Abstract: Provided are a top panel for a tactile sensation display device and a tactile sensation display device that are capable of enhancing the expressiveness of tactile sensation. A top panel 1 for a tactile sensation display device is for use in a tactile sensation display device 10 and has an internal friction of 1.0×10?2 or less.

Abstract: Reliability of a semiconductor device is improved. In the semiconductor device SA1, a snubber capacitor pad SNP electrically connected to the capacitor electrode of the snubber capacitor is formed on the surface of the semiconductor chip CHP.

Abstract: Provided are a top panel for a tactile sensation display device and a tactile sensation display device that are capable of enhancing the expressiveness of tactile sensation. A top panel 1 for a tactile sensation display device is for use in a tactile sensation display device 10 and has an internal friction of 1.0×10?2 or less.

Abstract: Provided is a wavelength conversion member that is less decreased in luminescence intensity with time by irradiation with light of an LED or LD and a light emitting device using the wavelength conversion member. A wavelength conversion member is formed of an inorganic phosphor dispersed in a glass matrix, wherein the glass matrix contains, in % by mole, 30 to 85% SiO2, 0 to 20% B2O3, 0 to 25% Al2O3, 0 to 3% Li2O, 0 to 3% Na2O, 0 to 3% K2O, 0 to 3% Li2O+Na2O+K2O, 0 to 35% MgO, 0 to 35% CaO, 0 to 35% SrO, 0 to 35% BaO, 0.1 to 45% MgO+CaO+SrO+BaO, and 0 to 4% ZnO, and the inorganic phosphor is at least one selected from the group consisting of an oxide phosphor, a nitride phosphor, an oxynitride phosphor, a chloride phosphor, an oxychloride phosphor, a halide phosphor, an aluminate phosphor, and a halophosphoric acid chloride phosphor.

Abstract: Provided are a wavelength conversion member and a wavelength conversion element which are capable of reducing the decrease in luminescence intensity with time and the melting of a component material when irradiated with light of a high-power LED or LD, and a light emitting apparatus using the wavelength conversion member or the wavelength conversion element. A wavelength conversion member contains, in % by mass, 70 to 99.9% inorganic phosphor particles and 0.1 to 30% easily sinterable ceramic particles, wherein the easily sinterable ceramic particles are interposed between the inorganic phosphor particles and the inorganic phosphor particles are bound together by the easily sinterable ceramic particles.

Abstract: Provided is a wavelength conversion member that is less decreased in luminescence intensity with time by irradiation with light of an LED or LD and a light emitting device using the wavelength conversion member. A wavelength conversion member is formed of an inorganic phosphor dispersed in a glass matrix, wherein the glass matrix contains, in % by mole, 30 to 85% SiO2, 4.3 to 20% B2O3, 0 to 25% Al2O3, 0 to 3% Li2O, 0 to 3% Na2O, 0 to 3% K2O, 0 to 3% Li2O+Na2O+K2O, 0 to 35% MgO, 0 to 35% CaO, 0 to 35% SrO, 0 to 35% BaO, 0.1 to 45% MgO+CaO+SrO+BaO, and 0 to 5% ZnO, and the inorganic phosphor is at least one selected from the group consisting of an oxide phosphor, a nitride phosphor, an oxynitride phosphor, a chloride phosphor, an oxychloride phosphor, a halide phosphor, an aluminate phosphor, and a halophosphoric acid chloride phosphor.

Abstract: Provided are a wavelength conversion member and a wavelength conversion element which are capable of reducing the decrease in luminescence intensity with time and the melting of a component material when irradiated with light of a high-power LED or LD, and a light emitting apparatus using the wavelength conversion member or the wavelength conversion element. A wavelength conversion member contains, in % by mass, 70 to 99.9% inorganic phosphor particles and 0.1 to 30% easily sinterable ceramic particles, wherein the easily sinterable ceramic particles are interposed between the inorganic phosphor particles and the inorganic phosphor particles are bound together by the easily sinterable ceramic particles.

Abstract: Provided is a wavelength conversion member capable of reducing the decrease in luminescence intensity with time and the melting of a component material when irradiated with light of a high-power LED or LD and providing a light emitting device using the wavelength conversion member. The wavelength conversion member (11) includes a laminate that includes: a phosphor layer (1); and light-transmissive heat dissipation layers (2) formed on both surfaces of the phosphor layer (1) and having a higher thermal conductivity than the phosphor layer (1).

Abstract: An output terminal portion includes: an output terminal that includes: a shaft portion on which an external screw thread portion is formed; and a head portion; and an intermediary member that includes: a fastening seat on a first axial end of which a nut portion is formed integrally, and that is mounted so as to be fitted over the shaft portion such that a second axial end protrudes axially out of a bushing, the bushing is mounted to the intermediary member such that axial movement of the bushing is constrained, and an external output wire is mounted to a second axial end surface of the fastening seat in a state of contact by a fastening force from a fixing nut that is screwed onto the external screw thread portion such that the external output wire is fixed by fastening between the fixing nut and the fastening seat.

Abstract: An electronic device includes: a grounded shield plate; and a female-type interface connector, wherein a conductive member electrically connected to the shield plate is included, and when a male-type cable connector including a metal shell part and a holding part to hold the metal shell part is inserted into and connected to the interface connector, the conductive member is biased in such a manner as to come into contact with an exposed part that is on a side surface of the metal shell part and is between the holding part and the shield plate.

Abstract: An electronic device includes: a grounded shield plate; and a female-type interface connector, wherein a conductive member electrically connected to the shield plate is included, and when a male-type cable connector including a metal shell part and a holding part to hold the metal shell part is inserted into and connected to the interface connector, the conductive member is biased in such a manner as to come into contact with an exposed part that is on a side surface of the metal shell part and is between the holding part and the shield plate.

Abstract: Provided is a wavelength conversion member capable of reducing the decrease in luminescence intensity with time and the melting of a component material when irradiated with light of a high-power LED or LD and providing a light emitting device using the wavelength conversion member. The wavelength conversion member (11) includes a laminate that includes: a phosphor layer (1); and light-transmissive heat dissipation layers (2) formed on both surfaces of the phosphor layer (1) and having a higher thermal conductivity than the phosphor layer (1).

Abstract: After embedding a silicon oxide film within a second trench that opens in a semiconductor substrate using a silicon nitride film as a hard mask, the silicon oxide film over the silicon nitride film is polished, and then, wet etching is performed before a step for removing the silicon nitride film, and thereby the upper surface of the silicon oxide film within a first trench opened in the silicon nitride film is retreated.

Abstract: An output terminal portion includes: an output terminal that includes: a shaft portion on which an external screw thread portion is formed; and a head portion; and an intermediary member that includes: a fastening seat on a first axial end of which a nut portion is formed integrally, and that is mounted so as to be fitted over the shaft portion such that a second axial end protrudes axially out of a bushing, the bushing is mounted to the intermediary member such that axial movement of the bushing is constrained, and an external output wire is mounted to a second axial end surface of the fastening seat in a state of contact by a fastening force from a fixing nut that is screwed onto the external screw thread portion such that the external output wire is fixed by fastening between the fixing nut and the fastening seat.

Abstract: After embedding a silicon oxide film within a second trench that opens in a semiconductor substrate using a silicon nitride film as a hard mask, the silicon oxide film over the silicon nitride film is polished, and then, wet etching is performed before a step for removing the silicon nitride film, and thereby the upper surface of the silicon oxide film within a first trench opened in the silicon nitride film is retreated.

Abstract: A system and method for setting a software option of a numeric control device, by which a user cannot set the options without permission and a cost regarding option configuration may be recovered by a maker. A maker PC generates option setting data for setting bit information to one or zero, based on a name or a number of a software option to be set, in order to make the function of the software option valid or invalid. This data is encoded or encrypted by using a unique identification number of a control device. The control device reads and decodes the encoded software option setting data, in order to set data of the corresponding memory address and bit number in the control device to one or zero. By using the unique identification number of the control device, only the control device, the software option setting data of which is required, can decode the encoded data.

Abstract: A USB storage device having the function of preventing stored software from being deleted by mistake achieved with as simple a structure as possible. In the USB storage device, the storage area is divided into an area in which execution of reading, writing and deleting is allowed and an area in which only execution of reading is allowed. Information to make a USB mass storage class driver recognize these areas as areas corresponding, respectively, to logical unit numbers defined in the SCSI command set of the USB mass storage class driver owned by the host is stored in the USB storage device. The information includes logical unit numbers, formats, writing/deleting allowed/not allowed flag, logical block numbers and physical block numbers. By this, the USB mass storage class driver recognizes the USB storage device as a SCSI device having two logical units.

Abstract: A USB storage device having the function of preventing stored software from being deleted by mistake achieved with as simple a structure as possible. In the USB storage device, the storage area is divided into an area in which execution of reading, writing and deleting is allowed and an area in which only execution of reading is allowed. Information to make a USB mass storage class driver recognize these areas as areas corresponding, respectively, to logical unit numbers defined in the SCSI command set of the USB mass storage class driver owned by the host is stored in the USB storage device. The information includes logical unit numbers, formats, writing/deleting allowed/not allowed flag, logical block numbers and physical block numbers. By this, the USB mass storage class driver recognizes the USB storage device as a SCSI device having two logical units.

Abstract: A semiconductor device which has an internal circuit for performing a circuit operation corresponding to a signal inputted or outputted through an input/output interface circuit adapted to a serial bus. The semiconductor device has a non-volatile storage circuit for storing identification data. Internal identification data stored in the non-volatile storage circuit is compared with external identification data included in an input signal supplied through the serial bus by a comparator circuit. A control circuit is responsive to a match detecting signal generated by the comparator circuit to perform a circuit operation corresponding to an input signal subsequently supplied through the serial bus to change the internal identification data stored in the non-volatile storage circuit.