Patents by Inventor Naohisa Iino

Naohisa Iino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7750417
    Abstract: A non-volatile semiconductor memory includes memory cell transistors arranged in a matrix, wherein each of the memory cell transistors is a depletion mode MIS transistor.
    Type: Grant
    Filed: August 1, 2007
    Date of Patent: July 6, 2010
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Naohisa Iino, Yasuhiko Matsunaga, Fumitaka Arai
  • Patent number: 7508026
    Abstract: A non-volatile semiconductor memory device has a gate insulating film formed on a semiconductor substrate between isolation regions, a first gate electrode formed on the gate insulating film, an intergate insulating film formed on the first gate electrode, and a second gate electrode formed on the intergate insulating film. The first gate electrode has a first part positioned between isolation insulating films, a second part positioned on the first part and having a partial portion positioned on the isolation region, and a third part positioned on the second part. A width of the third part is set narrower than that of the second part.
    Type: Grant
    Filed: November 2, 2005
    Date of Patent: March 24, 2009
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Naohisa Iino, Fumitaka Arai
  • Patent number: 7505312
    Abstract: There is disclosed a semiconductor integrated circuit device including a memory cell array having a plurality of blocks, a first non-volatile semiconductor memory cell which is arranged in the memory cell array and has an electric charge storage layer, and a second non-volatile semiconductor memory cell which is arranged in the memory cell array to be adjacent to the first non-volatile semiconductor memory cell and has an electric charge storage layer. Regular data writing is performed with respect to the second non-volatile semiconductor memory cell after regular data writing is carried out with respect to the first non-volatile semiconductor memory cell. Additional data writing is performed with respect to the first non-volatile semiconductor memory cell after regular data writing is carried out with respect to the second non-volatile semiconductor memory cell.
    Type: Grant
    Filed: June 7, 2006
    Date of Patent: March 17, 2009
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yasuhiko Matsunaga, Fumitaka Arai, Atsuhiro Sato, Makoto Sakuma, Masato Endo, Kiyohito Nishihara, Keiji Shuto, Naohisa Iino
  • Publication number: 20080169497
    Abstract: A non-volatile semiconductor memory includes memory cell transistors arranged in a matrix, wherein each of the memory cell transistors is a depletion mode MIS transistor.
    Type: Application
    Filed: August 1, 2007
    Publication date: July 17, 2008
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Naohisa Iino, Yasuhiko Matsunaga, Fumitaka Arai
  • Patent number: 7292474
    Abstract: A semiconductor integrated circuit device has a memory cell array including a plurality of pages and a page buffer. Each of the plurality of pages includes a user region and a page flag region in which page flag data indicative of a current state of a corresponding page is written. The page buffer includes a user page buffer section which temporarily holds the user data and a page flag page buffer section which temporarily holds the page flag data. The page flag data is recorded in the form of two levels in the non-volatile semiconductor memory cell arranged in the page flag region. The user data is recorded in the form of multilevel in the non-volatile semiconductor memory cell arranged in the user region.
    Type: Grant
    Filed: May 31, 2006
    Date of Patent: November 6, 2007
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Naohisa Iino, Fumitaka Arai
  • Patent number: 7268386
    Abstract: A nonvolatile semiconductor memory including: a plurality of stripe-shaped active regions extending in a bit line direction; device isolation regions having tops arranged at a location higher than the active regions; a plurality of word lines and select gate lines intersecting with the bit line direction; and memory cell transistors arranged at the intersections of the active regions and the word lines via gate insulator films, including floating gate electrodes formed on the device isolation regions and gate insulator films on the active regions, and isolated on the device isolation regions, control gate electrodes arranged on the floating gate electrodes, and inter-gate insulator films arranged between the control gate electrodes and the floating gate electrodes; wherein, the thickness of the floating gate electrodes on the active regions and a maximum thickness of the floating gate electrodes on the device isolation regions are substantially the same, and steps are provided at the edges of the floating gat
    Type: Grant
    Filed: November 8, 2004
    Date of Patent: September 11, 2007
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Naohisa Iino, Atsushi Murakawa
  • Publication number: 20070180219
    Abstract: There is disclosed a semiconductor integrated circuit device comprising a memory cell array including a plurality of pages and a page buffer. Each of the plurality of pages includes a user region and a page flag region in which page flag data indicative of a current state of a corresponding page is written. The page buffer includes a user page buffer section which temporarily holds the user data and a page flag page buffer section which temporarily holds the page flag data. The page flag data is recorded in the form of two levels in the non-volatile semiconductor memory cell arranged in the page flag region. The user data is recorded in the form of multilevel in the non-volatile semiconductor memory cell arranged in the user region.
    Type: Application
    Filed: May 31, 2006
    Publication date: August 2, 2007
    Inventors: Naohisa Iino, Fumitaka Arai
  • Publication number: 20070177431
    Abstract: There is disclosed a semiconductor integrated circuit device including a memory cell array having a plurality of blocks, a first non-volatile semiconductor memory cell which is arranged in the memory cell array and has an electric charge storage layer, and a second non-volatile semiconductor memory cell which is arranged in the memory cell array to be adjacent to the first non-volatile semiconductor memory cell and has an electric charge storage layer. Regular data writing is performed with respect to the second non-volatile semiconductor memory cell after regular data writing is carried out with respect to the first non-volatile semiconductor memory cell. Additional data writing is performed with respect to the first non-volatile semiconductor memory cell after regular data writing is carried out with respect to the second non-volatile semiconductor memory cell.
    Type: Application
    Filed: June 7, 2006
    Publication date: August 2, 2007
    Inventors: Yasuhiko Matsunaga, Fumitaka Arai, Atsuhiro Sato, Makoto Sakuma, Masato Endo, Kiyohito Nishihara, Keiji Shuto, Naohisa Iino
  • Publication number: 20070128815
    Abstract: A nonvolatile semiconductor memory includes a plurality of active regions AA extending along the column direction isolated from each other by element isolating regions; a plurality of word lines/control gate lines extending along the row direction perpendicular to the plurality of active regions; and memory cell transistors each having a SOI semiconductor layer, source/drain regions, a tunneling insulating film provided on the SOI semiconductor layer, a floating gate metallic/polysilicon electrode layer sandwiched between the source/drain regions disposed on the tunneling insulating film on the semiconductor layer, an inter-gate insulating film disposed on the floating gate metallic/polysilicon electrode layer, and a control gate metallic electrode layer disposed on the floating gate metallic/polysilicon electrode layer via the inter-gate insulating film.
    Type: Application
    Filed: November 24, 2006
    Publication date: June 7, 2007
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Naohisa Iino, Fumitaka Arai
  • Publication number: 20060278916
    Abstract: A non-volatile semiconductor memory device has a gate insulating film formed on a semiconductor substrate between isolation regions, a first gate electrode formed on the gate insulating film, an intergate insulating film formed on the first gate electrode, and a second gate electrode formed on the intergate insulating film. The first gate electrode has a first part positioned between isolation insulating films, a second part positioned on the first part and having a partial portion positioned on the isolation region, and a third part positioned on the second part. A width of the third part is set narrower than that of the second part.
    Type: Application
    Filed: November 2, 2005
    Publication date: December 14, 2006
    Inventors: Naohisa Iino, Fumitaka Arai
  • Publication number: 20060049449
    Abstract: A non-volatile semiconductor memory includes memory cell transistors arranged in a matrix, wherein each of the memory cell transistors is a depletion mode MIS transistor.
    Type: Application
    Filed: April 12, 2005
    Publication date: March 9, 2006
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Naohisa Iino, Yasuhiko Matsunaga, Fumitaka Arai
  • Publication number: 20050224862
    Abstract: A nonvolatile semiconductor memory including: a plurality of stripe-shaped active regions extending in a bit line direction; device isolation regions having tops arranged at a location higher than the active regions; a plurality of word lines and select gate lines intersecting with the bit line direction; and memory cell transistors arranged at the intersections of the active regions and the word lines via gate insulator films, including floating gate electrodes formed on the device isolation regions and gate insulator films on the active regions, and isolated on the device isolation regions, control gate electrodes arranged on the floating gate electrodes, and inter-gate insulator films arranged between the control gate electrodes and the floating gate electrodes; wherein, the thickness of the floating gate electrodes on the active regions and a maximum thickness of the floating gate electrodes on the device isolation regions are substantially the same, and steps are provided at the edges of the floating gat
    Type: Application
    Filed: November 8, 2004
    Publication date: October 13, 2005
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Naohisa Iino, Atsushi Murakawa