Patents by Inventor Naohiro Hiruta

Naohiro Hiruta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10424984
    Abstract: A rotating electrical machine includes a plurality of coil conductors, and an insulating tape. The insulating tape is wound around the coil conductors a plurality of times to form an insulating layer. The insulating layer corresponds to at least a part of the coil conductors protruded from the core is provided so that a part of the wound insulating tape is adhered.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: September 24, 2019
    Assignee: Hitachi, Ltd.
    Inventors: Hiroaki Kojima, Kenji Ikeda, Naohiro Hiruta, Daisuke Kamegawa
  • Publication number: 20160301274
    Abstract: Provided is a rotating electrical machine coil in which an ununiform bulge of the rotating electrical machine coil protruded outside from the core is suppressed. A rotating electrical machine coil, provided by receiving the rotating electrical machine coil in a core of a rotating electrical machine and performing impregnation with insulating resin and curing of the insulating resin, includes: a plurality of coil conductors; and an insulating tape wound around the coil conductors a plurality of times to form an insulating layer, in which the insulating layer corresponding to at least a part of the coil conductors protruded from the core is provided so that a part of the wound insulating tape is adhered.
    Type: Application
    Filed: March 18, 2016
    Publication date: October 13, 2016
    Inventors: Hiroaki KOJIMA, Kenji IKEDA, Naohiro HIRUTA, Daisuke KAMEGAWA
  • Patent number: 8669473
    Abstract: A dry mica tape includes a base material, a binder resin layer A formed on the base material and including an epoxy resin and an accelerator, a mica paper layer formed in contact with the binder resin layer A, and a binder resin layer B formed in contact with the mica paper layer, including an epoxy resin, and providing a cured resin with a higher glass transition point than that of a cured resin of an impregnating varnish only by reacting with an impregnating varnish including an epoxy resin impregnated into the dry mica tape wound around a conductor.
    Type: Grant
    Filed: August 9, 2011
    Date of Patent: March 11, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Kenji Ikeda, Hisashi Morooka, Motonobu Iizuka, Yoshihiro Haraguchi, Naohiro Hiruta, Shoichi Maruyama
  • Publication number: 20120038239
    Abstract: A dry mica tape includes a base material, a binder resin layer A formed on the base material and including an epoxy resin and an accelerator, a mica paper layer formed in contact with the binder resin layer A, and a binder resin layer B formed in contact with the mica paper layer, including an epoxy resin, and providing a cured resin with a higher glass transition point than that of a cured resin of an impregnating varnish only by reacting with an impregnating varnish including an epoxy resin impregnated into the dry mica tape wound around a conductor.
    Type: Application
    Filed: August 9, 2011
    Publication date: February 16, 2012
    Inventors: Kenji IKEDA, Hisashi Morooka, Motonobu Ilzuka, Yoshihiro Haraguchi, Naohiro Hiruta, Shoichi Maruyama