Patents by Inventor Naohiro Takagi

Naohiro Takagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • IC socket suitable for BGA/LGA hybrid package
    Patent number: 7811096
    Abstract: An IC socket is provided with first and second contact pins and a socket body supporting said first and second contact pins. The first contact pin is used to establish a connection with a first terminal of a semiconductor package, while the second contact pin is used to establish a connection with a second terminal of said semiconductor package. The first and second terminals have different heights from a mount face of the semiconductor package.
    Type: Grant
    Filed: May 11, 2007
    Date of Patent: October 12, 2010
    Assignee: NEC Electronics Corporation
    Inventor: Naohiro Takagi
  • Semiconductor device and method for manufacturing semiconductor device
    Patent number: 7687803
    Abstract: A semiconductor device includes a semiconductor chip and a wiring substrate. The wiring substrate is configured to be electrically connected to the semiconductor chip, and have a plurality of terminals arranged on an surface opposite to a surface on which the semiconductor chip is mounted. The plurality of terminals includes a plurality of first terminals configured to be arranged closely to each other, and a plurality of second terminals configured to be arranged so as to surround the plurality of first terminals. The plurality of second terminals is provided such that terminals of the semiconductor chip are connected to outer terminals through the plurality of second terminals. Each of the plurality of first terminals is not provided with a metal ball, while each of the plurality of second terminals is provided with a metal ball.
    Type: Grant
    Filed: June 8, 2006
    Date of Patent: March 30, 2010
    Assignee: NEC Electronics Corporation
    Inventors: Naohiro Takagi, Yasuhiro Suzuki, Kazuaki Satou
  • IC SOCKET SUITABLE FOR BGA/LGA HYBRID PACKAGE
    Publication number: 20070264846
    Abstract: An IC socket is provided with first and second contact pins and a socket body supporting said first and second contact pins. The first contact pin is used to establish a connection with a first terminal of a semiconductor package, while the second contact pin is used to establish a connection with a second terminal of said semiconductor package. The first and second terminals have different heights from a mount face of the semiconductor package.
    Type: Application
    Filed: May 11, 2007
    Publication date: November 15, 2007
    Applicant: NEC ELECTRONICS CORPORATION
    Inventor: Naohiro Takagi
  • Semiconductor device and method for manufacturing semiconductor device
    Publication number: 20060279315
    Abstract: A semiconductor device includes a semiconductor chip and a wiring substrate. The wiring substrate is configured to be electrically connected to the semiconductor chip, and have a plurality of terminals arranged on an surface opposite to a surface on which the semiconductor chip is mounted. The plurality of terminals includes a plurality of first terminals configured to be arranged closely to each other, and a plurality of second terminals configured to be arranged so as to surround the plurality of first terminals. The plurality of second terminals is provided such that terminals of the semiconductor chip are connected to outer terminals through the plurality of second terminals. Each of the plurality of first terminals is not provided with a metal ball, while each of the plurality of second terminals is provided with a metal ball.
    Type: Application
    Filed: June 8, 2006
    Publication date: December 14, 2006
    Inventors: Naohiro Takagi, Yasuhiro Suzuki, Kazuaki Satou