Abstract: A semiconductor device includes a high-side IC controlling on/off of an upper arm; and a low-side IC controlling on/off of a lower arm, wherein the low-side IC includes: a first ground terminal connected via a shunt resistor to a main terminal of the lower arm; a first power supply terminal receiving a first power supply based on the first ground terminal; a second ground terminal connected to a connection point between the main terminal and the shunt resistor; a second power supply terminal receiving a second power supply based on the second ground terminal; an input side circuit receiving power from the first power supply terminal; and an output side circuit applying a voltage of the second power supply terminal to a gate terminal of the lower arm; and the second power supply is generated by supplying a current from the first power supply terminal through a diode.

Abstract: A semiconductor module includes: a lead frame; a semiconductor element mounted to the lead frame; a first wire connected to the semiconductor element or the lead frame and contributing to an operation of the semiconductor element; a second wire connected the lead frame and not contributing to an operation of the semiconductor element; and sealing resin sealing a part of the lead frame, the semiconductor element, the first wire, and the second wire. The second wire has a smaller diameter or elastic coefficient than the first wire.

Abstract: A semiconductor device includes: a rectangular RC-IGBT; an IC chip electrically connected to the RC-IGBT; a plurality of control terminals electrically connected to the IC chip; a plurality of power terminals electrically connected to the RC-IGBT; and a rectangular sealing resin covering the RC-IGBT and the IC chip. The RC-IGBT has an aspect ratio of 1.62 or more, the sealing resin has a lengthwise length of 44 mm or smaller, and the semiconductor device has a rated current of 25 A or more.

Abstract: An analysis system includes: a terminal that comprises a terminal controller; and a server that comprises a server controller and a communication interface, the terminal controller acquiring original data, converting the original data into a plurality of pieces of small data each having a size smaller than a size of each piece of the original data and into certainty factors of respective pieces of the small data, and transmitting the small data to the server, and the server controller receiving the small data from the terminal via the communication interface, executing analysis using the small data, and outputting an analysis result of the analysis.

Abstract: A semiconductor device includes: semiconductor elements; a package sealing the semiconductor elements and being rectangular in a top view; control terminals protruding from a first side of the package; output terminals protruding from a second side facing the first side of the package; and a recessed portion formed in a third side adjacent to the first side and the second side of the package, wherein a part of the control terminals is disposed at end portions of lead frames, the semiconductor device further includes dummy terminals disposed at other end portions of the lead frames, respectively, the dummy terminals protruding from the recessed portion, and an amount of the protrusion of each of the dummy terminals from the recessed portion is smaller than or equal to 0.75 mm.

Abstract: A semiconductor device includes: a semiconductor element; a mold member covering the semiconductor element; and a first terminal and a second terminal electrically connected to the semiconductor element, protruding from one side of the mold member, and alternating along the one side. The first terminal includes a first bend, and the second terminal includes: a second bend located further from the one side of the mold member than the first bend, and having the same width as the first bend in plan view.

Abstract: The plurality of control terminals are drawn out from the first side surface of the sealing resin. The plurality of main terminals are drawn out from the second side surface of the sealing resin. Each of the main terminals includes, in the sealing resin, a bonding section wire-connected to one of the semiconductor chips, a heat transfer section adjacent to the bonding section, and a mounting section on which the other one of the semiconductor chips is mounted. A concave section is provided on the second side surface between the main terminals adjacent to each other. A side surface of the heat transfer section is opposed to the concave section. A side surface of the bonding section is not opposed to the concave section.

Abstract: An analysis system includes: a terminal that comprises a terminal controller; and a server that comprises a server controller and a communication interface, the terminal controller acquiring original data, converting the original data into a plurality of pieces of small data each having a size smaller than a size of each piece of the original data and into certainty factors of respective pieces of the small data, and transmitting the small data to the server, and the server controller receiving the small data from the terminal via the communication interface, executing analysis using the small data, and outputting an analysis result of the analysis.

Abstract: A semiconductor device includes: semiconductor elements; a package sealing the semiconductor elements and being rectangular in a top view; control terminals protruding from a first side of the package; output terminals protruding from a second side facing the first side of the package; and a recessed portion formed in a third side adjacent to the first side and the second side of the package, wherein a part of the control terminals is disposed at end portions of lead frames, the semiconductor device further includes dummy terminals disposed at other end portions of the lead frames, respectively, the dummy terminals protruding from the recessed portion, and an amount of the protrusion of each of the dummy terminals from the recessed portion is smaller than or equal to 0.75 mm.

Abstract: A semiconductor device includes: a rectangular RC-IGBT; an IC chip electrically connected to the RC-IGBT; a plurality of control terminals electrically connected to the IC chip; a plurality of power terminals electrically connected to the RC-IGBT; and a rectangular sealing resin covering the RC-IGBT and the IC chip. The RC-IGBT has an aspect ratio of 1.62 or more, the sealing resin has a lengthwise length of 44 mm or smaller, and the semiconductor device has a rated current of 25 A or more.

Abstract: A drive circuit includes a second drive circuit that drives a semiconductor switching element in a case where a pulse width of a corresponding signal is determined to be larger than a second threshold, and a timing adjustment circuit that adjusts a timing at which the second drive circuit cooperates with a first drive circuit to drive the semiconductor switching element during a turn-off period of the semiconductor switching element due to drive of the first drive circuit.

Abstract: A drive circuit includes a second drive circuit that drives a semiconductor switching element in a case where a pulse width of a corresponding signal is determined to be larger than a second threshold, and a timing adjustment circuit that adjusts a timing at which the second drive circuit cooperates with a first drive circuit to drive the semiconductor switching element during a turn-off period of the semiconductor switching element due to drive of the first drive circuit.

Abstract: The present invention is to provide a small-sized dryness/wetness responsive sensor that detects a galvanic current with a high sensitivity as a principle of operation. According to one embodiment of the present invention, a dryness/wetness responsive sensor comprises a thin wire made of a first metal and a thin wire made of a second metal, the second metal is different from the first metal, the thin wire of the first metal and the thin wire of the second metal are disposed in juxtaposition with each other on an insulating substrate, and a surface state of a part between the thin wire of the first metal and the thin wire of the second metal is hydrophilic or hydrophobic.

Abstract: A posture estimation device includes: a processor that: obtains detected information indicating a feature of a subject, wherein the feature is detected based on an image that is captured by an imager from a position where the subject is viewed from above, calculates a feature amount based on the obtained detected information, updates, based on a geometric relationship between the imager and the subject, a model parameter for estimating a posture of the subject by machine learning using the calculated feature amount in a time series, and estimates the posture of the subject using the updated model parameter.

Abstract: The present invention is to provide a small-sized dryness/wetness responsive sensor that detects a galvanic current with a high sensitivity as a principle of operation. According to one embodiment of the present invention, a dryness/wetness responsive sensor comprises a thin wire made of a first metal and a thin wire made of a second metal, the second metal is different from the first metal, the thin wire of the first metal and the thin wire of the second metal are disposed in juxtaposition with each other on an insulating substrate, and a surface state of a part between the thin wire of the first metal and the thin wire of the second metal is hydrophilic or hydrophobic.

Abstract: A posture estimation device includes: a processor that: obtains detected information indicating a feature of a subject, wherein the feature is detected based on an image that is captured by an imager from a position where the subject is viewed from above, calculates a feature amount based on the obtained detected information, updates, based on a geometric relationship between the imager and the subject, a model parameter for estimating a posture of the subject by machine learning using the calculated feature amount in a time series, and estimates the posture of the subject using the updated model parameter.

Abstract: A terminal device according to the present invention includes an application and a browser. The application includes a providing unit that provides the browser that is instructed by the application to perform a predetermined process with terminal information that is used to identify a terminal device and that is acquired by the application. The browser includes a sending unit that sends terminal information that is provided by the providing unit in the application and cookie information that is associated with a predetermined server device to the predetermined server device.

Abstract: A power module includes one control IC and a plurality of reverse conducting insulated gate bipolar transistors (RC-IGBTs). The control IC has the functions of a high-voltage IC and a low-voltage IC. The plurality of RC-IGBTs are disposed on three of four sides of the control IC and connected to the control IC through only wires.

Abstract: A power module includes one control IC and a plurality of reverse conducting insulated gate bipolar transistors (RC-IGBTs). The control IC has the functions of a high-voltage IC and a low-voltage IC. The plurality of RC-IGBTs are disposed on three of four sides of the control IC and connected to the control IC through only wires.

Abstract: A power module includes one control IC and a plurality of reverse conducting insulated gate bipolar transistors (RC-IGBTs). The control IC has the functions of a high-voltage IC and a low-voltage IC. The plurality of RC-IGBTs are disposed on three of four sides of the control IC and connected to the control IC through only wires.