Patents by Inventor Naofumi Yasuda

Naofumi Yasuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12120339
    Abstract: A video encoding apparatus is a video encoding apparatus for subjecting a video image to motion compensated prediction coding, comprising an acquisition module to acquire available blocks of blocks having motion vectors from encoded blocks adjacent to a to-be-encoded block and number of the available blocks, an acquisition/selection module to select one selection block from the encoded available blocks, a selection information encoder to encode selection information specifying the selection block using a code table corresponding to the number of available blocks, and an image encoder to subject the to-be-encoded block to motion compensated prediction coding using a motion vector of the selection block.
    Type: Grant
    Filed: June 27, 2023
    Date of Patent: October 15, 2024
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Saori Asaka, Takeshi Chujoh, Akiyuki Tanizawa, Goki Yasuda, Naofumi Wada, Takashi Watanabe
  • Patent number: 12077207
    Abstract: Provided is an outer tube including a solid-shaped male-shaft portion and a bottomed cylindrical female-tube portion integrally formed with the male shaft portion. A hole cover is externally fitted to the female-tube portion and closes a gap between a dash panel separating the vehicle cabin interior and the vehicle cabin exterior of a vehicle body and the outer tube. In an assembled state in the vehicle body, the solid male-shaft portion is arranged in the vehicle cabin exterior, and an opening portion of a slide hole provided in the female-tube portion is arranged in the vehicle cabin interior.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: September 3, 2024
    Assignee: NSK LTD.
    Inventors: Seiichi Moriyama, Keisuke Nakao, Kaname Yasuda, Naofumi Fujita
  • Publication number: 20240263001
    Abstract: An uncrosslinked fluororubber composition contains a rubber component containing fluororubber as a main component, ionic liquid, and an organic resin filler other than perfluoro resin.
    Type: Application
    Filed: February 28, 2022
    Publication date: August 8, 2024
    Applicant: MITSUBISHI CABLE INDUSTRIES, LTD.
    Inventors: Hiroaki YASUDA, Takehiro HAMAMURA, Tetsuya YAMAMOTO, Naofumi IEZUMI
  • Patent number: 10946617
    Abstract: Provided is a graphite laminated body having excellent properties such as excellent mechanical properties, excellent heat resistance, and excellent thermal conductivity. In particular, provided is a graphite laminated body comprising a graphite film, a non-thermoplastic polyimide film, and an adhesive layer for bonding the graphite film to the non-thermoplastic polyimide film, the adhesive layer being made of a thermoplastic polyimide or a fluororesin.
    Type: Grant
    Filed: October 27, 2014
    Date of Patent: March 16, 2021
    Assignees: DU PONT-TORAY CO., LTD., PANASONIC CORPORATION
    Inventors: Naofumi Yasuda, Noriko Toida, Naomi Nishiki, Kazuhiro Nishikawa
  • Publication number: 20200047473
    Abstract: A polyolefin microporous membrane has a microporous structure with a small pore size and a highly superior air permeability and the like. The polyolefin microporous membrane includes at least a first layer and a second layer, wherein the first layer is composed of a first polyolefin resin containing polyethylene, wherein the second layer is composed of a second polyolefin resin containing polyethylene and polypropylene, and wherein the polyolefin microporous membrane satisfies (I) and (II); and the like. (I) The polyolefin microporous membrane has an air resistance of from 10 to 200 sec/100 ml. (II) The polyolefin microporous membrane has a bubble point pore size of from 5 to 35 nm.
    Type: Application
    Filed: March 13, 2018
    Publication date: February 13, 2020
    Inventors: Yukiko Miura, Naofumi Yasuda, Nobuaki Suzuki
  • Publication number: 20160279902
    Abstract: Provided is a graphite laminated body having excellent properties such as excellent mechanical properties, excellent heat resistance, and excellent thermal conductivity. In particular, provided is a graphite laminated body comprising a graphite film, a non-thermoplastic polyimide film, and an adhesive layer for bonding the graphite film to the non-thermoplastic polyimide film, the adhesive layer being made of a thermoplastic polyimide or a fluororesin.
    Type: Application
    Filed: October 27, 2014
    Publication date: September 29, 2016
    Applicants: DU PONT-TORAY CO., LTD., PANASONIC CORPORATION
    Inventors: Naofumi YASUDA, Noriko TOIDA, Naomi NISHIKI, Kazuhiro NISHIKAWA
  • Publication number: 20130240777
    Abstract: To obtain a thermal-conductive polyimide film having excellent mechanical characteristics, heat resistance, and the like, and additionally being excellent in thermal conductivity in the planar direction, having anisotropy in thermal conductivity between the planar direction and the thickness direction, and being excellent also in tear strength and moldability. A highly thermal-conductive polyimide film, containing 5 weight % to less than 40 weight % scaly graphite powder relative to the entirety of the polyimide film, having a thermal conductivity in a planar direction of 1.0 W/m·K or higher and a thermal conductivity in a thickness direction of less than 1.0 W/m·K, and having a ratio of the thermal conductivity in the planar direction over the thermal conductivity in the thickness direction of 4.0 or higher.
    Type: Application
    Filed: March 7, 2013
    Publication date: September 19, 2013
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: NAOFUMI YASUDA, OSAMU YONENAGA
  • Patent number: 8114500
    Abstract: The purpose of the present invention is to provide a polyimide film with excellent passage characteristic, especially in an automatic optical inspection system (AOI), not to mention running characteristic (easy slip characteristic) and adhesion.
    Type: Grant
    Filed: October 30, 2009
    Date of Patent: February 14, 2012
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Naofumi Yasuda, Hiroki Ishikawa, Hirokazu Yokoyama
  • Publication number: 20100129605
    Abstract: The purpose of the present invention is to provide a polyimide film with excellent passage characteristic, especially in an automatic optical inspection system (AOI), not to mention running characteristic (easy slip characteristic) and adhesion.
    Type: Application
    Filed: October 30, 2009
    Publication date: May 27, 2010
    Applicant: E. I. DU PONT DE NEMOURS AND COMPANY
    Inventors: NAOFUMI YASUDA, Hiroki Ishikawa, Hirokazu Yokoyama
  • Publication number: 20090068403
    Abstract: To provide a polyimide film, which has excellent size stability and is suitable for a substrate for fine pitch circuits, especially COF (Chip on Film) being wired at a narrow pitch in the width direction of the film, and a copper-clad laminate using the film as a base material.
    Type: Application
    Filed: September 12, 2008
    Publication date: March 12, 2009
    Applicant: E.I. du Pont de Nemours and Company
    Inventors: Naofumi Yasuda, Hiroki Ishikawa
  • Patent number: 6908685
    Abstract: The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4?-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
    Type: Grant
    Filed: August 23, 2001
    Date of Patent: June 21, 2005
    Assignees: E. I. du Pont de Nemours and Company, DuPont-Toray Co. Ltd.
    Inventors: Kenji Uhara, Kouichi Sawasaki, Naofumi Yasuda, Brian C. Auman, John D. Summers
  • Publication number: 20040010113
    Abstract: The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
    Type: Application
    Filed: January 28, 2003
    Publication date: January 15, 2004
    Inventors: Kenji Uhara, Kouichi Sawasaki, Naofumi Yasuda, Brian C Auman, John D Summers
  • Patent number: 6555238
    Abstract: A polyimide film is manufactured from a random copolymeric, block copolymeric or interpenetrating polymer network-type polyamic acid prepared from pyromellitic dianhydride in combination with 22 to 78 mol % of 4,4′-oxydianiline and 22 to 78 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
    Type: Grant
    Filed: August 10, 2001
    Date of Patent: April 29, 2003
    Assignee: DuPont-Toray Co. Ltd.
    Inventors: Kenji Uhara, Naofumi Yasuda, Kouichi Sawasaki
  • Patent number: 6548179
    Abstract: A polyimide film is produced by copolymerizing pyromellitic dianhydride in combination with phenylenediamine, methylenedianiline and 3,4′-oxydianiline in a specific molar ratio. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
    Type: Grant
    Filed: August 9, 2001
    Date of Patent: April 15, 2003
    Assignee: DuPont-Toray Co., Ltd.
    Inventors: Kenji Uhara, Naofumi Yasuda, Kouichi Sawasaki
  • Publication number: 20020045033
    Abstract: A polyimide film is produced by copolymerizing pyromellitic dianhydride in combination with phenylenediamine, methylenedianiline and 3,4′-oxydianiline in a specific molar ratio. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
    Type: Application
    Filed: August 9, 2001
    Publication date: April 18, 2002
    Inventors: Kenji Uhara, Naofumi Yasuda, Kouichi Sawasaki
  • Publication number: 20020045054
    Abstract: A polyimide film is manufactured from a random copolymeric, block copolymeric or interpenetrating polymer network-type polyamic acid prepared from pyromellitic dianhydride in combination with 22 to 78 mol % of 4,4′-oxydianiline and 22 to 78 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.
    Type: Application
    Filed: August 10, 2001
    Publication date: April 18, 2002
    Inventors: Kenji Uhara, Naofumi Yasuda, Kouichi Sawasaki
  • Patent number: 4840488
    Abstract: A photoelectric type displacement detecting instrument comprising: a main optical lattice formed on a first member; an auxiliary optical lattice formed on a second member; a light emitter for emitting detecting light to the both optical lattices in a direction from the outer side of the second member to the first member; a light receiver opposed to the light emitter, interposing therebetween the both optical lattices, for receiving the detecting light transmitted through the both optical lattices, transducing changes in the value of the received light through the repeat of overlappings due to relative movements between the both optical lattices into electric signals; and an electronic circuit for calculating a relative moving distance between the main optical lattice and the auxiliary optical lattice on the basis of the electric signals.
    Type: Grant
    Filed: July 24, 1987
    Date of Patent: June 20, 1989
    Assignee: Mitutoyo Mfg. Co., Ltd.
    Inventors: Yoshihiko Kabaya, Naofumi Yasuda, Toshihiro Omi