Abstract: A tape carrier used for assemblage of integrated circuit chips based on a TAB system, comprises a plurality of square frames, each including a substantially square opening for defining a position of an integrated circuit chip to be bonded to the frame, the square opening being formed within a mold area of the frame on which, when the integrated circuit chip mounted at the square opening and bonded to the frame is resin-molded, the resin-molded integrated circuit chip extends. At least two substantially rectangular first openings are formed within the mold area at a space between the square opening and an outer periphery of the mold area. A plurality of lead groups, extend from an inside of the square opening to positions adjacent to a periphery of the frame by crossing one of the first openings.

Abstract: A radiator for a semiconductor chip is provided which is made from a material having good heat conductivity. The radiator is plate shaped and is attached to the semiconductor chip. The radiator has at least one projection on the outer peripheral edge thereof so as to extend outwardly, laterally beyond the outer periphery of the semiconductor chip. The semiconductor chip and the radiator are sealed within plastic so that the projection of the radiator extend outwardly from the plastic encapsulation. Heat from the semiconductor chip is released from the plastic encapsulation via the projection(s) of the radiator. The radiator can be formed from a material which also has good electrical conductivity to electrically protect the semiconductor chip.

Abstract: An apparatus for assembly and testing of an IC element having a first section designated for primary functions of the IC element and a second section designated for testing of the IC element, including a substrate made of a film of insulating material and having an IC-mounting portion defining a position of IC element to be assembled a plurality of first leads mounted on the substrate and connected to the first section of the IC element when mounted to the IC-mounting portion, a plurality of second leads connected to the second section of the IC element, a single first test pad for connection of the first leads thereto, second test pads for connection of the respective second leads thereto and circuit for connecting the first leads to at least one of the second leads for testing the IC element through the first and second pads.

Abstract: A lead structure for packaging a semiconductor chip is provided which includes a plurality of electroconductive leads. At least one lead of an adjacent pair of electroconductive leads has at least one projecting portion which projects towards the other lead of the pair so that a tortuous path is defined between the electroconductive leads. The tortuous path minimizes outflow of molten plastic between the electroconductive leads.

Abstract: An apparatus for inspecting the top and bottom surfaces of a tape or sheet has a device to magnify the surface of the tape or sheet, with its objective lens disposed to face the top surface of the tape or sheet. The apparatus also has an optical transmittion system that transmits an image of the bottom surface of the tape or sheet through a focusing unit and four reflectors, each of which is adapted to bend the path of light rays 90 degrees. Of the four reflectors, one that faces the objective lens is retractable from the light-ray path in the optical transmission system. The reflector facing the objective lens may be a half-coated mirror. Fixed in the light-ray path in the optical transmission system, the half-coated mirror is not retractable.

Abstract: An IC chip is packaged on a film carrier. The film carrier comprises an insulation film and many conductive leads formed on the insulation film in predetermined patterns. Each of the leads has an inner lead portion to be connected to a terminal of the IC chip, and an outer lead portion to be connected to a conductive pattern of a mounting board. The film carrier further comprises an embankment, which is made of insulation material and formed on and/or in the vicinity of the outer lead portions of the leads to prevent an ooze of resin when the IC chip is sealed with the resin.