Patents by Inventor Naoki HORINOUCHI

Naoki HORINOUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220039675
    Abstract: A measurement device includes a light emitter, a light receiver, an amplifier, and a computation processor. The light emitter irradiates, with light, an irradiation target having an internal space through which a fluid flows. The light receiver receives coherent light including light scattered by the irradiation target and outputs a signal corresponding to intensity of the coherent light. The amplifier amplifies the signal output from the light receiver. The computation processor calculates a first frequency spectrum of signal strength for each frequency with respect to a temporal strength change in the signal amplified by the amplifier, and calculates a calculation value on a flow state of the fluid with a computation including division using a first value and a second value. The first value is a value of a frequency based on the first frequency spectrum. The second value is a value of strength based on the first frequency spectrum.
    Type: Application
    Filed: March 26, 2020
    Publication date: February 10, 2022
    Applicant: KYOCERA Corporation
    Inventors: Shougo MATSUNAGA, Keisuke TODA, Hiroshige ITOU, Naoki HORINOUCHI
  • Patent number: 9842971
    Abstract: There is provided an electronic component mounting substrate which excels in resistance to migration, and is thus capable of maintaining high thermal conductivity and insulation performance for a long period of time. An electronic component mounting substrate includes: a metallic substrate formed of aluminum or an aluminum-based alloy; an alumite layer disposed on the metallic substrate, having a network of crevices at an upper surface thereof; and a ceramic layer disposed on the alumite layer, part of the ceramic layer extending into the crevices.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: December 12, 2017
    Assignee: KYOCERA Corporation
    Inventors: Seiichirou Itou, Tetsuya Tojo, Takeshi Oyamada, Yoshitada Konishi, Naoki Horinouchi
  • Publication number: 20170207369
    Abstract: There is provided an electronic component mounting substrate which excels in resistance to migration, and is thus capable of maintaining high thermal conductivity and insulation performance for a long period of time. An electronic component mounting substrate includes: a metallic substrate formed of aluminum or an aluminum-based alloy; an alumite layer disposed on the metallic substrate, having a network of crevices at an upper surface thereof; and a ceramic layer disposed on the alumite layer, part of the ceramic layer extending into the crevices.
    Type: Application
    Filed: September 24, 2015
    Publication date: July 20, 2017
    Applicant: KYOCERA Corporation
    Inventors: Seiichirou ITOU, Tetsuya TOJO, Takeshi OYAMADA, Yoshitada KONISHI, Naoki HORINOUCHI