Patents by Inventor Naohiro Hirai

Naohiro Hirai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7076317
    Abstract: A flagship line 1 includes a job shop environment and a flow shop environment where three different standalone processing apparatuses for different steps constitute the job shop environment and two different serial processing apparatuses constitute the flow shop environment. One of the two serial processing apparatuses as a first serial processing apparatus 8 consists of a die bonder 5, a clean cure unit 6, and a wire bonder 7 and sequentially performs die bonding, clean cure and wire bonding. The other or second serial processing apparatus 13 consists of a marking unit 9, a cutting unit 10, a testing unit 11, and a visual inspection unit 12 and sequentially performs marking, lead cutting, testing, and visual inspection. The three standalone processing apparatuses are a dicing apparatus 2, a molding apparatus 4, and a visual inspection apparatus 3. This not only minimizes the possibility of a stagnant flow of workpieces between steps but also substantially shortens the overall processing time.
    Type: Grant
    Filed: June 14, 2001
    Date of Patent: July 11, 2006
    Assignees: Renesas Technology Corp., Renesas Northern Japan Semiconductor, Inc.
    Inventors: Yuuki Yamate, Shuuetsu Yoshino, Toshimichi Suzuki, Naohiro Hirai
  • Publication number: 20040199281
    Abstract: A flagship line 1 includes a job shop environment and a flow shop environment where three different standalone processing apparatuses for different steps constitute the job shop environment and two different serial processing apparatuses constitute the flow shop environment. One of the two serial processing apparatuses as a first serial processing apparatus 8 consists of a die bonder 5, a clean cure unit 6, and a wire bonder 7 and sequentially performs die bonding, clean cure and wire bonding. The other or second serial processing apparatus 13 consists of a marking unit 9, a cutting unit 10, a testing unit 11, and a visual inspection unit 12 and sequentially performs marking, lead cutting, testing, and visual inspection. The three standalone processing apparatuses are a dicing apparatus 2, a molding apparatus 4, and a visual inspection apparatus 3. This not only minimizes the possibility of a stagnant flow of workpieces between steps but also substantially shortens the overall processing time.
    Type: Application
    Filed: December 11, 2003
    Publication date: October 7, 2004
    Inventors: Yuuki Yamate, Shuuetsu Yoshino, Toshimichi Suzuki, Naohiro Hirai