500 pm which are laminated to a base plate successively in this order, wherein a storage modulus (E?) of the adhesive layer is 1.0×104 Pa or greater at 100 to 200° C., and a thickness of the gas barrier layer is 25 nm or greater. A pixel-controlling substrate in which pixel-controlling elements for controlling individual pixels for a display are embedded can be prepared with excellent quality using the display substrate.

Abstract: An object of the present invention is to provide a treating method for brittle member capable of stably holding the brittle member when applying predetermined treatments such as transportation and grinding back surface of a brittle member such as a semi-conductor wafer and separating the brittle member without breakage after finishing required treatment to thereby attaining high thickness accuracy of the brittle member. A treating method for brittle member comprising: a step of removably fixing a brittle member on a flexible glass base plate, a step of treating said brittle member, a step of fixing said brittle member side by holding means, and a step of separating said flexible glass base plate from said brittle member by bending said flexible glass base plate.

Abstract: A sheet for circuit substrates for displays which comprises a polymer material of an energy ray hardening type for embedding circuit chips, wherein a storage modulus of an unhardened layer comprising the polymer material of an energy ray hardening type is 103 Pa or greater and smaller than 107 Pa at a temperature of embedding the circuit chips or at 25° C., and a storage modulus of a hardened layer obtained by hardening the unhardened layer is 107 Pa or greater at 25° C.; and a sheet of circuit substrate for displays obtained by embedding circuit chips into the unhardened layer, followed by hardening the unhardened layer by irradiation with an energy ray. A sheet of a circuit substrate in which circuit chips for controlling pixels of displays and, in particular, flat panel displays are embedded into the sheet can be efficiently produced with excellent quality and productivity using the sheet for circuit substrates.