Patents by Inventor Naoki GOUCHI
Naoki GOUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20170171966Abstract: To prevent decrease of the bonding strength of an electronic component and a multilayer substrate, an electronic component-embedded module may include an electronic component having a plurality of pads and a multilayer substrate which includes a plurality of resin layers and a cavity for containing the electronic component. The multilayer substrate may include a first resin layer having a plurality of first pattern conductors and a space, and a second resin layer having a second pattern conductor and a plurality of third pattern conductors. The plurality of third pattern conductors may be in conduction with either of the first pattern conductors or the pads, with the second resin layer being placed over the first resin layer. The second pattern conductor may be arranged around a first pad with a gap, and the second resin layer is present between the second pattern conductor and at least one of the first pads.Type: ApplicationFiled: January 30, 2017Publication date: June 15, 2017Inventor: Naoki GOUCHI
-
Publication number: 20170149111Abstract: A composite transmission line includes a laminated insulator including insulator layers, signal transmission lines including first and second signal transmission lines and a power transmission line. The power transmission line includes a power transmission conductor pattern along the insulator layers, and an interlayer connection conductor that interlayer-connects power transmission conductor patterns. The first signal conductor pattern of the first signal transmission line, the second signal conductor pattern of the second signal transmission line, and the power transmission conductor pattern are parallel or substantially parallel to each other on the insulator layers that are mutually different from each other. The first and second signal conductor patterns interpose a first ground conductor in the laminating direction of the insulator layers. The power transmission line is in a side portion of the first signal conductor pattern.Type: ApplicationFiled: January 10, 2017Publication date: May 25, 2017Inventors: Kuniaki YOSUI, Naoki GOUCHI, Nobuo IKEMOTO
-
Patent number: 9607260Abstract: An antenna device is configured as a jacket of a communication terminal, such as a mobile terminal, and a communication apparatus includes the antenna device attached to the communication terminal. The antenna device uses an HF-band high frequency signal as a carrier frequency, and is configured as a reader/writer antenna device for a near field communication system. The base body of the antenna device is a plate-shaped base member made of a resin. An antenna coil and a feeding coil are provided integrally with the plate-shaped base member. High-frequency signals are transmitted between the feeding coil and the antenna coil through magnetic coupling in a non-contact manner.Type: GrantFiled: April 11, 2014Date of Patent: March 28, 2017Assignee: Murata Manufacturing Co., Ltd.Inventors: Kuniaki Yosui, Takahiro Baba, Yuki Wakabayashi, Naoki Gouchi, Nobuo Ikemoto
-
Patent number: 9596764Abstract: To prevent decrease of the bonding strength of an electronic component and a multilayer substrate, an electronic component-embedded module may include an electronic component having a plurality of pads and a multilayer substrate which includes a plurality of resin layers and a cavity for containing the electronic component. The multilayer substrate may include a first resin layer having a plurality of first pattern conductors and a space, and a second resin layer having a second pattern conductor and a plurality of third pattern conductors. The plurality of third pattern conductors may be in conduction with either of the first pattern conductors or the pads, with the second resin layer being placed over the first resin layer. The second pattern conductor may be arranged around a first pad with a gap, and the second resin layer is present between the second pattern conductor and at least one of the first pads.Type: GrantFiled: December 19, 2014Date of Patent: March 14, 2017Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Naoki Gouchi
-
Patent number: 9585256Abstract: A component-embedded substrate includes a multilayer body formed by stacking up a plurality of resin layers in a predetermined direction, a component embedded in the multilayer body, the component having a plurality of terminal electrodes, a plurality of joining conductors provided in the multilayer body and joined to the plurality of terminal electrodes, a plurality of wiring conductors provided in the multilayer body and electrically coupled to the plurality of joining conductors and at least one auxiliary member enclosed within an outer boundary of the component provided in the multilayer body. The auxiliary member may be electrically insulated from each of the plurality of wiring conductors and arranged to balance pressures acting on the plurality of terminal electrodes when pressure is applied on the multilayer body.Type: GrantFiled: December 10, 2014Date of Patent: February 28, 2017Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Naoki Gouchi
-
Publication number: 20170040697Abstract: A plurality of first linear sections in a coil conductor are disposed on a lower surface of a first resin sheet. A plurality of second linear sections in the coil conductor are disposed on an upper surface of a second resin sheet. A plurality of via conductors in the coil conductor are disposed in the resin sheets. The coil conductor including the linear sections and the via conductors constitutes an antenna section. A first ground conductor is disposed on the lower surface of a third resin sheet. A second ground conductor is disposed on the upper surface of a fourth resin sheet. The first ground conductor and the second ground conductor are connected to each other by a interlayer connection conductor including a plurality of via conductors. The interlayer connection conductor does not define a closed loop surrounding the coil conductor.Type: ApplicationFiled: October 21, 2016Publication date: February 9, 2017Inventors: Naoki GOUCHI, Kuniaki YOSUI
-
Patent number: 9537200Abstract: There is provided an antenna apparatus capable of stably communicating with a communication partner and increasing the maximum possible communication range even when the antenna apparatus is relatively smaller than an antenna in the communication partner and the two antennas are disposed in close proximity on the same axis. A magnetic flux passing through a coil aperture of an antenna coil passes through a conductor aperture of a conductive layer, but the magnetic flux does not pass through the conductive layer. Accordingly, the magnetic flux is diverted to a path in which the conductor aperture of the conductive layer is the inside and the outer edge of the conductive layer is the outside. As a result, the magnetic flux passing through the coil aperture of the antenna coil makes a relatively large loop and links the inside and the outside of a coil conductor in an antenna in a communication partner with the antenna apparatus.Type: GrantFiled: February 26, 2015Date of Patent: January 3, 2017Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Katsumi Taniguchi, Jun Sasaki, Naoki Gouchi
-
Patent number: 9509051Abstract: A plurality of first linear sections in a coil conductor are disposed on a lower surface of a first resin sheet. A plurality of second linear sections in the coil conductor are disposed on an upper surface of a second resin sheet. A plurality of via conductors in the coil conductor are disposed in the resin sheets. The coil conductor including the linear sections and the via conductors constitutes an antenna section. A first ground conductor is disposed on the lower surface of a third resin sheet. A second ground conductor is disposed on the upper surface of a fourth resin sheet. The first ground conductor and the second ground conductor are connected to each other by a interlayer connection conductor including a plurality of via conductors. The interlayer connection conductor does not define a closed loop surrounding the coil conductor.Type: GrantFiled: October 16, 2014Date of Patent: November 29, 2016Assignee: Murata Manufacturing Co., Ltd.Inventors: Naoki Gouchi, Kuniaki Yosui
-
Patent number: 9484397Abstract: A component-embedded substrate having a multilayer substrate formed by laminating a plurality of thermoplastic sheets in a predetermined direction, an internal component provided in the multilayer substrate, and a surface-mount component mounted on a surface of the multilayer substrate using bumps. The surface-mount component, when viewed in a plan view in the predetermined direction, is positioned so as to cross an outline of the internal component, with the bumps on the surface-mount component located 50 ?m or more from the outline of the internal component.Type: GrantFiled: May 29, 2014Date of Patent: November 1, 2016Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Naoki Gouchi
-
Patent number: 9269038Abstract: An antenna device includes an antenna resonance circuit connected to a power supply circuit and a variable-frequency resonance element including a resonance circuit which is coupled with the antenna resonance circuit via an electromagnetic field. The resonant frequency of the resonance circuit is variable within a predetermined frequency band.Type: GrantFiled: May 15, 2014Date of Patent: February 23, 2016Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Nobuo Ikemoto, Toshiyuki Nakaiso, Naoki Gouchi, Naoto Ikeda
-
Patent number: 9225064Abstract: In an antenna device, first linear portions of a coil conductor are located on a lower surface of a first resin sheet. Second linear portions of the coil conductor are located on an upper surface of a second resin sheet. Via conductors of the coil conductor are formed in the first and second resin sheets and intermediate resin sheets located between the first and second resin sheets. The via conductors connect a first end and a second end of the first linear portions and a first end and a second end of the second linear portions, respectively. The first and second linear portions and the via conductors define the coil conductor. Each of the intermediate resin sheets includes an aperture in the center portion thereof. The lamination of the apertures defines a cavity in which a magnetic substance core is embedded. The coil conductor is wound around a periphery of the cavity.Type: GrantFiled: August 6, 2013Date of Patent: December 29, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Naoki Gouchi, Nobuo Ikemoto, Kuniaki Yosui, Wataru Tamura
-
Patent number: 9104950Abstract: An antenna for a wireless IC device having improved energy transfer efficiency with a wireless IC, and a wireless IC device equipped with the antenna are constructed such that the antenna includes a coil pattern and spiral coupling patterns provided at the ends of the coil pattern and disposed so as to face each other. A coupling module including a wireless IC chip and a feeder circuit substrate including a feeder circuit arranged to be coupled to the wireless IC chip is mounted on the coupling pattern so as to define a wireless IC device. The coil pattern is an open type coil pattern. The coupling patterns are arranged close to each other to define a single LC resonator. Thus, energy is concentrated in the coupling patterns, thereby improving the energy transfer efficiency between the antenna and the wireless IC chip.Type: GrantFiled: July 26, 2011Date of Patent: August 11, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Jun Sasaki, Teppei Miura, Naoki Gouchi
-
Patent number: 9083389Abstract: In a communication circuit, an RFIC includes an IO terminal and a control IC includes an IO terminal. A variable capacitance element includes control terminals, a capacitance element with a capacitance value that is determined according to a control voltage, and a resistance voltage divider circuit configured to generate the control voltage by dividing a voltage inputted to the control terminals. One of the RFIC and the control IC supplies control data to the variable capacitance element via a signal line. The variable capacitance element, along with an antenna coil, constitutes an antenna circuit of an LC parallel resonance circuit, and sets a resonant frequency of the antenna circuit to be a predetermined frequency.Type: GrantFiled: March 17, 2015Date of Patent: July 14, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Naoto Ikeda, Nobuo Ikemoto, Naoki Gouchi, Toshiyuki Nakaiso, Katsumi Taniguchi
-
Publication number: 20150188606Abstract: In a communication circuit, an RFIC includes an IO terminal and a control IC includes an IO terminal. A variable capacitance element includes control terminals, a capacitance element with a capacitance value that is determined according to a control voltage, and a resistance voltage divider circuit configured to generate the control voltage by dividing a voltage inputted to the control terminals. One of the RFIC and the control IC supplies control data to the variable capacitance element via a signal line. The variable capacitance element, along with an antenna coil, constitutes an antenna circuit of an LC parallel resonance circuit, and sets a resonant frequency of the antenna circuit to be a predetermined frequency.Type: ApplicationFiled: March 17, 2015Publication date: July 2, 2015Inventors: Naoto IKEDA, Nobuo IKEMOTO, Naoki GOUCHI, Toshiyuki NAKAISO, Katsumi TANIGUCHI
-
Patent number: 9065182Abstract: There is provided an antenna apparatus capable of stably communicating with a communication partner and increasing the maximum possible communication range even when the antenna apparatus is relatively smaller than an antenna in the communication partner and the two antennas are disposed in close proximity on the same axis. A magnetic flux passing through a coil aperture of an antenna coil passes through a conductor aperture of a conductive layer, but the magnetic flux does not pass through the conductive layer. Accordingly, the magnetic flux is diverted to a path in which the conductor aperture of the conductive layer is the inside and the outer edge of the conductive layer is the outside. As a result, the magnetic flux passing through the coil aperture of the antenna coil makes a relatively large loop and links the inside and the outside of a coil conductor in an antenna in a communication partner with the antenna apparatus.Type: GrantFiled: July 1, 2014Date of Patent: June 23, 2015Assignee: Murata Manufacturing Co., LtdInventors: Noboru Kato, Katsumi Taniguchi, Jun Sasaki, Naoki Gouchi
-
Publication number: 20150171509Abstract: There is provided an antenna apparatus capable of stably communicating with a communication partner and increasing the maximum possible communication range even when the antenna apparatus is relatively smaller than an antenna in the communication partner and the two antennas are disposed in close proximity on the same axis. A magnetic flux passing through a coil aperture of an antenna coil passes through a conductor aperture of a conductive layer, but the magnetic flux does not pass through the conductive layer. Accordingly, the magnetic flux is diverted to a path in which the conductor aperture of the conductive layer is the inside and the outer edge of the conductive layer is the outside. As a result, the magnetic flux passing through the coil aperture of the antenna coil makes a relatively large loop and links the inside and the outside of a coil conductor in an antenna in a communication partner with the antenna apparatus.Type: ApplicationFiled: February 26, 2015Publication date: June 18, 2015Inventors: Noboru KATO, Katsumi TANIGUCHI, Jun SASAKI, Naoki GOUCHI
-
Patent number: 9047524Abstract: A high-frequency device includes an antenna coil, a variable capacitance element, and an RFIC. The variable capacitance element is configured by capacitor units in each of which a ferroelectric film is sandwiched between capacitor electrodes, and a capacitance value changes according to a control voltage applied between the capacitor electrodes. A control voltage application circuit configured by a plurality of resistance elements of different resistance values, and a resistance element of the variable capacitance element unit configured to apply a control voltage to the variable capacitance element are arranged in a layered manner above the capacitor unit. Thus, a variable capacitance element and a high-frequency device that includes a control voltage application circuit eliminating problems such as distortion due to active elements and growing IC size along with complication of circuit architecture, and ensuring reliability on impact due to falling or the like, are provided.Type: GrantFiled: April 18, 2014Date of Patent: June 2, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobuo Ikemoto, Toshiyuki Nakaiso, Katsumi Taniguchi, Naoki Gouchi, Naoto Ikeda
-
Publication number: 20150138030Abstract: An antenna device includes a first insulating base portion including a spiral antenna pattern, and a second insulating base portion including at least two conductor wires. An insulating layer configured to insulate the conductor wires from the antenna pattern is provided between a first end and a second end of the antenna pattern in a planar view. The insulating layer includes a cut or an opening allowing at least one of the first end and the second end of the antenna pattern to be exposed toward the conductor wires. Electrode portions of the conductor wires are electrically and mechanically connected to the first end and the second end, respectively, of the antenna pattern by a conductive material in the cut or the opening of the insulating layer. The second insulating base portion is more flexible than the first insulating base portion.Type: ApplicationFiled: January 26, 2015Publication date: May 21, 2015Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Kuniaki YOSUI, Naoki GOUCHI, Naoto IKEDA, Hiroyuki IRIKAWA
-
Patent number: 9026050Abstract: In a communication circuit, an RFIC includes an IO terminal and a control IC includes an IO terminal. A variable capacitance element includes control terminals, a capacitance element with a capacitance value that is determined according to a control voltage, and a resistance voltage divider circuit configured to generate the control voltage by dividing a voltage inputted to the control terminals. One of the RFIC and the control IC supplies control data to the variable capacitance element via a signal line. The variable capacitance element, along with an antenna coil, constitutes an antenna circuit of an LC parallel resonance circuit, and sets a resonant frequency of the antenna circuit to be a predetermined frequency.Type: GrantFiled: April 18, 2014Date of Patent: May 5, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Naoto Ikeda, Nobuo Ikemoto, Naoki Gouchi, Toshiyuki Nakaiso, Katsumi Taniguchi
-
Patent number: 9013882Abstract: A high-frequency module has a multilayer board formed by laminating a plurality of sheets made of a thermoplastic resin material and subjecting the laminated sheets to thermocompression bonding, and an IC chip placed in a cavity provided in the multilayer board. A gap is provided between a side of the IC chip and an inner wall of the cavity. The multilayer board includes a via-hole conductor provided near the inner wall of the cavity for preventing the resin sheets from being softened and flowing into the cavity upon thermocompression bonding.Type: GrantFiled: July 11, 2014Date of Patent: April 21, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Naoki Gouchi, Takahiro Baba