Abstract: A component-embedded substrate includes a multilayer body formed by stacking up a plurality of resin layers in a predetermined direction, a component embedded in the multilayer body, the component having a plurality of terminal electrodes, a plurality of joining conductors provided in the multilayer body and joined to the plurality of terminal electrodes, a plurality of wiring conductors provided in the multilayer body and electrically coupled to the plurality of joining conductors and at least one auxiliary member enclosed within an outer boundary of the component provided in the multilayer body. The auxiliary member may be electrically insulated from each of the plurality of wiring conductors and arranged to balance pressures acting on the plurality of terminal electrodes when pressure is applied on the multilayer body.

Abstract: A plurality of first linear sections in a coil conductor are disposed on a lower surface of a first resin sheet. A plurality of second linear sections in the coil conductor are disposed on an upper surface of a second resin sheet. A plurality of via conductors in the coil conductor are disposed in the resin sheets. The coil conductor including the linear sections and the via conductors constitutes an antenna section. A first ground conductor is disposed on the lower surface of a third resin sheet. A second ground conductor is disposed on the upper surface of a fourth resin sheet. The first ground conductor and the second ground conductor are connected to each other by a interlayer connection conductor including a plurality of via conductors. The interlayer connection conductor does not define a closed loop surrounding the coil conductor.

Abstract: There is provided an antenna apparatus capable of stably communicating with a communication partner and increasing the maximum possible communication range even when the antenna apparatus is relatively smaller than an antenna in the communication partner and the two antennas are disposed in close proximity on the same axis. A magnetic flux passing through a coil aperture of an antenna coil passes through a conductor aperture of a conductive layer, but the magnetic flux does not pass through the conductive layer. Accordingly, the magnetic flux is diverted to a path in which the conductor aperture of the conductive layer is the inside and the outer edge of the conductive layer is the outside. As a result, the magnetic flux passing through the coil aperture of the antenna coil makes a relatively large loop and links the inside and the outside of a coil conductor in an antenna in a communication partner with the antenna apparatus.

Abstract: A plurality of first linear sections in a coil conductor are disposed on a lower surface of a first resin sheet. A plurality of second linear sections in the coil conductor are disposed on an upper surface of a second resin sheet. A plurality of via conductors in the coil conductor are disposed in the resin sheets. The coil conductor including the linear sections and the via conductors constitutes an antenna section. A first ground conductor is disposed on the lower surface of a third resin sheet. A second ground conductor is disposed on the upper surface of a fourth resin sheet. The first ground conductor and the second ground conductor are connected to each other by a interlayer connection conductor including a plurality of via conductors. The interlayer connection conductor does not define a closed loop surrounding the coil conductor.

Abstract: A component-embedded substrate having a multilayer substrate formed by laminating a plurality of thermoplastic sheets in a predetermined direction, an internal component provided in the multilayer substrate, and a surface-mount component mounted on a surface of the multilayer substrate using bumps. The surface-mount component, when viewed in a plan view in the predetermined direction, is positioned so as to cross an outline of the internal component, with the bumps on the surface-mount component located 50 ?m or more from the outline of the internal component.

Abstract: An antenna device includes an antenna resonance circuit connected to a power supply circuit and a variable-frequency resonance element including a resonance circuit which is coupled with the antenna resonance circuit via an electromagnetic field. The resonant frequency of the resonance circuit is variable within a predetermined frequency band.

Abstract: In an antenna device, first linear portions of a coil conductor are located on a lower surface of a first resin sheet. Second linear portions of the coil conductor are located on an upper surface of a second resin sheet. Via conductors of the coil conductor are formed in the first and second resin sheets and intermediate resin sheets located between the first and second resin sheets. The via conductors connect a first end and a second end of the first linear portions and a first end and a second end of the second linear portions, respectively. The first and second linear portions and the via conductors define the coil conductor. Each of the intermediate resin sheets includes an aperture in the center portion thereof. The lamination of the apertures defines a cavity in which a magnetic substance core is embedded. The coil conductor is wound around a periphery of the cavity.

Abstract: An antenna for a wireless IC device having improved energy transfer efficiency with a wireless IC, and a wireless IC device equipped with the antenna are constructed such that the antenna includes a coil pattern and spiral coupling patterns provided at the ends of the coil pattern and disposed so as to face each other. A coupling module including a wireless IC chip and a feeder circuit substrate including a feeder circuit arranged to be coupled to the wireless IC chip is mounted on the coupling pattern so as to define a wireless IC device. The coil pattern is an open type coil pattern. The coupling patterns are arranged close to each other to define a single LC resonator. Thus, energy is concentrated in the coupling patterns, thereby improving the energy transfer efficiency between the antenna and the wireless IC chip.

Abstract: In a communication circuit, an RFIC includes an IO terminal and a control IC includes an IO terminal. A variable capacitance element includes control terminals, a capacitance element with a capacitance value that is determined according to a control voltage, and a resistance voltage divider circuit configured to generate the control voltage by dividing a voltage inputted to the control terminals. One of the RFIC and the control IC supplies control data to the variable capacitance element via a signal line. The variable capacitance element, along with an antenna coil, constitutes an antenna circuit of an LC parallel resonance circuit, and sets a resonant frequency of the antenna circuit to be a predetermined frequency.

Abstract: In a communication circuit, an RFIC includes an IO terminal and a control IC includes an IO terminal. A variable capacitance element includes control terminals, a capacitance element with a capacitance value that is determined according to a control voltage, and a resistance voltage divider circuit configured to generate the control voltage by dividing a voltage inputted to the control terminals. One of the RFIC and the control IC supplies control data to the variable capacitance element via a signal line. The variable capacitance element, along with an antenna coil, constitutes an antenna circuit of an LC parallel resonance circuit, and sets a resonant frequency of the antenna circuit to be a predetermined frequency.

Abstract: There is provided an antenna apparatus capable of stably communicating with a communication partner and increasing the maximum possible communication range even when the antenna apparatus is relatively smaller than an antenna in the communication partner and the two antennas are disposed in close proximity on the same axis. A magnetic flux passing through a coil aperture of an antenna coil passes through a conductor aperture of a conductive layer, but the magnetic flux does not pass through the conductive layer. Accordingly, the magnetic flux is diverted to a path in which the conductor aperture of the conductive layer is the inside and the outer edge of the conductive layer is the outside. As a result, the magnetic flux passing through the coil aperture of the antenna coil makes a relatively large loop and links the inside and the outside of a coil conductor in an antenna in a communication partner with the antenna apparatus.

Abstract: There is provided an antenna apparatus capable of stably communicating with a communication partner and increasing the maximum possible communication range even when the antenna apparatus is relatively smaller than an antenna in the communication partner and the two antennas are disposed in close proximity on the same axis. A magnetic flux passing through a coil aperture of an antenna coil passes through a conductor aperture of a conductive layer, but the magnetic flux does not pass through the conductive layer. Accordingly, the magnetic flux is diverted to a path in which the conductor aperture of the conductive layer is the inside and the outer edge of the conductive layer is the outside. As a result, the magnetic flux passing through the coil aperture of the antenna coil makes a relatively large loop and links the inside and the outside of a coil conductor in an antenna in a communication partner with the antenna apparatus.

Abstract: A high-frequency device includes an antenna coil, a variable capacitance element, and an RFIC. The variable capacitance element is configured by capacitor units in each of which a ferroelectric film is sandwiched between capacitor electrodes, and a capacitance value changes according to a control voltage applied between the capacitor electrodes. A control voltage application circuit configured by a plurality of resistance elements of different resistance values, and a resistance element of the variable capacitance element unit configured to apply a control voltage to the variable capacitance element are arranged in a layered manner above the capacitor unit. Thus, a variable capacitance element and a high-frequency device that includes a control voltage application circuit eliminating problems such as distortion due to active elements and growing IC size along with complication of circuit architecture, and ensuring reliability on impact due to falling or the like, are provided.

Abstract: An antenna device includes a first insulating base portion including a spiral antenna pattern, and a second insulating base portion including at least two conductor wires. An insulating layer configured to insulate the conductor wires from the antenna pattern is provided between a first end and a second end of the antenna pattern in a planar view. The insulating layer includes a cut or an opening allowing at least one of the first end and the second end of the antenna pattern to be exposed toward the conductor wires. Electrode portions of the conductor wires are electrically and mechanically connected to the first end and the second end, respectively, of the antenna pattern by a conductive material in the cut or the opening of the insulating layer. The second insulating base portion is more flexible than the first insulating base portion.

Abstract: In a communication circuit, an RFIC includes an IO terminal and a control IC includes an IO terminal. A variable capacitance element includes control terminals, a capacitance element with a capacitance value that is determined according to a control voltage, and a resistance voltage divider circuit configured to generate the control voltage by dividing a voltage inputted to the control terminals. One of the RFIC and the control IC supplies control data to the variable capacitance element via a signal line. The variable capacitance element, along with an antenna coil, constitutes an antenna circuit of an LC parallel resonance circuit, and sets a resonant frequency of the antenna circuit to be a predetermined frequency.

Abstract: A high-frequency module has a multilayer board formed by laminating a plurality of sheets made of a thermoplastic resin material and subjecting the laminated sheets to thermocompression bonding, and an IC chip placed in a cavity provided in the multilayer board. A gap is provided between a side of the IC chip and an inner wall of the cavity. The multilayer board includes a via-hole conductor provided near the inner wall of the cavity for preventing the resin sheets from being softened and flowing into the cavity upon thermocompression bonding.

Abstract: To prevent decrease of the bonding strength of an electronic component and a multilayer substrate, an electronic component-embedded module may include an electronic component having a plurality of pads and a multilayer substrate which includes a plurality of resin layers and a cavity for containing the electronic component. The multilayer substrate may include a first resin layer having a plurality of first pattern conductors and a space, and a second resin layer having a second pattern conductor and a plurality of third pattern conductors. The plurality of third pattern conductors may be in conduction with either of the first pattern conductors or the pads, with the second resin layer being placed over the first resin layer. The second pattern conductor may be arranged around a first pad with a gap, and the second resin layer is present between the second pattern conductor and at least one of the first pads.

Abstract: An antenna device includes a resin multilayer board in which a plurality of resin sheets are stacked, and a coil conductor provided in the resin multilayer board. A plurality of line portions of the coil conductor are provided on a lower surface of the resin sheet. When a magnetic material core is preliminarily pressure-bonded to the resin sheet, the magnetic material core is fractured along the line portions and cracks occur. Thus, the resin sheet with the magnetic material core in which the cracks have been formed is fully pressure-bonded together with the other resin sheets.

Abstract: There is provided an antenna apparatus. A magnetic flux passing through a coil aperture of an antenna coil passes through a conductor aperture of a conductive layer, but the magnetic flux does not pass through the conductive layer. Accordingly, the magnetic flux is diverted to a path in which the conductor aperture of the conductive layer is the inside and the outer edge of the conductive layer is the outside. As a result, the magnetic flux passing through the coil aperture of the antenna coil makes a relatively large loop and links the inside and the outside of a coil conductor in an antenna in a communication partner with the antenna apparatus.

Abstract: A component-embedded substrate includes a multilayer body formed by stacking up a plurality of resin layers in a predetermined direction, a component embedded in the multilayer body, the component having a plurality of terminal electrodes, a plurality of joining conductors provided in the multilayer body and joined to the plurality of terminal electrodes, a plurality of wiring conductors provided in the multilayer body and electrically coupled to the plurality of joining conductors and at least one auxiliary member enclosed within an outer boundary of the component provided in the multilayer body. The auxiliary member may be electrically insulated from each of the plurality of wiring conductors and arranged to balance pressures acting on the plurality of terminal electrodes when pressure is applied on the multilayer body.