Patents by Inventor Naofumi Maeda

Naofumi Maeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reflow Sn plated material
    Patent number: 8865319
    Abstract: A reflow Sn plated material, comprising: a substrate consisting of Cu or a Cu base alloy, and a reflow Sn layer formed on the surface of the substrate, wherein an orientation index of a (101) plane on the surface of the reflow Sn layer is from 2.0 or more to 5.0 or less.
    Type: Grant
    Filed: October 26, 2010
    Date of Patent: October 21, 2014
    Assignee: JX Nippon Mining & Metals Corporation
    Inventor: Naofumi Maeda
  • REFLOW SN PLATED MATERIAL
    Publication number: 20120282486
    Abstract: A reflow Sn plated material, comprising: a substrate consisting of Cu or a Cu base alloy, and a reflow Sn layer formed on the surface of the substrate, wherein an orientation index of a (101) plane on the surface of the reflow Sn layer is from 2.0 or more to 5.0 or less.
    Type: Application
    Filed: October 26, 2010
    Publication date: November 8, 2012
    Inventor: Naofumi Maeda