Patents by Inventor Naoki HAYASAKA

Naoki HAYASAKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-frequency module
    Patent number: 8687378
    Abstract: A high-frequency module includes first and second switch IC elements and a substrate. The first and second switch IC elements are the same or substantially the same IC chips, and are mounted in the same or substantially the same orientation. The first switch IC element is mounted on the substrate. The second switch IC element is mounted above the first switch IC element. Due to wire bonding, the individual pad electrodes of the first and second switch IC elements are connected to the land electrodes of the substrate, which are to be connected to the individual pad electrodes. Between a pad electrode and a land electrode connected to each other, another land electrode is not provided.
    Type: Grant
    Filed: August 22, 2013
    Date of Patent: April 1, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Nobuyoshi Okuda, Masaaki Kanae, Naoki Hayasaka
  • HIGH-FREQUENCY MODULE
    Publication number: 20130335938
    Abstract: A high-frequency module includes first and second switch IC elements and a substrate. The first and second switch IC elements are the same or substantially the same IC chips, and are mounted in the same or substantially the same orientation. The first switch IC element is mounted on the substrate. The second switch IC element is mounted above the first switch IC element. Due to wire bonding, the individual pad electrodes of the first and second switch IC elements are connected to the land electrodes of the substrate, which are to be connected to the individual pad electrodes. Between a pad electrode and a land electrode connected to each other, another land electrode is not provided.
    Type: Application
    Filed: August 22, 2013
    Publication date: December 19, 2013
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Nobuyoshi OKUDA, Masaaki KANAE, Naoki HAYASAKA