Patents by Inventor Naohiro HANDA

Naohiro HANDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with stacked semiconductor chips
    Patent number: 9177941
    Abstract: A semiconductor chip 109 is mounted on a substrate 100, first wire group 120 and a second wire group 118 having a wire length shorter than the first wire group are provided so as to connect the substrate 100 and the semiconductor chip 109 to each other, and a sealing resin 307 is injected from the first wire group 120 toward the second wire group 118 so as to form a sealer 401 covering the semiconductor chip 109, the first wire group 120, and the second wire group 118.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: November 3, 2015
    Assignee: PS4 Luxco S.a.r.l.
    Inventor: Naohiro Handa
  • SEMICONDUCTOR DEVICE WITH STACKED SEMICONDUCTOR CHIPS
    Publication number: 20140091479
    Abstract: A semiconductor chip 109 is mounted on a substrate 100, first wire group 120 and a second wire group 118 having a wire length shorter than the first wire group are provided so as to connect the substrate 100 and the semiconductor chip 109 to each other, and a sealing resin 307 is injected from the first wire group 120 toward the second wire group 118 so as to form a sealer 401 covering the semiconductor chip 109, the first wire group 120, and the second wire group 118.
    Type: Application
    Filed: December 3, 2013
    Publication date: April 3, 2014
    Applicant: Elpida Memory, Inc.
    Inventor: Naohiro HANDA
  • Semiconductor device with stacked semiconductor chips
    Patent number: 8610288
    Abstract: A semiconductor chip 109 is mounted on a substrate 100, first wire group 120 and a second wire group 118 having a wire length shorter than the first wire group are provided so as to connect the substrate 100 and the semiconductor chip 109 to each other, and a sealing resin 307 is injected from the first wire group 120 toward the second wire group 118 so as to form a sealer 401 covering the semiconductor chip 109, the first wire group 120, and the second wire group 118.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: December 17, 2013
    Assignee: Elpida Memory, Inc.
    Inventor: Naohiro Handa
  • METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
    Publication number: 20110260337
    Abstract: A semiconductor chip 109 is mounted on a substrate 100, first wire group 120 and a second wire group 118 having a wire length shorter than the first wire group are provided so as to connect the substrate 100 and the semiconductor chip 109 to each other, and a sealing resin 307 is injected from the first wire group 120 toward the second wire group 118 so as to form a sealer 401 covering the semiconductor chip 109, the first wire group 120, and the second wire group 118.
    Type: Application
    Filed: October 5, 2010
    Publication date: October 27, 2011
    Applicant: ELPIDA MEMORY, INC
    Inventor: Naohiro HANDA