Abstract: A waveguide unit (2) is closed at one end thereof by a short circuit plane (2a) provided with through holes (3-1 to 3-6). Radio wave absorbers (4-1 to 4-6) absorb a frequency signal being a non-reflective target in the state of being inserted through the through holes (3-1 to 3-6) toward the inside of the waveguide unit (2) and contacting inner surfaces (3?-1 to 3?-6) of the through holes (3-1 to 3-6).

Abstract: A square waveguide (1) has four ridges (6a, 6b, 7a, 7b). The cross section of the square waveguide (1) perpendicular to a waveguide axial direction is square. Inside the square waveguide (1), two rectangular waveguide terminals (4, 5) are formed by partitioning the inside along the waveguide axial direction. A septum phase plate (2) formed to get narrower stepwisely as its gets closer to a square waveguide terminal (3) opposite to the rectangular waveguide terminals (4, 5) is provided. A projecting portion (8) is provided on a part of a ridge (7b) formed on a ridge-side wall surface opposite to a wall surface, the septum phase plate (2) being joined to the wall surface in a part where the septum phase plate has largest width, the projecting portion (8) being larger than other parts of the ridge (7b) in a cross-sectional shape perpendicular to the waveguide axial direction.

Abstract: Lossy members, which are disposed to overlap with a part of branch conductors in a signal conductor, respectively, and cause a loss of the power of signals flowing in the branch conductors, and via holes connecting each of the output terminals of the signal conductor and the ground conductor are included. The branch conductor includes a delay circuit having an electrical length of 90 degrees.

Abstract: A hollow-waveguide-to-planar-waveguide transition circuit includes: strip conductors formed on a first main surface of a dielectric substrate; a ground conductor formed on the back side, facing the strip conductors; a slot formed in the ground conductor; and a coupling conductor formed at a position to be electrically coupled with the strip conductors. The coupling conductor has: a main body portion electrically coupled with the strip conductors; and protruding portions protruding from the main body portion. The protruding portions are formed so as to face an end portion of the slot.

Abstract: According to the present invention, there is provided a power divider/combiner in which two transmission lines configured to connect between respective input/output terminals and an isolation resistor are at least partially adjusted to have suitable impedances during an even-mode operation and an odd-mode operation, for each of the even mode operation and the odd mode operation, to thereby ensure satisfactory reflection characteristics at the respective input/output terminals during the odd-mode operation, a satisfactory reflection characteristic at a common terminal during the even-mode operation, and satisfactory reflection characteristics at the respective input/output terminals during the even-mode operation over a wide band.

Abstract: A coaxial-waveguide-to-hollow-waveguide transition circuit (1) includes a hollow waveguide (10), a coaxial waveguide (20) having an end coupled to a wide wall (16) of the hollow waveguide (10), and a strip conductor (30) located inside the internal path (10h) of the hollow waveguide (10). The coaxial waveguide (20) includes a conducting core wire (22) extending into the internal path (10h) of the hollow waveguide (10). The strip conductor (30) is located so as to make a short-circuit connection between the conducting core wire (22) of the coaxial waveguide (20) and a termination surface (12) of the hollow waveguide (10).

Abstract: [Object] To propose an optical communication connector, an optical communication cable, and an electronic device being novel and improved that have excellent maintenance properties and can prevent parallel light (collimated light) from being directly emitted to the outside of an optical connector during non-optical coupling. [Solution] There is provided an optical communication connector device including: a collimating lens configured to collimate light from an optical transmission path; a refracting section arranged on a leading end side with respect to the collimating lens, and configured to refract and eject light from the optical transmission path ejected from the collimating lens; and a scattering section configured to scatter at least a part of the light ejected from the refracting section.

Abstract: Provided is a structure configured to electrically connect multi-layer dielectric waveguides, each including a dielectric waveguide formed of conductor patterns and vias in a laminating direction of the multi-layer dielectric substrate, in which the vias for forming part of a waveguide wall of each of the dielectric waveguides are arranged in a staggered pattern in the multi-layer dielectric substrate side having choke structures formed so as to electrically connect the waveguides to each other.

Abstract: A semiconductor package includes a package main body. The package main body includes: a lead frame that includes first terminals and a die pad; two or more integrated circuit chips that are disposed on the die pad; one or more electrically conductive members that are disposed on the die pad; wires that connect the first terminals and the integrated circuit chips electrically; and a molded member that seals the lead frame, the integrated circuit chips, the electrically conductive member, and the wires. An upper surface, a bottom surface, and side surfaces of the package main body are formed by the molded member. The electrically conductive member is exposed through the upper surface of the package main body, and the die pad is exposed through the bottom surface of the package main body.

Abstract: Provided is a power divider/combiner capable of improving reflection characteristics and isolation characteristics. The power divider/combiner is formed by a multilayer board, and a strip conductor is arranged in an inner layer of the multilayer board and a chip resistor is arranged on an outer surface of the multilayer board. The power divider/combiner includes vias, which connect the strip conductor and the chip resistor, and includes stubs mounted between input/output terminals and the vias. With this configuration, it is possible to adjust induction mainly during an odd mode of an even/odd mode operation and to consequently improve reflection characteristics of the input/output terminals and isolation characteristics between the input/output terminals.

Abstract: A square waveguide (1) has four ridges (6a, 6b, 7a, 7b). The cross section of the square waveguide (1) perpendicular to a waveguide axial direction is square. Inside the square waveguide (1), two rectangular waveguide terminals (4, 5) are formed by partitioning the inside along the waveguide axial direction. A septum phase plate (2) formed to get narrower stepwisely as its gets closer to a square waveguide terminal (3) opposite to the rectangular waveguide terminals (4, 5) is provided. A projecting portion (8) is provided on a part of a ridge (7b) formed on a ridge-side wall surface opposite to a wall surface, the septum phase plate (2) being joined to the wall surface in a part where the septum phase plate has largest width, the projecting portion (8) being larger than other parts of the ridge (7b) in a cross-sectional shape perpendicular to the waveguide axial direction.

Abstract: A hollow-waveguide-to-planar-waveguide transition circuit includes: a dielectric substrate; strip conductors formed on a first main surface of the dielectric substrate; a ground conductor formed on a second main surface of the dielectric substrate, facing the strip conductors in the thickness direction; a slot formed in the ground conductor; a coupling conductor formed at a position to be electrically coupled with the strip conductors on the first main surface; and branch conductor lines formed on the first main surface. Each of the branch conductor lines includes a base portion branching from the coupling conductor and a tip portion that is electrically open.

Abstract: A coaxial-waveguide-to-hollow-waveguide transition circuit (1) includes a hollow waveguide (10), a coaxial waveguide (20) having an end coupled to a wide wall (16) of the hollow waveguide (10), and a strip conductor (30) located inside the internal path (10h) of the hollow waveguide (10). The coaxial waveguide (20) includes a conducting core wire (22) extending into the internal path (10h) of the hollow waveguide (10). The strip conductor (30) is located so as to make a short-circuit connection between the conducting core wire (22) of the coaxial waveguide (20) and a termination surface (12) of the hollow waveguide (10).

Abstract: An imaging apparatus including a main unit, a grip, and an arm. The main unit includes an imaging device and imaging lens. The grip is configured to be gripped by a user. The arm includes a first attaching portion and a second attaching portion. The grip is attached to the first attaching portion, and the second attaching portion is attached to the main unit of the imaging apparatus. A position of the grip is adjustable, with respect to the main unit, about the second attaching portion. Further, an orientation of the grip is adjustable, with respect to the main unit, about the first attaching portion of the arm.

Abstract: A waveguide unit (2) is closed at one end thereof by a short circuit plane (2a) provided with through holes (3-1 to 3-6). Radio wave absorbers (4-1 to 4-6) absorb a frequency signal being a non-reflective target in the state of being inserted through the through holes (3-1 to 3-6) toward the inside of the waveguide unit (2) and contacting inner surfaces (3?-1 to 3?-6) of the through holes (3-1 to 3-6).

Abstract: A hollow-waveguide-to-planar-waveguide transition circuit includes: strip conductors formed on a first main surface of a dielectric substrate; a ground conductor formed on the back side, facing the strip conductors; a slot formed in the ground conductor; and a coupling conductor formed at a position to be electrically coupled with the strip conductors. The coupling conductor has: a main body portion electrically coupled with the strip conductors; and protruding portions protruding from the main body portion. The protruding portions are formed so as to face an end portion of the slot.

Abstract: Provided is a power divider/combiner capable of improving reflection characteristics and isolation characteristics. The power divider/combiner is formed by a multilayer board, and a strip conductor is arranged in an inner layer of the multilayer board and a chip resistor is arranged on an outer surface of the multilayer board. The power divider/combiner includes vias, which connect the strip conductor and the chip resistor, and includes stubs mounted between input/output terminals and the vias. With this configuration, it is possible to adjust induction mainly during an odd mode of an even/odd mode operation and to consequently improve reflection characteristics of the input/output terminals and isolation characteristics between the input/output terminals.

Abstract: A waveguide circuit (1) includes a first waveguide tube (10), a second waveguide tube (20), and a third waveguide tube (30). The first waveguide tube (10), the second waveguide tube (20), and the third waveguide tube (30) have cross-sectional shapes to allow propagation of TE modes. The tube axis of the second waveguide tube (20) is parallel to the tube axis of the first waveguide tube (10). One of the narrow sidewalls of the second waveguide tube (20) faces a narrow sidewall (10s) of the first waveguide tube (10). The third waveguide tube (30) includes a coupler that connects a hollow guide of the third waveguide tube (30) to a hollow guide of the first waveguide tube (10) and a hollow guide of the second waveguide tube (20).

Abstract: A semiconductor package includes a package main body. The package main body includes: a lead frame that includes first terminals and a die pad; two or more integrated circuit chips that are disposed on the die pad; one or more electrically conductive members that are disposed on the die pad; wires that connect the first terminals and the integrated circuit chips electrically; and a molded member that seals the lead frame, the integrated circuit chips, the electrically conductive member, and the wires. An upper surface, a bottom surface, and side surfaces of the package main body are formed by the molded member. The electrically conductive member is exposed through the upper surface of the package main body, and the die pad is exposed through the bottom surface of the package main body.

Abstract: [Object] To propose an optical communication connector, an optical communication cable, and an electronic device being novel and improved that have excellent maintenance properties and can prevent parallel light (collimated light) from being directly emitted to the outside of an optical connector during non-optical coupling. [Solution] There is provided an optical communication connector device including: a collimating lens configured to collimate light from an optical transmission path; a refracting section arranged on a leading end side with respect to the collimating lens, and configured to refract and eject light from the optical transmission path ejected from the collimating lens; and a scattering section configured to scatter at least a part of the light ejected from the refracting section.