Patents by Inventor Naohiro Igata

Naohiro Igata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Spring copper alloy for electric and electronic parts
    Patent number: 4761265
    Abstract: A spring copper alloy for electric and electronic parts having a high modulus of elasticity, a good electrical conductivity and a good solderability is disclosed, which alloy consists of 1.5.about.3.0% by weight of Ni, 1.2.about.2.0% by weight of Sn, 0.05.about.0.30% by weight of Mn, 0.01.about.0.1% by weight of P, inevitable impurities and the remainder of Cu.
    Type: Grant
    Filed: September 10, 1987
    Date of Patent: August 2, 1988
    Assignees: Nakasato Limited, Naohiro Igata
    Inventors: Naohiro Igata, Yoshio Nakasato
  • Spring material for electric and electronic parts
    Patent number: 4620885
    Abstract: A spring material for electric and electronic parts having a high modulus of elasticity and good electrical conductivity. The material is made by melting Cu, Ni, Ti or mother alloy thereof and Cu--P as deoxidizer at a temperature between a melting point and 1,400.degree. C. to obtain a molten alloy consisting of 0.5.about.2.0% by weight of Ni, 0.1.about.1.0% by weight of Ti, less than 0.2% by weight of P and the remainder being Cu; casting the molten alloy into a metal mold to obtain an ingot; subjecting the ingot to hot (or warm) working, cold working and annealing; and finally rolling the annealed sheet above 50% and annealing it at low temperature with air cooling to obtain a formed product having a stable structure.
    Type: Grant
    Filed: December 27, 1985
    Date of Patent: November 4, 1986
    Assignees: Nakasato Limited, Naohiro Igata
    Inventors: Naohiro Igata, Shinji Sato