Patents by Inventor Naohiro OOGUSHI

Naohiro OOGUSHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 11270929
    Abstract: A semiconductor chip (6) having flexibility is bonded to a heat radiation material (4) with solder. The semiconductor chip (6) is pressed by a tip of a pressing member (9,11) from an upper side. As a result, convex warpage of the semiconductor chip (6) can be suppressed. Furthermore, since voids can be prevented from remaining in the solder (7), the heat radiation of the semiconductor device can be enhanced.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: March 8, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Naohiro Oogushi, Ryoji Murai, Takahiko Murakami
  • SEMICONDUCTOR DEVICE
    Publication number: 20210225743
    Abstract: A semiconductor chip (6) having flexibility is bonded to a heat radiation material (4) with solder. The semiconductor chip (6) is pressed by a tip of a pressing member (9,11) from an upper side. As a result, convex warpage of the semiconductor chip (6) can be suppressed. Furthermore, since voids can be prevented from remaining in the solder (7), the heat radiation of the semiconductor device can be enhanced.
    Type: Application
    Filed: January 5, 2018
    Publication date: July 22, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Naohiro OOGUSHI, Ryoji MURAI, Takahiko MURAKAMI