Abstract: An electronic device assembly for dense mounting of electronic devices and method of connecting the electronic devices are disclosed. Conductive portions implemented by metal bumps and sealing portions implemented by adhesive seal resin are connected by thermocompression at the same time between two electronic devices. This may be repeated between three or more electronic device.

Abstract: Disclosed is a bump structure, which has a hollow body, for electrically connecting a first member and a second member. Also disclosed is a method for making a bump structure, which has the steps of: preparing a molding plate with a concave mold to mold a bump-forming member; forming a conductive thin film so as to form a predetermined cavity in the concave mold of the molding plate; preparing a substrate to which the conductive thin film is to be transferred; and transferring the conductive thin film formed on the molding plate to the substrate.

Abstract: There is disclosed a double side connected type semiconductor apparatus comprising pads for external connection on both sides, semiconductor devices formed on both sides of a semiconductor substrate, and conductor portions which perform electrical connection between the pads and between the pads and the semiconductor devices, wherein the semiconductor devices are formed on both the sides of the semiconductor substrate in accordance with a selective impurity diffusing method; the conductor portions are formed in such a manner that impurities are diffused only in required parts on both the sides of the semiconductor substrate in accordance with the selective impurity diffusing method, so that a resistivity of the diffused part of the semiconductor substrate lowers, which enables electric conduction; and the conductor portions are electrically insulated from the semiconductor devices by isolations.

Abstract: An electronic device assembly for dense mounting of electronic devices and method of connecting the electronic devices are disclosed. Conductive portions implemented by metal bumps and sealing portions implemented by adhesive seal resin are connected by thermocompression at the same time between two electronic devices. This may be repeated between three or more electronic device.

Abstract: A semiconductor manufacturing apparatus for manufacturing a highly versatile semiconductor device includes a holder for releasably embracing and holding a substrate having first and second sides on which first and second bonding pads, respectively, are provided; a bonding tool for wire-bonding the first and second bonding pads; and a bonding head, which has the bonding tool mounted thereon, for driving the bonding tool in three dimensions and rotating the bonding tool about an axis that is perpendicular to the central axis of the bonding tool.

Abstract: A three-dimensional semiconductor device includes a cylindrical heat sink, wherein a CPU is provided on a substantially center of an inner bottom surface of the cylindrical heat sink, semiconductor chips are respectively mounted on an outer peripheral surface and an inner peripheral surface of the cylindrical heat sink, and the CPU is connected to an upper heat sink.

Abstract: An apparatus for lining up micro-balls in accordance with the present invention includes: ball carrying pallets having a plurality of pits for holding the micro-balls, respectively, on its surface, a pallet holder for holding the ball carrying pallets, a lining-up container defining a sealed chamber in association with the pallet holder hermetically fitted thereto, a storing tank for storing liquid carrier in which micro-balls are dispersed, and applying/collecting device for communicating the storing tank with the lining-up container via a passage to supply the micro-balls together with the liquid carrier from the storing tank to the sealed chamber and return the surplus micro-balls together with the liquid carrier from the sealed chamber to the storing tank.

Abstract: A metal layer is formed on each surface of topside substrate electrodes on a substrate. Another metal layer is formed on each surface of chip electrodes on a function element chip. Both ends of vertical coil springs are connected to the topside substrate electrodes and the chip electrodes through the metal layers, respectively. In this way, the topside substrate electrodes are connected to the chip electrodes through the vertical coil springs by means of flip hip bonding.

Abstract: A solder ball arrangement device has a thin arrangement plate having a plurality of through-holes of a truncated pyramid shape, a porous member bonded to the arrangement plate, and a housing member for receiving the arrangement plate and the porous member for defining an air space inside the housing member. A suction pump is provided to evacuate the air space and to receive an array of solder balls in the through-holes by suction. The through-holes are formed by etching, and the porous member reinforces the thin arrangement plate.

Abstract: An electronic device assembly for dense mounting of electronic devices and method of connecting the electronic devices are disclosed. Conductive portions implemented by metal bumps and sealing portions implemented by adhesive seal resin are connected by thermocompress ion at the same time between two electronic devices. This may be repeated between three or more electronic device.

Abstract: Disclosed is a bump structure, which has a hollow body, for electrically connecting a first member and a second member. Also disclosed is a method for making a bump structure, which has the steps of: preparing a molding plate with a concave mold to mold a bump-forming member; forming a conductive thin film so as to form a predetermined cavity in the concave mold of the molding plate; preparing a substrate to which the conductive thin film is to be transferred; and transferring the conductive thin film formed on the molding plate to the substrate.

Abstract: A three-dimensional semiconductor device includes a cylindrical heat sink, wherein a CPU is provided on a substantially center of an inner bottom surface of the cylindrical heat sink, semiconductor chips are respectively mounted on an outer peripheral surface and an inner peripheral surface of the cylindrical heat sink, and the CPU is connected to an upper heat sink.

Abstract: A semiconductor device includes (a) a semiconductor chip, (b) a patterned lead composed of an electrical conductor and formed on the semiconductor chip in electrical contact with the semiconductor chip, and (c) a resin film sealing a main surface of the semiconductor chip therewith. The lead has a portion projecting beyond the main surface of the semiconductor chip.

Abstract: There is provided a function element including a resin layer formed on a surface thereof, the resin layer having adhesive property and sealing property, the resin layer having such a pattern that a resin layer does not exist in at least one of following areas: (a) a first area around an area where device performances are influenced by resin of which the resin layer was composed, (b) a second area around pads or bumps, (c) a third area around an area on which a wiring of a substrate will exist when the function element is coupled to the substrate, and (d) a fourth area around an area on which a passive element mounted on a substrate will exist when the function element is coupled to the substrate. The function element prevents extra resin from adhering to an area of the function element where device performances will be influenced by the resin, when the function element is coupled to a substrate with a resin layer being sandwiched therebetween.

Abstract: One main surface of a substrate has formed on it an appropriate contact terminal having in one part thereof a protruding part. An end of a lead is mounted via a holding part that is provided between the substrate and a probe, the lead being disposed along the main surface of the substrate so as to peel away from the main surface.

Abstract: Disclosed is a bump structure, which has a hollow body, for electrically connecting a first member and a second member. Also disclosed is a method for making a bump structure, which has the steps of: preparing a molding plate with a concave mold to mold a bump-forming member; forming a conductive thin film so as to form a predetermined cavity in the concave mold of the molding plate; preparing a substrate to which the conductive thin film is to be transferred; and transferring the conductive thin film formed on the molding plate to the substrate.

Abstract: An apparatus for transferring micro-balls in accordance with the present invention, includes a suction head in which a plurality of suction pits are open for holding the respective micro-balls, a head holder to which the suction head is detachably coupled, a suction device communicating with a suction chamber in the head holder, for allowing the suction pits to hold the micro-balls by decompressing the interior of the suction chamber, and a holder transporting device to which the head holder is mounted, wherein the holder transporting device are movable between a sucking position at which is placed a pallet on which the micro-balls to be held by the suction pits, a transferring position at which is placed a working object to which the micro-balls held by the suction pits, and a head exchanging position at which the replacement of the suction head is carried out relative to the head holder.

Abstract: An apparatus for lining up micro-balls in accordance with the present invention includes: ball carrying pallets having a plurality of pits for holding the micro-balls, respectively, on its surface, a pallet holder for holding the ball carrying pallets, a lining-up container defining a sealed chamber in association with the pallet holder hermetically fitted thereto, a storing tank for storing liquid carrier in which micro-balls are dispersed, and applying/collecting device for communicating the storing tank with the lining-up container via a passage to supply the micro-balls together with the liquid carrier from the storing tank to the sealed chamber and return the surplus micro-balls together with the liquid carrier from the sealed chamber to the storing tank.

Abstract: An electronic device assembly for dense mounting of electronic devices and method of connecting the electronic devices are disclosed. Conductive portions implemented by metal bumps and sealing portions implemented by adhesive seal resin are connected by thermocompression at the same time between two electronic devices. This may be repeated between three or more electronic device.

Abstract: The present invention adopts a circuit pattern in which in a carrier of a package for coupling semiconductor devices at multistage, drawing out lines for selecting individual semiconductor devices are coupled in parallel. Thus, the present invention achieves the multistage coupling semiconductor device which can be completed with a circuit pattern of one kind regardless of the number of stages of a multistage. Using the carrier having the foregoing structure, the semiconductor device is assembled and is subjected to characteristic inspections. Thereafter, the circuit patterns, coupled in parallel, having good electrical characteristics are partially cut by either laser, sand-blast, or etching. The products can be specified according to the circuit pattern which is cut.