Patents by Inventor Naoki ARAKAWA

Naoki ARAKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11051679
    Abstract: A substrate connection structure includes a tubular member, a first substrate, a second substrate, a first connector, a second connector, a first pin, and a guide member. The tubular member has a bottom portion and an opening side. The first substrate is disposed on either the bottom portion or the opening side. The second substrate is disposed on either the bottom portion or the opening side opposite to the first substrate. The first connector is disposed on the first substrate. The second connector is disposed on the second substrate and is connected to the first connector. The first pin is disposed on the first substrate. The first pin projects such as to extend from the first substrate along a direction of connection between the first connector and the second connector. The guide member is disposed on the second substrate. The guide member has a guide hole.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: July 6, 2021
    Assignee: OLYMPUS CORPORATION
    Inventor: Naoki Arakawa
  • Patent number: 10418732
    Abstract: A board attaching structure includes a first board on which a first connector provided, a second board on which a second connector provided, a plate-like member extending parallel to the first board and covering at least part of an surface of the first board, a posture restricting portion formed by bending part of the plate-like member toward the first board and configured to restrict a posture of the second board with respect to the first board when the second connector is mounted on the first connector, and a position restricting portion formed by bending part of the plate-like member and configured to restrict a position at which the second board is arranged on the first board while the second connector is mounted on the first connector.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: September 17, 2019
    Assignee: OLYMPUS CORPORATION
    Inventor: Naoki Arakawa
  • Publication number: 20190059704
    Abstract: A substrate connection structure includes a tubular member, a first substrate, a second substrate, a first connector, a second connector, a first pin, and a guide member. The tubular member has a bottom portion and an opening side. The first substrate is disposed on either the bottom portion or the opening side. The second substrate is disposed on either the bottom portion or the opening side opposite to the first substrate. The first connector is disposed on the first substrate. The second connector is disposed on the second substrate and is connected to the first connector. The first pin is disposed on the first substrate. The first pin projects such as to extend from the first substrate along a direction of connection between the first connector and the second connector. The guide member is disposed on the second substrate. The guide member has a guide hole.
    Type: Application
    Filed: October 26, 2018
    Publication date: February 28, 2019
    Applicant: Olympus Corporation
    Inventor: Naoki Arakawa
  • Publication number: 20180375236
    Abstract: A board attaching structure includes a first board on which a first connector provided, a second board on which a second connector provided, a plate-like member extending parallel to the first board and covering at least part of an surface of the first board, a posture restricting portion formed by bending part of the plate-like member toward the first board and configured to restrict a posture of the second board with respect to the first board when the second connector is mounted on the first connector, and a position restricting portion formed by bending part of the plate-like member and configured to restrict a position at which the second board is arranged on the first board while the second connector is mounted on the first connector.
    Type: Application
    Filed: August 31, 2018
    Publication date: December 27, 2018
    Applicant: OLYMPUS CORPORATION
    Inventor: Naoki ARAKAWA