Abstract: Disclosed is a liquid processing apparatus capable of increasing the number of arranged substrate retainers without increasing the total exhaust amount of the liquid processing apparatus. A N-number (N is an integer identical to or greater than three) of cup bodies are inhaled and exhausted in total exhaust amount E through a plurality of separate exhaustion passage each having a first damper, and through a common exhaustion passage connected in common downstream of the separate exhaustion passages. The first dampers are configured such that an external air is received from the cup body in a first intake amount of external air E1 for one of the cup bodies where a chemical liquid nozzle is placed at a setting location facing a wafer, and an external air is received from each of the other cup bodies in a second intake amount of external air E2 less than the first amount E1 and the intake amount of external air from both each of the other cup bodies and each of branched passages equals (E?E1)/(n?1).

Abstract: In a complex pipe, a plurality of pipe members containing at least a pipe member for liquid and a pipe member for electricity are fixed in parallel arrangement. One end of the complex pipe is connected to a stationary equipment and the other end is connected to a movable member. The plurality of pipe members are integrally combined by a cover member having flexibility. A liquid supply pipe is inserted with a space in the pipe member for liquid. A fluid for temperature adjustment is supplied to the space between the pipe member for liquid and the liquid supply pipe.

Abstract: A liquid treatment apparatus treating a surface of a substrate held generally horizontally on a stage in a housing by supplying a treating liquid to said surface from a supply nozzle. The liquid treatment apparatus includes a cup body provided so as to surround the substrate held in the substrate holding part laterally, the cup body being mounted detachably to a base inside the housing from an upward direction thereof; a cup body holding part holding the cup body detachably; and an elevating mechanism moving the cup body holding part up and down between a first position at which the cup body is mounted upon the base body and a second position located above the first position.

Abstract: Dislocation of processing liquid pouring nozzles is prevented, smooth carrying of the processing liquid pouring nozzles is achieved, and the positional accuracy of the processing liquid pouring nozzles, processing accuracy and yield are improved. A substrate processing apparatus includes a spin chuck (50) for holding and rotating a wafer (W), a plurality of processing liquid pouring nozzles (60) for pouring processing liquids on a surface of the wafer (W), a solvent bath (70) for holding the processing liquid pouring nozzles at their home positions, and a nozzle-carrying arm (80) for detachably gripping desired one of the processing liquid pouring nozzles (60) held on the solvent bath (70) and carrying the desired processing liquid pouring nozzle (60) to a working position above the wafer (W).

Abstract: Dislocation of processing liquid pouring nozzles is prevented, smooth carrying of the processing liquid pouring nozzles is achieved, and the positional accuracy of the processing liquid pouring nozzles, processing accuracy and yield are improved. A substrate processing apparatus includes a spin chuck (50) for holding and rotating a wafer (W), a plurality of processing liquid pouring nozzles (60) for pouring processing liquids on a surface of the wafer (W), a solvent bath (70) for holding the processing liquid pouring nozzles at their home positions, and a nozzle-carrying arm (80) for detachably gripping desired one of the processing liquid pouring nozzles (60) held on the solvent bath (70) and carrying the desired processing liquid pouring nozzle (60) to a working position above the wafer (W).