Patents by Inventor Naoji Akutsu

Naoji Akutsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6775491
    Abstract: A fixing unit fixes a developing material deposited on a recording medium by heating and pressing the recording medium. The fixing unit includes two heating members that apply heat to the recording medium and two temperature-sensitive shutoff devices. The two temperature-sensitive shutoff devices are connected in series with a corresponding one of the heating members. Each of the temperature-sensitive shut-off devices includes a first heat-sensitive shut-off element and a second heat-sensitive shut-off element. The first heat-sensitive shut-off element shuts off electric power to the corresponding one of the two heating members when a temperature of a surface of the corresponding one of the two heating members exceeds a certain value. The second heat-sensitive shut-off element shuts off electric power to the corresponding one of the two heating members when a temperature of a surface of the second one of the two heating members exceeds a certain value.
    Type: Grant
    Filed: May 30, 2003
    Date of Patent: August 10, 2004
    Assignee: Oki Data Corporation
    Inventors: Naoji Akutsu, Akinori Kumonaka
  • Publication number: 20030206745
    Abstract: A fixing unit fixes a developing material deposited on a recording medium by heating and pressing the recording medium. The fixing unit includes two heating members that apply heat to the recording medium and two temperature-sensitive shutoff devices. The two temperature-sensitive shutoff devices are connected in series with a corresponding one of the heating members. Each of the temperature-sensitive shut-off devices includes a first heat-sensitive shut-off element and a second heat-sensitive shut-off element. The first heat-sensitive shut-off element shuts off electric power to the corresponding one of the two heating members when a temperature of a surface of the corresponding one of the two heating members exceeds a certain value. The second heat-sensitive shut-off element shuts off electric power to the corresponding one of the two heating members when a temperature of a surface of the second one of the two heating members exceeds a certain value.
    Type: Application
    Filed: May 30, 2003
    Publication date: November 6, 2003
    Inventors: Naoji Akutsu, Akinori Kumonaka
  • Patent number: 6597879
    Abstract: A fixing unit fixes a developing material deposited on a recording medium by heating and pressing the recording medium. The fixing unit includes a first number of heating members that apply heat to the recording medium and a second number of switches that supply electric power to the first number of heating members. Each of the heating members receives electric power through a series circuit of the switches. Each of the switches responds to a surface temperature of a corresponding one of the heating members so that when the surface temperature exceeds a predetermined value, the electric power is shut off.
    Type: Grant
    Filed: May 21, 2002
    Date of Patent: July 22, 2003
    Assignee: Oki Data Corporation
    Inventors: Naoji Akutsu, Akinori Kumonaka
  • Publication number: 20030007803
    Abstract: A fixing unit fixes a developing material deposited on a recording medium by heating and pressing the recording medium. The fixing unit includes a first number of heating members that apply heat to the recording medium and a second number of switches that supply electric power to the first number of heating members. Each of the heating members receives electric power through a series circuit of the switches. Each of the switches responds to a surface temperature of a corresponding one of the heating members so that when the surface temperature exceeds a predetermined value, the electric power is shut off.
    Type: Application
    Filed: May 21, 2002
    Publication date: January 9, 2003
    Applicant: Oki Data Corporation
    Inventors: Naoji Akutsu, Akinori Kumonaka
  • Patent number: 6169260
    Abstract: A needle disposal apparatus for melting a needle to be disposed of by passage of electrical current through it, has a guide member having an inlet which permits the needle to be inserted; an upper electrode roller, to which a first voltage is applied, the inserted needle making contact with an outer surface of the upper electrode roller; a lower electrode roller to which a second voltage is applied, the inserted needle making contact with an outer surface of the lower electrode roller; and a drive mechanism which rotates the electrode rollers in each direction so that the inserted needle is drawn between the electrode rollers; wherein the electrode rollers are disposed so that a part of the lower electrode roller is hidden behind the upper electrode roller when viewed from the inlet in a direction of insertion of the needle.
    Type: Grant
    Filed: March 24, 1999
    Date of Patent: January 2, 2001
    Assignee: Oki Data Corporation
    Inventors: Naoji Akutsu, Yukio Ota
  • Patent number: 5518323
    Abstract: According to a method of adjusting a head gap, a wire dot head is set to a predetermined position of a reference head gap; a printing pattern for detecting printing time is printed by a plurality of pins; reference printing times of respective pins are detected. Next, a test printing is performed with test printing dots previously selected from printing data, and printing time of the test printing is detected. Then, the thickness of the printing media is calculated based on the reference printing time and the printing time of the test printing. At that time, a rule of thumb in which the difference of the printing time corresponds to the difference of the head gap, is used. Then, a shift amount of the wire dot head is calculated for setting the head gap to an optimum value according to the thickness of the printing media, and gap shifting mechanism shifts the wire dot head by the shift amount. This leads to highly accurate detection of the head gap and improves printing quality thereof.
    Type: Grant
    Filed: July 14, 1993
    Date of Patent: May 21, 1996
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Hiroshi Sakaino, Hideaki Ishimizu, Mitsuru Kishimoto, Noboru Ooishi, Masayuki Ishikawa, Chihiro Komori, Naoji Akutsu, Jiro Tanuma, Tadashi Kasai
  • Patent number: 5452174
    Abstract: A power source circuit is provided having a high frequency transformer 16, a switching control circuit 15 connected with the primary winding of the transformer 16, rectifier circuits 17, 18 and 20 connected with the secondary winding of the transformer 16 for outputting a D.C. voltage to an external circuit, an alarm detection circuit 25, an excess current detection circuit 26, and an excess current detection delay circuit 28. When the alarm detection circuit 25 detects an excess current in supplying power source, the power source supply is suspended by turning off the output of the switching control circuit 15 after the lapse of the preset time. When the excess current flows after the lapse of the initial preset time t.sub.s from turning on the power source, the excess current detection circuit 26 detects it so that the output of the switching control circuit 15 is turned off.
    Type: Grant
    Filed: June 15, 1994
    Date of Patent: September 19, 1995
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Naoji Akutsu, Yasuhiro Shirai, Akira Hagiwara
  • Patent number: 5450288
    Abstract: A printed chip-on-board substrate is for mounting a high-power semiconductor chip. As a construction for efficiently releasing or dissipating heat to be generated in the semiconductor chip, the printed substrate has a printed interconnected substrate and a metal plate bonded on a back side of the substrate. The printed interconnected substrate is constructed by forming an interconnected layer on a surface of the substrate. At a mount area where the semiconductor chip is to be mounted, an opening is formed reaching the metal plate. The metal plate covers the opening on the side of the back side and is formed with a thickness capable of providing rigidity sufficient to support thereon at least the semiconductor chip to be mounted.
    Type: Grant
    Filed: September 14, 1993
    Date of Patent: September 12, 1995
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Jiro Tanuma, Naoji Akutsu, Chihiro Komori, Hideaki Ishimizu
  • Patent number: 5330277
    Abstract: A drive system for a wire dot head is provided with sensors for detecting displacements of corresponding print wires. Each sensor outputs a movement initiation timing signal and an impact timing signal for the corresponding print wire. An electric current to be fed to an associated coil is normally controlled by these timing signals. It is detected whether these timing signals are obtained in a predetermined time period. If not, electric power is continuously fed to the coil or is forcedly cut off so that the timing signals are obtained within the predetermine time period.
    Type: Grant
    Filed: October 21, 1992
    Date of Patent: July 19, 1994
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Tadashi Kasai, Takao Uchida, Jiro Tanuma, Naoji Akutsu, Chihiro Komori
  • Patent number: 5326183
    Abstract: Printing control includes determining printing dot density of print data to be supplied to a printing head, averaging the printing dot density during a predetermined period of time based on the printing dot density determined, selecting a printing speed in response to the average value of printing dot density, and controlling printing to print at the selected printing speed.
    Type: Grant
    Filed: November 14, 1991
    Date of Patent: July 5, 1994
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Tadashi Kasai, Jiro Tanuma, Naoji Akutsu, Hideaki Ishimizu, Chihiro Komori
  • Patent number: 5311403
    Abstract: A printed chip-on-board substrate is for mounting a high-power semiconductor chip. As a construction for efficiently releasing or dissipating heat to be generated in the semiconductor chip, the printed substrate has a printed interconnected substrate and a metal plate bonded on a back side of the substrate. The printed interconnected substrate is constructed by forming an interconnected layer on a surface of the substrate. At a mount area where the semiconductor chip is to be mounted, an opening is formed reaching the metal plate. The metal plate covers the opening on the side of the back side and is formed with a thickness capable of providing rigidity sufficient to support thereon at least the semiconductor chip to be mounted.
    Type: Grant
    Filed: November 6, 1991
    Date of Patent: May 10, 1994
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Jiro Tanuma, Naoji Akutsu, Chihiro Komori, Hideaki Ishimizu
  • Patent number: 5307049
    Abstract: A drive current for driving actuators is generated based on a first digital signal comprising n-bit binary data which is supplied from a microprocessor and it is applied to an excitation coil. The drive current is supplied to the exciting coil and is converted into a voltage which is then converted into a second digital signal comprising n-bit binary data. The binary data of the second digital signal is compared with the digital data of the first digital signal to detect an alarm condition. Furthermore, the second digital signal is compared with first and second reference value to set plural alarm conditions.
    Type: Grant
    Filed: April 28, 1992
    Date of Patent: April 26, 1994
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Takao Uchida, Naoji Akutsu, Jiro Tanuma
  • Patent number: 5295750
    Abstract: In a wire-dot impact printer having a capacitance detector for detecting a displacement of each armature by a sensor electrode arranged opposite the armature, a space is formed between each sensor electrode and its associated armature, and a shield pattern is formed with a small space left around each sensor electrode. The shield pattern is fed with a potential at least equal to the potential of each sensor electrode. This makes it possible to reduce the influence of noise upon detection of a capacitance by the capacitance detector. A noise canceling electrode is also disposed around each sensor electrode and is connected to the sensor electrode, whereby a noise canceling circuit is further provided to eliminate noise voltage. The noise canceling circuit can eliminate a noise voltage picked up by the sensor electrode and the noise canceling electrode.
    Type: Grant
    Filed: February 9, 1993
    Date of Patent: March 22, 1994
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Jiro Tanuma, Naoji Akutsu, Takao Uchida, Chihiro Komori, Masaru Ito
  • Patent number: 5200763
    Abstract: An LED array printer includes an LED array print head (1) and a control circuit board (31) for controlling the LED array printer. A setting arrangement circuit (41) for setting the characteristics and specifications of the head is disposed in the head (1). setting data is read from the setting arrangement (41) and transferred to the control circuit board (31) in order to control the head (1).
    Type: Grant
    Filed: March 20, 1991
    Date of Patent: April 6, 1993
    Assignee: Oki Electric Co., Ltd.
    Inventors: Jiro Tanuma, Naoji Akutsu
  • Patent number: 5101233
    Abstract: In an electrophotographic recording device which includes a number of consumable parts, there is provided a first memory for storing a currently integrated total number of prints, and a number of prints at replacement of each consumable part. A second memory stores a number of lifetime prints, which is a conversion of the life of each part into a number of prints. A processor performs a first calculation to calculate a number of prints for replaced consumable parts after such replacement and a second calculation to calculate a wear rate of the replaced consumable parts from the number of lifetime prints read out from the second memory, and from the number of prints calculated by the first calculation. An indication section indicates the wear rate obtained from the second calculation. The number of prints stored in the first memory for the consumable parts at replacement is written into the current total number of prints.
    Type: Grant
    Filed: February 13, 1991
    Date of Patent: March 31, 1992
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Katsuyuki Ito, Naoji Akutsu, Takehiko Okubo, Koichi Negishi, Kazuhiko Itoh
  • Patent number: 4918365
    Abstract: An electromechanical actuator includes an electric motor and a control and drive circuit mounted integrally with the electric motor. The control and drive circuit includes a serial-to-parallel converter for converting a control signal in the form of serial data into parallel data, and a device responsive to the control signal in the form of parallel data for producing a drive current or voltage for the electric motor. A system for accessing or controlling a plurality of such actuators by commands from a main controller can include a control and drive circuit which is integral with the motor itself.
    Type: Grant
    Filed: December 23, 1988
    Date of Patent: April 17, 1990
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Jiro Tanuma, Naoji Akutsu, Tadashi Kasai
  • Patent number: 4916464
    Abstract: An LED array print head for an electrophotographic printer includes: LED array device packages each being loaded with an array of LEDs individually connected to a first major surface of the LED package by first solder joints; LED driver packages each loaded with a driver circuit connected to a first major surface of the driver package by second solder joints; and an optically transparent insulative substrate with a first major surface carrying conductive leads adapted to electrically connect the LEDs and driver circuits. The LED and driver packages are mounted on the substrate in such an orientation that the first major surfaces of the packages face the first major surface of the substrate and the first and second solder joints are connected to the conductive leads of the substrate.
    Type: Grant
    Filed: May 4, 1989
    Date of Patent: April 10, 1990
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Katsuyuki Ito, Naoji Akutsu, Yuhei Itasaka
  • Patent number: 4825133
    Abstract: An electromechanical actuator includes an electric motor and a control and drive circuit mounted integrally with the electric motor. The control and drive circuit includes a serial-to-parallel converter for converting a control signal in the form of serial data into parallel data, and a device responsive to the control signal in the form of parallel data for producing a drive current or voltage for the electric motor. A system for accessing or controlling a plurality of such actuators by commands from a main controller can include a control and drive circuit which is integral with the motor itself.
    Type: Grant
    Filed: July 30, 1987
    Date of Patent: April 25, 1989
    Assignee: OKI Electric Industry Co., Ltd.
    Inventors: Jiro Tanuma, Naoji Akutsu, Tadashi Kasai
  • Patent number: 4748293
    Abstract: A flexible cable has a grounding pattern or patterns provided therein. Thereby, when an object having static electricity of high voltage is caused to approach the flexible cable, dielectric breakdown of a base and cover of a high polymer material of the cable, to a conducting portion of the cable which is not exposed at the interior of the flexible cable is prevented, and damage to an electronic circuit connected with the not exposed portion, due to electric discharge, can be prevented by causing the static electricity to be discharged to the exposed grounding pattern.
    Type: Grant
    Filed: February 25, 1986
    Date of Patent: May 31, 1988
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Hiroshi Kikuchi, Jiro Tanuma, Naoji Akutsu