Abstract: A temperature-compensated oscillator includes a resonator element, an oscillating circuit, and a temperature compensation circuit, and a frequency deviation with respect to a frequency at a time point when power supply starts is within a range of ±8 ppb at a time point when 10 seconds elapse from when the power supply starts, within a range of ±10 ppb at a time point when 20 seconds elapse from when the power supply starts, and within a range of ±10 ppb at a time point when 30 seconds elapse from when the power supply starts.

Abstract: A temperature-compensated oscillator includes a resonator element, an oscillating circuit, and a temperature compensation circuit, and in a case of varying temperature in a temperature range of ±5° C. centered on a reference temperature in intervals of 6 minutes, and assuming observation period as ?, a wander performance fulfills a condition that an MTIE value is equal to or shorter than 6 ns in a range of 0 s<??0.1 s, the MTIE value is equal to or shorter than 27 ns in a range of 0.1 s<??1 s, the MTIE value is equal to or shorter than 250 ns in a range of 1 s<??10 s, the MTIE value is equal to or shorter than 100 ns in a range of 10 s<??1700 s, and the MTIE value is equal to or shorter than 6332 ns in a range of 100 s<??1000 s.

Abstract: In a crystal resonator, a resonator element is installed in a package via a first bonding member and a second bonding member, and when viewed from above, a distance between a first bonding center and a second bonding center is set to be L1, and a length of a perpendicular line drawn to a virtual line which connects the first bonding center and the second bonding center from the resonation area center is set to be L2, a relationship expressed by 0<L1/L2?0.97 is satisfied.

Abstract: A resonator device includes a substrate, a resonator element including a base member having first and second surface, and a pair of excitation electrodes, and first and second bonding member. Defining center of the first and second bonding member as a first and second bonding center, a center of a resonating region as a resonating region center, and defining a distance between the first bonding center and the second bonding center as L1, a length of a perpendicular drawn from the resonating region center to an imaginary line connecting the first bonding center and the second bonding center to each other as L2, a linear expansion coefficient of the first metal layer, the second metal layer, and the base member as ?1, ?2, ?3 respectively, and a length of the resonator element as L3, 0<L1/L2?0.97, |(?2??1)/?1|?0.35, |(?3??1)/?1|?0.35, and L3?1.5 mm are satisfied.

Abstract: A resonator element has a piezoelectric substrate including a vibration section and a thick section having a thickness which is thicker than that of the vibration section, and a pair of excitation electrodes provided on a surface and a back surface of the vibration section. In addition, the thick section has a second thick section provided along a second outer edge of the vibration section. The second thick section has an outer edge section intersecting with both axes of an X axis and a Z? axis in an end portion opposite to the fixing section in a plan view of the resonator element.

Abstract: An oscillator includes a resonator element; an oscillation circuit which outputs an oscillation signal by oscillating the resonator element; and a temperature compensation circuit as a frequency control circuit which controls an oscillation frequency of the oscillation signal, wherein, if a resonance frequency of the resonator element is referred to as Fr (MHz) and an equivalent series capacitance is referred to as C1 (fF), a relationship of C1?0.00279×Fr2?0.05684×Fr+2.69481 is satisfied.

Abstract: In a crystal resonator, a resonator element is installed in a package via a first bonding member and a second bonding member, and when viewed from above, a distance between a first bonding center and a second bonding center is set to be L1, and a length of a perpendicular line drawn to a virtual line which connects the first bonding center and the second bonding center from the resonation area center is set to be L2, a relationship expressed by 0<L1/L2?0.97 is satisfied.

Abstract: A vibration element includes a piezoelectric substrate including a vibrating section and a thick section having a thickness larger than that of the vibrating section. The thick section includes a first thick section provided along a first outer edge of the vibrating section, a second thick section provided along a second outer edge thereof, and a third thick section provided along a third outer edge thereof. When a maximum size of the second thick section in the vibration direction is Lmax and a minimum size thereof is Lmin, an average size expressed by (Lmax+Lmin)/2 is 100 ?m or smaller.

Abstract: A SAW device includes a SAW chip formed of a piezoelectric substrate and an IDT formed thereon, a base substrate that supports the SAW chip, and a fixing member that fixes the SAW chip to the base substrate. The SAW chip that forms a cantilever is supported by the base substrate via the fixing member in a position where the IDT does not overlap with the fixing member in a plan view of the SAW chip. The length W of the SAW chip in a y-axis direction and the length D of the fixing member in the y-axis direction satisfy 1<D/W?1.6. The fixing member bonds the lower surface and side surfaces of the fixed end of the SAW chip to the base substrate.

Abstract: A vibration element includes a substrate having first and second principal surfaces, a first excitation electrode on the first principal surface, a second excitation electrode on the second principal surface, and a first extraction electrode on the first principal surface, and connected to the first excitation electrode. The first extraction electrode includes a first electrode section, and a second electrode section extending from the first electrode section in a first direction and connected to the first excitation electrode. The second electrode section is narrower in a second direction than the first electrode section. When an area of the first excitation electrode is S1, and an area of an overlapping part where the second electrode section overlaps the second excitation electrode is S2, (S2/S1)?0.1.

Abstract: A resonator element includes a piezoelectric substrate including a vibrating section and a thick section having a thickness larger than that of the vibrating section. The thick section includes a first thick section provided along a first outer edge of the vibrating section, a second thick section provided along a second outer edge, and a third thick section provided along a third outer edge. A first inclined outer edge section that is inclined with respect to both of an X axis direction and a Z? axis direction is provided in a corner section of the piezoelectric substrate where the second thick section and the third thick section are connected to each other.

Abstract: A vibration element includes a piezoelectric substrate including a vibrating section and a thick section having a thickness larger than that of the vibrating section. The thick section includes a first thick section provided along a first outer edge of the vibrating section, a second thick section provided along a second outer edge, and a third thick section provided along another first outer edge. An inclined outer edge section that intersects with each of an X axis and a Z? axis is provided in a tip section of the piezoelectric substrate.

Abstract: A resonator element includes a piezoelectric substrate that includes a vibration portion, and a thick portion which is integrally formed with an outer edge excluding a partial outer edge in an outer edge of the vibration portion and which is thicker than the vibration portion, and a pair of excitation electrodes that are respectively provided on a first main surface and a second main surface of a vibration region which are in front and rear relationships. In addition, the piezoelectric substrate includes first and second beam portions that are provided along a fourth side of the vibration portion.

Abstract: A SAW device includes an IDT which is provided on the principal surface of a quartz crystal substrate having Euler angles (?1.5°???1.5°, 117°???142°, |?|?90°×n (where n=0, 1, 2, 3)) and excites a Rayleigh wave (wavelength: ?) in a stopband upper end mode. Inter-electrode-finger grooves are recessed between electrode fingers of the IDT. An IDT line occupancy ? and an inter-electrode-finger groove depth G satisfy a predetermined relationship in terms of the wavelength ?, such that the SAW device has a frequency-temperature characteristic of a cubic curve having an inflection point between a maximum value and a minimum value in an operation temperature range. The inflection point is adjustable to a desired temperature or a desired temperature range depending on the IDT line occupancy ? within an operation temperature range.

Abstract: A vibration element includes a piezoelectric substrate including a vibrating section and a thick section having a thickness larger than that of the vibrating section. The thick section includes a first thick section provided along a first outer edge of the vibrating section, a second thick section provided along a second outer edge, and a third thick section provided along another first outer edge. An inclined outer edge section that intersects with each of an X axis and a Z? axis is provided in a tip section of the piezoelectric substrate.

Abstract: A vibration element includes a piezoelectric substrate including a vibrating section and a thick section having a thickness larger than that of the vibrating section. The thick section includes a first thick section provided along a first outer edge of the vibrating section, a second thick section provided along a second outer edge thereof, and a third thick section provided along a third outer edge thereof. When a maximum size of the second thick section in the vibration direction is Lmax and a minimum size thereof is Lmin, an average size expressed by (Lmax+Lmin)/2 is 100 ?m or smaller.

Abstract: A vibration element includes a piezoelectric substrate including a vibrating section and a thick section having a thickness larger than that of the vibrating section. The thick section includes a first thick section provided along a first outer edge of the vibrating section, a second thick section provided along a second outer edge, and a third thick section provided along another first outer edge. An inclined outer edge section that intersects with each of an X axis and a Z? axis is provided in a tip section of the piezoelectric substrate.

Abstract: A resonator element includes a piezoelectric substrate including a vibrating section and a thick section having a thickness larger than that of the vibrating section. The thick section includes a first thick section provided along a first outer edge of the vibrating section, a second thick section provided along a second outer edge, and a third thick section provided along a third outer edge. A first inclined outer edge section that is inclined with respect to both of an X axis direction and a Z? axis direction is provided in a corner section of the piezoelectric substrate where the second thick section and the third thick section are connected to each other.

Abstract: A SAW device includes an IDT which is provided on the principal surface of a quartz crystal substrate having Euler angles (?1.5°???1.5°, 117°???142°, |?|90°×n (where n=0, 1, 2, 3)) and excites a Rayleigh wave (wavelength: ?) in a stopband upper end mode. Inter-electrode-finger grooves are recessed between electrode fingers of the IDT. An IDT line occupancy ? and an inter-electrode-finger groove depth G satisfy a predetermined relationship in terms of the wavelength ?, such that the SAW device has a frequency-temperature characteristic of a cubic curve having an inflection point between a maximum value and a minimum value in an operation temperature range. The inflection point is adjustable to a desired temperature or a desired temperature range depending on the IDT line occupancy ? within an operation temperature range.

Abstract: A SAW device includes a SAW chip formed of a piezoelectric substrate and an IDT formed thereon, a base substrate that supports the SAW chip, and a fixing member that fixes the SAW chip to the base substrate. The SAW chip that forms a cantilever is supported by the base substrate via the fixing member in a position where the IDT does not overlap with the fixing member in a plan view of the SAW chip. The length W of the SAW chip in a y-axis direction and the length D of the fixing member in the y-axis direction satisfy 1<D/W?1.6. The fixing member bonds the lower surface and side surfaces of the fixed end of the SAW chip to the base substrate.