Abstract: Provided is a graphite laminated body having excellent properties such as excellent mechanical properties, excellent heat resistance, and excellent thermal conductivity. In particular, provided is a graphite laminated body comprising a graphite film, a non-thermoplastic polyimide film, and an adhesive layer for bonding the graphite film to the non-thermoplastic polyimide film, the adhesive layer being made of a thermoplastic polyimide or a fluororesin.

Abstract: A polyolefin microporous membrane has a microporous structure with a small pore size and a highly superior air permeability and the like. The polyolefin microporous membrane includes at least a first layer and a second layer, wherein the first layer is composed of a first polyolefin resin containing polyethylene, wherein the second layer is composed of a second polyolefin resin containing polyethylene and polypropylene, and wherein the polyolefin microporous membrane satisfies (I) and (II); and the like. (I) The polyolefin microporous membrane has an air resistance of from 10 to 200 sec/100 ml. (II) The polyolefin microporous membrane has a bubble point pore size of from 5 to 35 nm.

Abstract: Provided is a graphite laminated body having excellent properties such as excellent mechanical properties, excellent heat resistance, and excellent thermal conductivity. In particular, provided is a graphite laminated body comprising a graphite film, a non-thermoplastic polyimide film, and an adhesive layer for bonding the graphite film to the non-thermoplastic polyimide film, the adhesive layer being made of a thermoplastic polyimide or a fluororesin.

Abstract: To obtain a thermal-conductive polyimide film having excellent mechanical characteristics, heat resistance, and the like, and additionally being excellent in thermal conductivity in the planar direction, having anisotropy in thermal conductivity between the planar direction and the thickness direction, and being excellent also in tear strength and moldability. A highly thermal-conductive polyimide film, containing 5 weight % to less than 40 weight % scaly graphite powder relative to the entirety of the polyimide film, having a thermal conductivity in a planar direction of 1.0 W/m·K or higher and a thermal conductivity in a thickness direction of less than 1.0 W/m·K, and having a ratio of the thermal conductivity in the planar direction over the thermal conductivity in the thickness direction of 4.0 or higher.

Abstract: The purpose of the present invention is to provide a polyimide film with excellent passage characteristic, especially in an automatic optical inspection system (AOI), not to mention running characteristic (easy slip characteristic) and adhesion.

Abstract: The purpose of the present invention is to provide a polyimide film with excellent passage characteristic, especially in an automatic optical inspection system (AOI), not to mention running characteristic (easy slip characteristic) and adhesion.

Abstract: To provide a polyimide film, which has excellent size stability and is suitable for a substrate for fine pitch circuits, especially COF (Chip on Film) being wired at a narrow pitch in the width direction of the film, and a copper-clad laminate using the film as a base material.

Abstract: The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4?-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract: The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract: A polyimide film is manufactured from a random copolymeric, block copolymeric or interpenetrating polymer network-type polyamic acid prepared from pyromellitic dianhydride in combination with 22 to 78 mol % of 4,4′-oxydianiline and 22 to 78 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract: A polyimide film is produced by copolymerizing pyromellitic dianhydride in combination with phenylenediamine, methylenedianiline and 3,4′-oxydianiline in a specific molar ratio. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract: A polyimide film is produced by copolymerizing pyromellitic dianhydride in combination with phenylenediamine, methylenedianiline and 3,4′-oxydianiline in a specific molar ratio. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract: A polyimide film is manufactured from a random copolymeric, block copolymeric or interpenetrating polymer network-type polyamic acid prepared from pyromellitic dianhydride in combination with 22 to 78 mol % of 4,4′-oxydianiline and 22 to 78 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract: A photoelectric type displacement detecting instrument comprising: a main optical lattice formed on a first member; an auxiliary optical lattice formed on a second member; a light emitter for emitting detecting light to the both optical lattices in a direction from the outer side of the second member to the first member; a light receiver opposed to the light emitter, interposing therebetween the both optical lattices, for receiving the detecting light transmitted through the both optical lattices, transducing changes in the value of the received light through the repeat of overlappings due to relative movements between the both optical lattices into electric signals; and an electronic circuit for calculating a relative moving distance between the main optical lattice and the auxiliary optical lattice on the basis of the electric signals.