Abstract: A multilayer circuit board includes a plurality of wiring layers laminated with insulation layers interposed therebetween, the multilayer circuit board further including a solder resist layer that covers a front face wiring layer formed on a front face side insulation layer, in which the front face wiring layer includes a pad for leg terminal to which a leg terminal of a connector is connected, the solder resist layer has an opening part for leg terminal which exposes a part of the pad for leg terminal, a via for leg terminal is provided beneath the pad for leg terminal in a predetermined range straddling a contour line of an opening part for leg terminal, and the via for leg terminal connects a first internal wiring layer with the pad for leg terminal.

Abstract: A connecting structure for high frequency circuits is provided, with which components can be readily replaced, and which does not require high assembly accuracy and is applicable in a broad band. First and second circuit boards each having strip lines on top surfaces thereof are placed to secure a gap therebetween. Patch portions each constituting a resonator are formed by extending the width of the strip lines, and a supporting member of a foam material is placed on the top of the patch portion formed on the first circuit board. A parasitic element made of a dielectric material is cantilevered by the supporting member. The free end side of the parasitic element is placed above the patch portion formed on the second circuit board while securing a predetermined space between the parasitic element and this patch portion. A strong electrical connection is established by the parasitic element that electromagnetically couples non-continuing portions, thereby making it possible to cut a direct current.

Abstract: A connecting structure for high frequency circuits is provided, with which components can be readily replaced, and which does not require high assembly accuracy and is applicable in a broad band. First and second circuit boards each having strip lines on the top surfaces are placed to secure a gap. Patch portions each constituting a resonator are formed by extending the width of the strip lines, and a supporting member of a foam material is placed on the top of the patch portion formed on the first circuit board such that a parasitic element made of a dielectric material is cantilevered by the supporting member. The free end side of the parasitic element is placed above the patch portion formed on the second circuit board while securing a predetermined space. A strong electrical connection is established by the parasitic element that electromagnetically couples non-continuing portions, thereby making it possible to cut a direct current.