Patents by Inventor Naoki Ichimura

Naoki Ichimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11267990
    Abstract: A method for producing a flexible packaging film including a substrate and a polyurethane adhesive that is applied to the substrate and is a mixture of an A agent and a B agent includes a two-part separate application step that includes bringing a mixture of the A agent and B agent applied to one substrate into contact with a catalyst applied to another substrate and pressing the substrates, wherein the A agent is a polyisocyanate compound, and the B agent is a polyol compound. The polyol compound is preferably a polymer polyol comprising a polyether polyol or a polyester polyol as an essential component.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: March 8, 2022
    Assignee: DIC Corporation
    Inventors: Masahiko Ogawa, Shigekazu Takahashi, Choichi Takada, Naoki Ichimura
  • Publication number: 20210163788
    Abstract: A method for producing a flexible packaging film including a substrate and a polyurethane adhesive that is applied to the substrate and is a mixture of an A agent and a B agent includes a two-part separate application step that includes bringing a mixture of the A agent and B agent applied to one substrate into contact with a catalyst applied to another substrate and pressing the substrates, wherein the A agent is a polyisocyanate compound, and the B agent is a polyol compound. The polyol compound is preferably a polymer polyol comprising a polyether polyol or a polyester polyol as an essential component.
    Type: Application
    Filed: August 29, 2017
    Publication date: June 3, 2021
    Applicants: DIC Corporation, DIC Corporation
    Inventors: Masahiko Ogawa, Shigekazu Takahashi, Choichi Takada, Naoki Ichimura