Patents by Inventor Naoki Hirao
Naoki Hirao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230230530Abstract: Provided is a light emitting device in which a joint between panels is made less visible without unduly compromising practicality. The light emitting device includes an array of a plurality of unit panels each having a surface region divided into a plurality of pixels. Each of the plurality of the unit panels includes: a first pixel including at least one of pixels adjacent to an outer periphery of the unit panel, out of the plurality of the pixels; and a second pixel including at least one pixel other than the first pixel. The number of light sources provided for the first pixel is greater than the number of light sources provided for the second pixel.Type: ApplicationFiled: June 8, 2021Publication date: July 20, 2023Inventor: NAOKI HIRAO
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Patent number: 11335830Abstract: A photo-emission semiconductor device superior in reliability is provided. The photo-emission semiconductor device includes a semiconductor layer, a light reflection layer provided on the semiconductor layer, and a protective layer formed by electroless plating to cover the light reflection layer. Therefore, even if the whole structure is reduced in size, the protective layer reliably covers the light reflection layer without gap.Type: GrantFiled: August 17, 2017Date of Patent: May 17, 2022Assignee: Sony CorporationInventor: Naoki Hirao
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Patent number: 10490533Abstract: A light emitting apparatus including: one or a plurality of light emitting devices each having a plurality of electrodes and each emitting light from the upper surface of the light emitting device; a plurality of terminal electrodes provided on the lower side of the light emitting devices in a positional relation with the light emitting devices and electrically connected to the electrodes of the light emitting devices; a first metal line brought into contact with the upper surfaces of the light emitting devices and one of the terminal electrodes, provided at a location separated away from side surfaces of the light emitting devices and created in a film creation process; and an insulator in which the light emitting devices and the first metal line are embedded.Type: GrantFiled: March 22, 2019Date of Patent: November 26, 2019Assignee: SONY CORPORATIONInventors: Naoki Hirao, Katsuhiro Tomoda
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Patent number: 10424501Abstract: A method of manufacturing an electronic device includes: in transferring one or a plurality of element sections onto a first substrate from a second substrate, forming part or all of the one or the plurality of element sections on the second substrate with a resin layer in between; peeling off the one or the plurality of element sections that are formed on the second substrate from the second substrate through laser irradiation performed on the resin layer, and disposing, onto the first substrate, the one or the plurality of element sections peeled off; and using, as the resin layer, resin having glass-transition temperature and thermal decomposition temperature that differ from each other by 150 degrees centigrade or less.Type: GrantFiled: March 9, 2016Date of Patent: September 24, 2019Assignee: Sony Semiconductor Solutions CorporationInventor: Naoki Hirao
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Publication number: 20190221551Abstract: A light emitting apparatus including: one or a plurality of light emitting devices each having a plurality of electrodes and each emitting light from the upper surface of the light emitting device; a plurality of terminal electrodes provided on the lower side of the light emitting devices in a positional relation with the light emitting devices and electrically connected to the electrodes of the light emitting devices; a first metal line brought into contact with the upper surfaces of the light emitting devices and one of the terminal electrodes, provided at a location separated away from side surfaces of the light emitting devices and created in a film creation process; and an insulator in which the light emitting devices and the first metal line are embedded.Type: ApplicationFiled: March 22, 2019Publication date: July 18, 2019Applicant: Sony CorporationInventors: Naoki Hirao, Katsuhiro Tomoda
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Patent number: 10249600Abstract: A light emitting apparatus including: one or a plurality of light emitting devices each having a plurality of electrodes and each emitting light from the upper surface of the light emitting device; a plurality of terminal electrodes provided on the lower side of the light emitting devices in a positional relation with the light emitting devices and electrically connected to the electrodes of the light emitting devices; a first metal line brought into contact with the upper surfaces of the light emitting devices and one of the terminal electrodes, provided at a location separated away from side surfaces of the light emitting devices and created in a film creation process; and an insulator in which the light emitting devices and the first metal line are embedded.Type: GrantFiled: May 5, 2017Date of Patent: April 2, 2019Assignee: SONY CORPORATIONInventors: Naoki Hirao, Katsuhiro Tomoda
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Patent number: 9991422Abstract: A device includes: a substrate; and a functional element mounted, the functional element including electrodes. The substrate includes a support substrate, and includes a first seed metal, a second seed metal, and a resin component on the support substrate, the first seed metal being disposed in a section opposed to part or all of a first electrode among the electrodes, and being connected to the first electrode by plating, the second seed metal being disposed in a section opposed to part or all of a second electrode among the electrodes, and being connected to the second electrode by plating, and the resin component being disposed in a layer between the functional element and the support substrate, and fixing the functional element to the support substrate, and being, provided avoiding a neighborhood of an end of the functional element among, opposed side sections of the first and second seed metals.Type: GrantFiled: February 22, 2016Date of Patent: June 5, 2018Assignee: SONY CORPORATIONInventors: Katsuhiro Tomoda, Naoki Hirao, Izuho Hatada
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Publication number: 20180047608Abstract: A method of manufacturing an electronic device includes: in transferring one or a plurality of element sections onto a first substrate from a second substrate, forming part or all of the one or the plurality of element sections on the second substrate with a resin layer in between; peeling off the one or the plurality of element sections that are formed on the second substrate from the second substrate through laser irradiation performed on the resin layer, and disposing, onto the first substrate, the one or the plurality of element sections peeled off; and using, as the resin layer, resin having glass-transition temperature and thermal decomposition temperature that differ from each other by 150 degrees centigrade or less.Type: ApplicationFiled: March 9, 2016Publication date: February 15, 2018Applicant: Sony Semiconductor Solutions CorporationInventor: Naoki Hirao
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Publication number: 20170345973Abstract: A photo-emission semiconductor device superior in reliability is provided. The photo-emission semiconductor device includes a semiconductor layer, a light reflection layer provided on the semiconductor layer, and a protective layer formed by electroless plating to cover the light reflection layer. Therefore, even if the whole structure is reduced in size, the protective layer reliably covers the light reflection layer without gap.Type: ApplicationFiled: August 17, 2017Publication date: November 30, 2017Applicant: Sony CorporationInventor: Naoki Hirao
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Publication number: 20170236806Abstract: A light emitting apparatus including: one or a plurality of light emitting devices each having a plurality of electrodes and each emitting light from the upper surface of the light emitting device; a plurality of terminal electrodes provided on the lower side of the light emitting devices in a positional relation with the light emitting devices and electrically connected to the electrodes of the light emitting devices; a first metal line brought into contact with the upper surfaces of the light emitting devices and one of the terminal electrodes, provided at a location separated away from side surfaces of the light emitting devices and created in a film creation process; and an insulator in which the light emitting devices and the first metal line are embedded.Type: ApplicationFiled: May 5, 2017Publication date: August 17, 2017Inventors: Naoki Hirao, Katsuhiro Tomoda
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Patent number: 9679536Abstract: A light emitting apparatus including: one or a plurality of light emitting devices each having a plurality of electrodes and each emitting light from the upper surface of the light emitting device; a plurality of terminal electrodes provided on the lower side of the light emitting devices in a positional relation with the light emitting devices and electrically connected to the electrodes of the light emitting devices; a first metal line brought into contact with the upper surfaces of the light emitting devices and one of the terminal electrodes, provided at a location separated away from side surfaces of the light emitting devices and created in a film creation process; and an insulator in which the light emitting devices and the first metal line are embedded.Type: GrantFiled: May 18, 2015Date of Patent: June 13, 2017Assignee: SONY CORPORATIONInventors: Naoki Hirao, Katsuhiro Tomoda
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Publication number: 20160172347Abstract: A device includes: a substrate; and a functional element mounted, the functional element including electrodes. The substrate includes a support substrate, and includes a first seed metal, a second seed metal, and a resin component on the support substrate, the first seed metal being disposed in a section opposed to part or all of a first electrode among the electrodes, and being connected to the first electrode by plating, the second seed metal being disposed in a section opposed to part or all of a second electrode among the electrodes, and being connected to the second electrode by plating, and the resin component being disposed in a layer between the functional element and the support substrate, and fixing the functional element to the support substrate, and being, provided avoiding a neighborhood of an end of the functional element among, opposed side sections of the first and second seed metals.Type: ApplicationFiled: February 22, 2016Publication date: June 16, 2016Inventors: Katsuhiro TOMODA, Naoki Hirao, Izuho Hatada
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Patent number: 9312461Abstract: A light-emission element assembly includes: a light-emission element; a mold section in which the light-emission element is molded; a pad section protruding from an undersurface of the mold section, and electrically connected to the light-emission element; and a reinforcement section provided in the pad section, and projecting towards a side on which the mold section is provided.Type: GrantFiled: March 24, 2014Date of Patent: April 12, 2016Assignee: SONY CORPORATIONInventors: Naoki Hirao, Hiroyuki Hosono
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Patent number: 9293434Abstract: A device includes: a substrate; and a functional element mounted, the functional element including electrodes. The substrate includes a support substrate, and includes a first seed metal, a second seed metal, and a resin component on the support substrate, the first seed metal being disposed in a section opposed to part or all of a first electrode among the electrodes, and being connected to the first electrode by plating, the second seed metal being disposed in a section opposed to part or all of a second electrode among the electrodes, and being connected to the second electrode by plating, and the resin component being disposed in a layer between the functional element and the support substrate, and fixing the functional element to the support substrate, and being provided avoiding a neighborhood of an end of the functional element among opposed side sections of the first and second seed metals.Type: GrantFiled: June 27, 2013Date of Patent: March 22, 2016Inventors: Katsuhiro Tomoda, Naoki Hirao, Izuho Hatada
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Publication number: 20150255039Abstract: A light emitting apparatus including: one or a plurality of light emitting devices each having a plurality of electrodes and each emitting light from the upper surface of the light emitting device; a plurality of terminal electrodes provided on the lower side of the light emitting devices in a positional relation with the light emitting devices and electrically connected to the electrodes of the light emitting devices; a first metal line brought into contact with the upper surfaces of the light emitting devices and one of the terminal electrodes, provided at a location separated away from side surfaces of the light emitting devices and created in a film creation process; and an insulator in which the light emitting devices and the first metal line are embedded.Type: ApplicationFiled: May 18, 2015Publication date: September 10, 2015Inventors: Naoki Hirao, Katsuhiro Tomoda
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Patent number: 9065029Abstract: Disclosed herein is a light emitting apparatus including: one or a plurality of light emitting devices each having a plurality of electrodes and each emitting light from the upper surface of the light emitting device; a plurality of terminal electrodes provided on the lower side of the light emitting devices in a positional relation with the light emitting devices and electrically connected to the electrodes of the light emitting devices; a first metal line brought into contact with the upper surfaces of the light emitting devices and one of the terminal electrodes, provided at a location separated away from side surfaces of the light emitting devices and created in a film creation process; and an insulator in which the light emitting devices and the first metal line are embedded.Type: GrantFiled: January 30, 2012Date of Patent: June 23, 2015Assignee: SONY CORPORATIONInventors: Naoki Hirao, Katsuhiro Tomoda
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Patent number: 8928009Abstract: A light emitting device includes: one or plural light emitting elements having plural electrodes; a chip-like insulator surrounding the one or plural light emitting elements from a side surface side of the one or plural light emitting elements; and plural terminal electrodes electrically connected one-to-one with the plural electrodes, and having protrusions each protruding from a peripheral edge of the chip-like insulator.Type: GrantFiled: December 21, 2011Date of Patent: January 6, 2015Assignee: Sony CorporationInventors: Hiroyuki Okuyama, Katsuhiro Tomoda, Naoki Hirao
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Publication number: 20140284634Abstract: A light-emission element assembly includes: a light-emission element; a mold section in which the light-emission element is molded; a pad section protruding from an undersurface of the mold section, and electrically connected to the light-emission element; and a reinforcement section provided in the pad section, and projecting towards a side on which the mold section is provided.Type: ApplicationFiled: March 24, 2014Publication date: September 25, 2014Applicant: SONY CORPORATIONInventors: Naoki Hirao, Hiroyuki Hosono
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Patent number: 8686447Abstract: A light emitting unit including plural kinds of light emitting elements with different light emitting wavelengths, wherein, among the light emitting elements, at least one kind of light emitting element includes a semiconductor layer configured by laminating a first conductive layer, an active layer and a second conductive layer and having a side surface exposed by the first conductive layer, the active layer and the second conductive layer; a first electrode electrically connected to the first conductive layer; a second electrode electrically connected to the second conductive layer; a first insulation layer contacting at least an exposed surface of the active layer in the surface of the semiconductor layer; and a metal layer contacting at least a surface, which is opposite to the exposed surface of the active layer, in the surface of the first insulation layer, and electrically separated from the first electrode and the second electrode.Type: GrantFiled: February 22, 2012Date of Patent: April 1, 2014Assignee: Sony CorporationInventors: Katsuhiro Tomoda, Naoki Hirao, Goshi Biwa
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Publication number: 20140008691Abstract: A device includes: a substrate; and a functional element mounted, the functional element including electrodes. The substrate includes a support substrate, and includes a first seed metal, a second seed metal, and a resin component on the support substrate, the first seed metal being disposed in a section opposed to part or all of a first electrode among the electrodes, and being connected to the first electrode by plating, the second seed metal being disposed in a section opposed to part or all of a second electrode among the electrodes, and being connected to the second electrode by plating, and the resin component being disposed in a layer between the functional element and the support substrate, and fixing the functional element to the support substrate, and being provided avoiding a neighborhood of an end of the functional element among opposed side sections of the first and second seed metals.Type: ApplicationFiled: June 27, 2013Publication date: January 9, 2014Applicant: Sony CorporationInventors: Katsuhiro Tomoda, Naoki Hirao, Izuho Hatada