Patents by Inventor Naohiro HOZUMI

Naohiro HOZUMI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11580638
    Abstract: This invention provides a signal-processing method that makes it possible to acquire, relatively easily and surely, a highly reliable normalized impulse-response signal without relying on the signal-correction processing after normalization. The signal-processing method of this invention includes a low-frequency extraction step, a high-frequency extraction step and a synthesizing step. In the low-frequency extraction step, only the low-frequency component is extracted from the spectrum of the first normalized signal NS1 obtained by normalizing the target signal Stgt in the time domain. In the high-frequency extraction step, only the high-frequency component is extracted from the spectrum of the second normalized signal NS2 obtained by normalizing the target signal Stgt in the frequency domain using the reference signal Sref.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: February 14, 2023
    Assignees: HONDA ELECTRONICS CO., LTD., NATIONAL UNIVERSITY CORPORATION TOYOHASHI UNIVERSITY OF TECHNOLOGY
    Inventors: Kazuto Kobayashi, Naohiro Hozumi
  • Publication number: 20220163485
    Abstract: An ultrasonic testing device having a packaged semiconductor device as a testing target, the device including: an ultrasonic oscillator disposed to face the semiconductor device; a pulse generator generating a driving signal that is used in the generation of an ultrasonic wave to be output from the ultrasonic oscillator; and an analysis unit analyzing an output signal that is output from the semiconductor device in accordance with the irradiation of the ultrasonic wave from the ultrasonic oscillator, in which the pulse generator sets an optimal frequency of the driving signal such that the absorption of the ultrasonic wave in the semiconductor device is maximized.
    Type: Application
    Filed: January 28, 2020
    Publication date: May 26, 2022
    Applicants: National University Corporation TOYOHASHI UNIVERSITY OF TECHNOLOGY, HAMAMATSU PHOTONICS K.K.
    Inventors: Naohiro HOZUMI, Takuto MATSUI, Toru MATSUMOTO, Shigeru EURA
  • Patent number: 11284863
    Abstract: A surface property measurement technology by which a surface property of a substance can be evaluated with high accuracy, is provided. A surface property measurement method includes radiating an ultrasonic wave to a measurement target and acquiring a reflected signal from the measurement target; calculating, by a measurement apparatus, a maximum value of a cross-correlation function between the reflected signal from the measurement target and a reference reflected signal from a reference substance acquired in advance; calculating a reflection component at an interface, by using the maximum value of the cross-correlation function; and outputting, as a measurement value, one of an acoustic impedance of the measurement target or an acoustic impedance of the reference substance, according to a result of comparing the reflection component with the reference reflected signal.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: March 29, 2022
    Assignees: SHISEIDO COMPANY, LTD., NATIONAL UNIVERSITY CORPORATION TOYOHASHI UNIVERSITY OF TECHNOLOGY, HONDA ELECTRONICS CO., LTD.
    Inventors: Yuki Ogura, Naohiro Hozumi, Sachiko Yoshida, Kazuto Kobayashi, Yusuke Hara
  • Patent number: 11224401
    Abstract: An ultrasonic measurement method includes irradiating an object to be measured with an ultrasonic wave, acquiring a reflection wave from the object, calculating at a processor an acoustic impedance in a depth direction of the object from the reflection wave, and estimating and outputting a thickness of the object based upon an inflection point determined by second-order differentiation of the acoustic impedance.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: January 18, 2022
    Assignees: SHISEIDO COMPANY, LTD., NATIONAL UNIVERSITY CORPORATION TOYOHASHI UNIVERSITY OF TECHNOLOGY, HONDA ELECTRONICS CO., LTD.
    Inventors: Yuki Ogura, Naohiro Hozumi, Sachiko Yoshida, Kazuto Kobayashi, Yusuke Hara
  • Patent number: 11191523
    Abstract: An ultrasonic-image-construction apparatus can construct an ultrasonic-tomographic image of a thin, layer-structured target object to be measured relatively easily and highly accurately in a manner in which such layered structure is easily understood. An ultrasonic transducer of an ultrasonic-image-constructing apparatus transmits ultrasonic waves to the target object. A reference substance makes contact with a base substrate, with such ultrasonic waves being incident on the target object via the base substrate, then receives an impulse response of an ultrasonic waveform. A computing means performs calculation to estimate acoustic-physical-property distribution in consideration of the multiple-reflections influence based on normalized-impulse information obtained from impulse-response information of such ultrasonic waveform incident on the reference substance and from impulse-response information of such ultrasonic waveform incident on the target object.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: December 7, 2021
    Assignees: HONDA ELECTRONICS CO., LTD., NATIONAL UNIVERSITY CORPORATION TOYOHASHI UNIVERSITY OF TECHNOLOGY, SHISEIDO COMPANY, LTD.
    Inventors: Yuki Ogura, Naohiro Hozumi, Sachiko Yoshida, Kazuto Kobayashi
  • Publication number: 20210150709
    Abstract: This invention provides a signal-processing method that makes it possible to acquire, relatively easily and surely, a highly reliable normalized impulse-response signal without relying on the signal-correction processing after normalization. The signal-processing method of this invention includes a low-frequency extraction step, a high-frequency extraction step and a synthesizing step. In the low-frequency extraction step, only the low-frequency component is extracted from the spectrum of the first normalized signal NS1 obtained by normalizing the target signal Stgt in the time domain. In the high-frequency extraction step, only the high-frequency component is extracted from the spectrum of the second normalized signal NS2 obtained by normalizing the target signal Stgt in the frequency domain using the reference signal Sref.
    Type: Application
    Filed: November 13, 2020
    Publication date: May 20, 2021
    Inventors: Kazuto Kobayashi, Naohiro Hozumi
  • Publication number: 20200375573
    Abstract: An ultrasonic-image-construction apparatus can construct an ultrasonic-tomographic image of a thin, layer-structured target object to be measured relatively easily and highly accurately in a manner in which such layered structure is easily understood. An ultrasonic transducer of an ultrasonic-image-constructing apparatus transmits ultrasonic waves to the target object. A reference substance makes contact with a base substrate, with such ultrasonic waves being incident on the target object via the base substrate, then receives an impulse response of an ultrasonic waveform. A computing means performs calculation to estimate acoustic-physical-property distribution in consideration of the multiple-reflections influence based on normalized-impulse information obtained from impulse-response information of such ultrasonic waveform incident on the reference substance and from impulse-response information of such ultrasonic waveform incident on the target object.
    Type: Application
    Filed: May 10, 2017
    Publication date: December 3, 2020
    Inventors: Yuki OGURA, Naohiro HOZUMI, Sachiko YOSHIDA, Kazuto KOBAYASHI
  • Publication number: 20200330069
    Abstract: An ultrasonic measurement method includes irradiating an object to be measured with an ultrasonic wave, acquiring a reflection wave from the object, calculating at a processor an acoustic impedance in a depth direction of the object from the reflection wave, and estimating and outputting a thickness of the object based upon an inflection point determined by second-order differentiation of the acoustic impedance.
    Type: Application
    Filed: April 7, 2020
    Publication date: October 22, 2020
    Inventors: Yuki OGURA, Naohiro HOZUMI, Sachiko YOSHIDA, Kazuto KOBAYASHI, Yusuke HARA
  • Publication number: 20190059857
    Abstract: A surface property measurement technology by which a surface property of a substance can be evaluated with high accuracy, is provided. A surface property measurement method includes radiating an ultrasonic wave to a measurement target and acquiring a reflected signal from the measurement target; calculating, by a measurement apparatus, a maximum value of a cross-correlation function between the reflected signal from the measurement target and a reference reflected signal from a reference substance acquired in advance; calculating a reflection component at an interface, by using the maximum value of the cross-correlation function; and outputting, as a measurement value, one of an acoustic impedance of the measurement target or an acoustic impedance of the reference substance, according to a result of comparing the reflection component with the reference reflected signal.
    Type: Application
    Filed: September 13, 2016
    Publication date: February 28, 2019
    Applicants: SHISEIDO COMPANY, LTD., NATIONAL UNIVERSITY CORPORATION TOYOHASHI UNIVERSITY OF TECHNOLOGY, HONDA ELECTRONICS CO., LTD.
    Inventors: Yuki OGURA, Naohiro HOZUMI, Sachiko YOSHIDA, Kazuto KOBAYASHI, Yusuke HARA