Abstract: In order to realize a pattern forming method for more precisely controlling a reacting area of photosensitive resin during formation of a fine pattern on a substrate and also for simplifying thickness management of the photosensitive resin a fine pattern can be formed through reaction of the photosensitive resin layer by particularly condensing an ultra-short pulse laser to a location where the focal point of the laser is at the interface between the substrate and the photosensitive resin. In this case, the ultra-short pulse laser is radiated through the substrate.

Abstract: In a laser forming apparatus, a first optical system and a second optical system are provided symmetrically with respect to a vertical plane to a center line of a head suspension targeted for spring pressure adjustment. A half mirror branches laser light emitted from one laser oscillator into two to guide the branched light beams to the two optical systems. The head suspension is structured such that optical spots formed by the first and second optical systems condensing laser light are positioned at the same distance from the center line of the head suspension. Condenser lenses of the first and second optical systems are arranged on right and left sides in a plane-symmetrical form to scan the optical sports to thereby adjust a spring pressure of a head suspension.

Abstract: A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.

Abstract: A spring member manufacturing device that manufactures the spring member by laser irradiation includes a laser irradiation unit including a plurality of laser irradiation devices that perform predetermined laser irradiation with respect to the spring member. In the spring member manufacturing device, the laser irradiation devices are configured so that laser irradiated conditions different from each other are preset for the respective laser irradiation devices, and are arranged so that the respective irradiated positions do not overlap each other. The laser irradiation apparatus is constituted by combining laser irradiation devices having laser irradiation conditions being 2 to the (n?1)th power, n being a positive integer,of predetermined minimum adjustment amount for adjusting load on the spring member. The combination of the laser irradiation devices are selected in accordance with load adjusting amount required for the spring member.

Abstract: A scanning mechanism that scans a scanning object with a light beam has light-collecting means for collecting the light beam that is emitted by a light source; driving means for driving the light-collecting means in a direction orthogonal to an optical axis of the light-collecting means; first reflecting means provided near a first side of the scanning object, for reflecting the light beam collected by the light-collecting means to allow the light beam to be incident on the scanning object; and second reflecting means provided near a second side of the scanning object that is opposite to the first side of the scanning object, for reflecting the light beam collected by the light-collecting means to allow the light beam to be incident on the scanning object.

Abstract: A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.

Abstract: A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate to cut the laminate into elements.

Abstract: A method of fabricating an element having a microstructure such as an MEMS device uses a material whose state changes with a temperature change. A sheet-like member having a microstructure on its surface is fixed to a vacuum chuck by an adhesive sheet and the material whose state changes with a temperature change is applied to the surface of the sheet-like member the material is then cooled to solidify it on the surface of the sheet-like member and the sheet-like member is cut 10 into a plurality of elements, while the material is in the solidified state, and the separated elements are then removed from the adhesive sheet.

Abstract: According to an aspect of an embodiment, a method for manufacturing a structure composed of a photoreactive resin comprises the steps of: forming the photoreactive resin on a sheet member soluble in water; exposing the photoreactive resin selectively to a radiation activating the photoreactivity to produce the structure; and dissolving the sheet member in water after the exposing step.

Abstract: A scanning mechanism that scans a scanning object with a light beam has light-collecting means for collecting the light beam that is emitted by a light source; driving means for driving the light-collecting means in a direction orthogonal to an optical axis of the light-collecting means; first reflecting means provided near a first aide of the scanning object, for reflecting the light beam collected by the light-collecting means to allow the light beam to be incident on the scanning object; and second reflecting means provided near a second side of the scanning object that is opposite to the first side of the scanning object, for reflecting the light beam collected by the light-collecting means to allow the light beats to be incident on the scanning object.

Abstract: An imaging device including a base on which an imaging element is provided, a cylindrically shaped plastic lens member holding a condensing lens at the inside, and a plastic barrel member in which the lens member can move in the axial direction and provided above the imaging element, wherein the barrel member and the lens member are affixed by laser welding, a method of production of the same, and an imaging device holding mechanism used for that production.

Abstract: Light is irradiated to a light curing resin material within a mold. The light penetrates through the light curing resin material at a position off a mask. The light curing resin material gets cured at the position off the mask. The mold in this manner serves to form the contour of a molded product. On the other hand, the mask partly blocks the light. An uncured section is established in the light curing resin material behind the mask. When the light curing resin material is removed from the uncured section, the uncured section provides a hole, for example. If the mask is finely formed, it is possible to form a fine hole in an easier manner in a shorter time. It is possible to realize the mass production of a molded product having a fine hole.

Abstract: A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.

Abstract: A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.

Abstract: The invention relates to a laser processing device that can change the diameter of a beam spot on an object to be processed, without using a mechanism for changing a distance between a condensing lens and the object. A beam emitted from a laser beam source is condensed by the condensing lens, and is made incident to an optical fiber. The beam emitted from the optical fiber is condensed by a condensing optical system onto an object to be processed. The object is welded using the condensed beam. The laser processing device comprises an adjusting unit that can change the angle of divergence of the beam on the emission surface of the optical fiber. The adjusting unit changes the angle of divergence of the beam, thereby to change the diameter of the beam spot formed on the surface of the object.

Abstract: A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.

Abstract: A method of fabricating an element having a microstructure such as an MEMS device uses a material whose state changes with a temperature change. A sheet-like member having a microstructure on its surface is fixed to a vacuum chuck by an adhesive sheet and the material whose state changes with a temperature change is applied to the surface of the sheet-like member the material is then cooled to solidify it on the surface of the sheet-like member and the sheet-like member is cut 10 into a plurality of elements, while the material is in the solidified state, and the separated elements are then removed from the adhesive sheet.

Abstract: A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.

Abstract: A laser beam machine and a laser beam machine capable of monitoring the effective energy of a laser beam oscillator, with which an object to be machined is irradiated, and the state of oscillation without affecting the properties of a laser beam, is disclosed. A laser beam machine comprises: a laser beam oscillator; a laser beam transmission path; a collimator lens; a machining condenser lens; at least one optical detection sensor provided along the laser beam transmission path; and an arithmetic control section for receiving the output of the optical detection sensor and performing a predetermined process to obtain the characteristic of a laser beam.

Abstract: An imaging device including a base on which an imaging element is provided, a cylindrically shaped plastic lens member holding a condensing lens at the inside, and a plastic barrel member in which the lens member can move in the axial direction and provided above the imaging element, wherein the barrel member and the lens member are affixed by laser welding, a method of production of the same, and an imaging device holding mechanism used for that production.