Abstract: One chip-shaped electronic component 100 of the present invention has a substrate 10, and a termination electrode layer 80 formed on an end face of the substrate 10. The termination electrode layer 80 is made of a mixed material that contains an electrically-conductive substance (a?) (containing carbon (a) as one type of the electrically-conductive substance (a?)), whisker-like particles (b) covered with the electrically-conductive substance (a?), flake-like particles (c) having electroconductivity, and a tetrafunctional hydroxyphenyl type epoxy resin (d) having a molecular weight of 450 or more and less than 800. In addition, a mass ratio of the flake-like particles (c) is 3/7 or more and 9 or less when the whisker-like particles (b) is assumed to be 1.

Abstract: One chip-shaped electronic component 100 of the present invention has a substrate 10, and a termination electrode layer 80 formed on an end face of the substrate 10. The termination electrode layer 80 is made of a mixed material that contains an electrically-conductive substance (a?) (containing carbon (a) as one type of the electrically-conductive substance (a?)), whisker-like particles (b) covered with the electrically-conductive substance (a?), flake-like particles (c) having electroconductivity, and a tetrafunctional hydroxyphenyl type epoxy resin (d) having a molecular weight of 450 or more and less than 800. In addition, a mass ratio of the flake-like particles (c) is 3/7 or more and 9 or less when the whisker-like particles (b) is assumed to be 1.

Abstract: A nip roller includes a core material having a surface coated with rubber. The nip roller having a support length L1 of 5 m or longer. The rubber surface has a hardness H (deg) equal to or lower than 65 deg as measured by a JIS K6253 Type A durometer (A type). Mass W (kg) of the nip roller and second moment of area I1 (m4) and the Young's modulus E1 (Pa) of the core material satisfy E1I1/W?80000.

Abstract: A nip roller includes a core material having a surface coated with rubber. The nip roller having a support length L1 of 5 m or longer. The rubber surface has a hardness H (deg) equal to or lower than 65 deg as measured by a JIS K6253 Type A durometer (A type). Mass W (kg) of the nip roller and second moment of area I1 (m4) and the Young's modulus E1 (Pa) of the core material satisfy E1I1/W?80000.

Abstract: A first coating rod placed on an upper-surface side of a resin film is pressed onto the resin film in a state where the first coating rod is circumscribed and supported by support members each comprising a pair of rollers and spaced with intervals therebetween in a length direction of the first coating rod so that the first coating rod is rotated in a forward direction at a speed substantially equal to that of the resin film, and a lower surface of the resin film is supported by a guide roll or a second coating rod placed on a downstream side of the first coating rod and an upstream side of a tenter so that the coating liquid continuously measured and supplied to an upper surface of the resin film is smoothened by the first coating rod.

Abstract: A chip-shaped electronic component includes a substrate and an end face electrode layer provided on an end face of the substrate, in which the end face electrode layer contains a mixed material. The mixed material includes as a conductive particle, a carbon powder, a whisker-like inorganic filler coated with a conductive film, and a flake-like conductive powder. Additionally, an epoxy resin has a weight-average molecular weight between 1,000 and 80,000.

Abstract: A first coating rod placed on an upper-surface side of a resin film is pressed onto the resin film in a state where the first coating rod is circumscribed and supported by support members each comprising a pair of rollers and spaced with intervals therebetween in a length direction of the first coating rod so that the first coating rod is rotated in a forward direction at a speed substantially equal to that of the resin film, and a lower surface of the resin film is supported by a guide roll or a second coating rod placed on a downstream side of the first coating rod and an upstream side of a tenter so that the coating liquid continuously measured and supplied to an upper surface of the resin film is smoothened by the first coating rod.

Abstract: A chip-shaped electronic component comprising a substrate and an end face electrode layer provided on an end face of the substrate, in which the end face electrode layer contains a mixed material including, as a conductive particle, a carbon powder, a whisker-like inorganic filler coated with a conductive film, and a flake-like conductive powder, and an epoxy resin having a weight-average molecular weight between 1,000 and 80,000.

Abstract: A resistor has a low resistance which precisely falls within a prescribed range regardless of the variation in the contact position of the probes. The resistor comprises a substrate, a pair of upper-surface electrode layers having respectively a notched section, provided on both sides of upper surface of the substrate, a resistor layer provided so that it is connected electrically to said upper-surface electrode layers, a protective layer formed to cover at least the resistor layer and side-face electrode layers provided respectively on side faces of said substrate so that the side-face electrode layers are overlapping on part of upper surface of said upper-surface electrode layers for electrical connection. The above construction reduces the dispersion in measuring the resistance even if contact positions of the probes for the resistance measurement vary.

Abstract: The present invention is to offer a resistor which can be mounted exactly on the terminals disposed on a circuit board regardless the sides of the resistor, and to offer its manufacturing method by forming the surface of the side-electrode layer at a height higher than the surface of protection layer, or by forming the surface of the second surface electrode layer at a height higher than the surface of protection layer. By these, the resistor can be mounted exactly on the terminal of circuit board at a high yield. Furthermore, since the first surface electrode layer and the second upper electrode layer are electrically connected together through a window provided on the protection layer, a higher connection reliability can be obtained.