Patents by Inventor Naoki Ikeuchi
Naoki Ikeuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8141426Abstract: A displacement measurement apparatus for a microstructure according to the present invention measures a displacement of the microstructure having a fixed portion electrode including a first electrode and a second electrode and a movable portion electrode located oppositely to the fixed portion electrode. A bias generating circuit applies a bias signal to between the first electrode and the movable portion electrode so that influence of a noise signal on a detection signal picked up from between the second electrode and the movable portion electrode may be reduced. A C/V converting circuit converts a capacitance change that is picked up from between the second electrode and the movable portion electrode into a voltage. A detecting circuit detects a displacement of the movable portion electrode based on the voltage.Type: GrantFiled: December 5, 2008Date of Patent: March 27, 2012Assignee: Tokyo Electron LimitedInventors: Naoki Ikeuchi, Hisashi Fujiwara, Masami Yakabe, Masato Hayashi
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Patent number: 8082124Abstract: Provided are a data obtaining section (21) that obtains a time-series data fluctuating in accordance with the plasma conditions, a translation error calculation section (24) that calculates a determinism providing an indicator of whether the time-series data in the plasma are deterministic or stochastic, from the time-series data that have been obtained in the data obtaining unit (21), and an abnormal discharge determination section (26) that determines that the plasma is under the abnormal discharge conditions, in the case that the value representing the determinism calculated in the determinism derivation unit is less than or equal to a given threshold value, during the plasma generation. Examples of the value representing the determinism include translation error or permutation entropy. In the case the permutation entropy is used as a value representing the determinism, a permutation entropy calculation section is provided.Type: GrantFiled: July 2, 2007Date of Patent: December 20, 2011Assignees: Ritsumeikan University, Tokyo Electron Ltd.Inventors: Takaya Miyano, Toshiyuki Matsumoto, Naoki Ikeuchi, Tsuyoshi Moriya
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Publication number: 20100161278Abstract: Provided are a data obtaining section (21) that obtains a time-series data fluctuating in accordance with the plasma conditions, a translation error calculation section (24) that calculates a determinism providing an indicator of whether the time-series data in the plasma are deterministic or stochastic, from the time-series data that have been obtained in the data obtaining unit (21), and an abnormal discharge determination section (26) that determines that the plasma is under the abnormal discharge conditions, in the case that the value representing the determinism calculated in the determinism derivation unit is less than or equal to a given threshold value, during the plasma generation. Examples of the value representing the determinism include translation error or permutation entropy. In the case the permutation entropy is used as a value representing the determinism, a permutation entropy calculation section is provided.Type: ApplicationFiled: July 2, 2007Publication date: June 24, 2010Inventors: Takaya Miyano, Toshiyuki Matsumoto, Naoki Ikeuchi, Tsuyoshi Moriya
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Patent number: 7726190Abstract: A speaker unit has a plurality of sound sources each outputting a sound wave. The compressional, sound wave output from the speaker unit arrives, or vibrates air, which moves a movable part of a three-axis acceleration sensor, or a microstructure of a chip to be tested TP. As the movable part thus moves, a value in resistance accordingly varies, and such variation is measured as based on an output voltage provided via a probe. A control unit determines a property of the three-axis acceleration sensor from a value in property as measured or measurement data. Furthermore, the plurality of sound sources can be spaced by a pitch of a predetermined value set as based on their difference in the distance to the movable part of the three-axis acceleration sensor and the wavelength of the test wave to apply a composite test wave to the movable part such that the composite sound wave's composite sound field is maximized.Type: GrantFiled: March 2, 2006Date of Patent: June 1, 2010Assignee: Tokyo Electron LimitedInventors: Toshiyuki Matsumoto, Naoki Ikeuchi, Masami Yakabe, Keiichi Enjoji, Masato Hayashi
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Publication number: 20090145230Abstract: A displacement measurement apparatus for a microstructure according to the present invention measures a displacement of the microstructure having a fixed portion electrode including a first electrode and a second electrode and a movable portion electrode located oppositely to the fixed portion electrode. A bias generating circuit applies a bias signal to between the first electrode and the movable portion electrode so that influence of a noise signal on a detection signal picked up from between the second electrode and the movable portion electrode may be reduced. A C/V converting circuit converts a capacitance change that is picked up from between the second electrode and the movable portion electrode into a voltage. A detecting circuit detects a displacement of the movable portion electrode based on the voltage.Type: ApplicationFiled: December 5, 2008Publication date: June 11, 2009Applicant: TOKYO ELECTRON LIMITEDInventors: Naoki Ikeuchi, Hisashi Fujiwara, Masami Yakabe, Masato Hayashi
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Publication number: 20090140612Abstract: A sensor body 1 having a plurality of resonator beams 5 each resonating with a different specific frequency and a plate-like diaphragm 2 connected to the resonator beams and vibrating in response to sound waves is supported by a supporter 11. A cap 12 for acoustically separating one of the surfaces of the diaphragm 2 from the other surface is placed on the sensor body 1 to make the pressure difference between the sound pressure applied on one of the surfaces of the diaphragm 2 and the sound pressure applied on the other surface large in order to improve sensitivity.Type: ApplicationFiled: July 5, 2006Publication date: June 4, 2009Inventor: Naoki Ikeuchi
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Publication number: 20090128171Abstract: An inspecting method which is for a microstructure with a movable portion and executes a highly precise inspection without damaging a probe or an inspection electrode by supressing the effect of a needle pressure in contacting the probe to the inspection electrode is provided. When inspection on a microstructure is performed, first a pair of probes (2) are caused to contact respective electrode pads (PD), and the pair of probes (2) and a fritting power source (50) are connected together through relays (30). Next a voltage is applied from the fritting power source (50) to one probe (2) in the pair of probes (2). As the voltage is gradually increased, an oxide film between the pair of probes (2) is destroyed and a current flows between the pair of probes (2) by fritting phenomenon, and the probes (2) and the electrode pad (PD) are electrically conducted each other.Type: ApplicationFiled: March 30, 2006Publication date: May 21, 2009Inventors: Katsuya Okumura, Masami Yakabe, Naoki Ikeuchi
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Publication number: 20090039908Abstract: A microstructure inspecting apparatus for evaluating a characteristic of at least one microstructure having a movable section formed on a substrate, includes: a probe, which electrically connects with pads formed on the microstructure, for obtaining an electric signal of the microstructure; a plurality of nozzles, positioned in the vicinity of the movable section of the microstructure, for discharging or sucking a gas; a nozzle flow rate controller for controlling a flow rate of the gas discharged from or sucked into the plurality of nozzles; and an evaluation unit for detecting a displacement of the movable section of the microstructure by using the electric signal obtained through the probe, wherein the displacement is made by the gas discharged from or sucked into the plurality of nozzles, and evaluating the characteristic of the microstructure based on the detected result.Type: ApplicationFiled: April 12, 2006Publication date: February 12, 2009Applicant: TOKYO ELECTRON LIMITEDInventors: Naoki Ikeuchi, Masami Yakabe, Akiko Kamigori
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Publication number: 20080302185Abstract: Voltage is applied to a chip TP by a voltage drive unit 30 through a probe needle P to move a movable part of a microstructure. A sound produced in response to motion of the movable part of the microstructure is detected by a microphone 3. Then, the sound detected by the microphone 3 is measured by a measurement unit 25. The control unit 20 evaluates the characteristics of the tested chip TP by comparing with a sound detected from an ideal chip TP.Type: ApplicationFiled: September 9, 2005Publication date: December 11, 2008Inventors: Masami Yakabe, Toshiyuki Matsumoto, Naoki Ikeuchi, Katsuya Okumura
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Patent number: 7428841Abstract: In an acceleration sensor detecting inclined displacement of a predetermined article from a basic position, the acceleration sensor (10) includes a sensor chip having a detection plane including one detection axis or two crossing detection axes detecting the inclined displacement. An axis orthogonal to the detection plane of the sensor chip is disposed in parallel with a standard plane of the article in the basic position. Then, the sensor chip obtains an output signal according to the inclined displacement of the standard plane.Type: GrantFiled: February 10, 2004Date of Patent: September 30, 2008Assignee: Tokyo Electron LimitedInventors: Muneo Harada, Naoki Ikeuchi, Hiroyuki Hashimoto
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Publication number: 20080223136Abstract: There are provided an inspection device, an inspection method, and an inspection program for accurately inspecting a minute structure having a movable portion by using a simple method. A test sound wave is inputted and frequency characteristic of a sensor output voltage amplitude responding to the input of the test sound wave is analyzed. The maximum frequency and the minimum frequency of the device is calculated from estimated use conditions and it is judged whether it is possible to detect a desired characteristic in the frequency band. More specifically, the device is judged to be good or bad depending whether the response characteristic in a predetermined frequency band exceeds the minimum characteristic level as a threshold value.Type: ApplicationFiled: February 4, 2008Publication date: September 18, 2008Applicant: TOKYO ELECTRON LIMITEDInventors: Masami Yakabe, Naoki Ikeuchi
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Publication number: 20080190206Abstract: A speaker unit has a plurality of sound sources each outputting a sound wave. The compressional, sound wave output from the speaker unit arrives, or vibrates air, which moves a movable part of a three-axis acceleration sensor, or a microstructure of a chip to be tested TP. As the movable part thus moves, a value in resistance accordingly varies, and such variation is measured as based on an output voltage provided via a probe. A control unit determines a property of the three-axis acceleration sensor from a value in property as measured or measurement data. Furthermore, the plurality of sound sources can be spaced by a pitch of a predetermined value set as based on their difference in the distance to the movable part of the three-axis acceleration sensor and the wavelength of the test wave to apply a composite test wave to the movable part such that the composite sound wave's composite sound field is maximized.Type: ApplicationFiled: March 2, 2006Publication date: August 14, 2008Applicant: Tokyo Electron LimitedInventors: Toshiyuki Matsumoto, Naoki Ikeuchi, Masami Yakabe, Keiichi Enjoji, Masato Hayashi
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Patent number: 7383732Abstract: Test sound wave is outputted from a speaker. A movable part of a three-axis acceleration sensor, which is a micro structure of a chip to be tested TP, moves due to the arrival of the test sound wave which is compression wave outputted from the speaker, that is, due to air vibrations. A change in the resistance value that changes in accordance with this movement is measured on the basis of an output voltage that is provided via a probe needles. A control part determines the property of the three-axis acceleration sensor on the basis of the measured property values, that is, measured data.Type: GrantFiled: June 10, 2005Date of Patent: June 10, 2008Assignees: Octec Inc., Tokyo Electron LimitedInventors: Katsuya Okumura, Toshiyuki Matsumoto, Naoki Ikeuchi, Masami Yakabe
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Patent number: 7348788Abstract: A probing card and an inspection apparatus which precisely inspect a microstructure having a minute moving section by a simple method are provided. A probing card (6) has a speaker (2), and a circuit substrate (100) which fixes a probe (4), and the speaker (2) is disposed on the circuit substrate (100). The circuit substrate (100) is provided with an aperture region. As the speaker (2) is disposed on that region, a test sound wave is output to the moving section of the microstructure. The probe (4) detects a change in an electrical characteristic caused by the motion of the moving section according to the test sound wave, thereby inspecting the characteristic of the microstructure.Type: GrantFiled: March 31, 2006Date of Patent: March 25, 2008Assignee: Tokyo Electron LimitedInventors: Masami Yakabe, Naoki Ikeuchi
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Publication number: 20070262306Abstract: A semiconductor device having a microstructure and a method of manufacturing a microstructure are provided, suppressing any change of characteristics in a wafer state caused in an assembly step. Specifically, a wafer where a plurality of microstructure chips are formed and a dummy wafer are attached to each other using an adhesive layer. As to an MEMS device, a cut dummy wafer is used as a mount for a chip and the dummy wafer and a housing member are attached to each other. Thus, the dummy wafer absorbs any stress or the like applied from below when the housing member is used for packaging.Type: ApplicationFiled: July 17, 2007Publication date: November 15, 2007Inventors: Naoki Ikeuchi, Hiroyuki Hashimoto
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Publication number: 20070257692Abstract: A probe, wherein a beam 3 is cantilevered by a supporter 2 with a predetermined space from a probe substrate 1, and a contact 4 extending in a direction away from the probe substrate 1 is attached to the beam 3. A projection 5 extending toward the probe substrate 1 is formed on the beam 3. Since the projection 5 is brought into contact with the probe substrate 1 when a load is applied to the probe substrate 1, stress imposed on the beam 3 can be dispersed.Type: ApplicationFiled: October 31, 2005Publication date: November 8, 2007Inventors: Masami Yakabe, Tomohisa Hoshino, Naoki Ikeuchi
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Publication number: 20070069746Abstract: A probing card and an inspection apparatus which precisely inspect a microstructure having a minute moving section by a simple method are provided. A probing card (6) has a speaker (2), and a circuit substrate (100) which fixes a probe (4), and the speaker (2) is disposed on the circuit substrate (100). The circuit substrate (100) is provided with an aperture region. As the speaker (2) is disposed on that region, a test sound wave is output to the moving section of the microstructure. The probe (4) detects a change in an electrical characteristic caused by the motion of the moving section according to the test sound wave, thereby inspecting the characteristic of the microstructure.Type: ApplicationFiled: March 31, 2006Publication date: March 29, 2007Inventors: Masami Yakabe, Naoki Ikeuchi
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Publication number: 20060162450Abstract: In an acceleration sensor detecting inclined displacement of a predetermined article from a basic position, the acceleration sensor (10) includes a sensor chip having a detection plane including one detection axis or two crossing detection axes detecting the inclined displacement. An axis orthogonal to the detection plane of the sensor chip is disposed in parallel with a standard plane of the article in the basic position. Then, the sensor chip obtains an output signal according to the inclined displacement of the standard plane.Type: ApplicationFiled: February 10, 2004Publication date: July 27, 2006Inventors: Muneo Harada, Naoki Ikeuchi, Hiroyuki Hashimoto
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Patent number: 7034551Abstract: An electrostatic capacitance detection circuit 10 comprises an AC voltage generator 11, a first operational amplifier 14 of which non-inverting input terminal is connected to specific potential (a ground in this example), a second operational amplifier 16 that includes a voltage follower, a resistance (R1) 12 connected between the AC voltage generator 11 and an inverting input terminal of the first operational amplifier 14, a resistance (R2) 13 connected between the inverting input terminal of the first operational amplifier 14 and an output terminal of the second operational amplifier 16, and an impedance element (a capacitor) 15 connected between an output terminal of the first operational amplifier 14 and a non-inverting input terminal of the second operational amplifier 16, and a capacitor to be detected 17 is connected between the non-inverting input terminal of the second operational amplifier 16 and specific potential.Type: GrantFiled: September 6, 2002Date of Patent: April 25, 2006Assignee: Tokyo Electron LimitedInventors: Masami Yakabe, Naoki Ikeuchi
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Patent number: 7023223Abstract: An electrostatic capacitance detection circuit 10 comprises an AC voltage generator 11, an operational amplifier 14 of which non-inverting input terminal is connected to specific potential (a ground in this example), an impedance converter 16, a resistance (R1) 12 connected between the AC voltage generator 11 and an inverting input terminal of the operational amplifier 14, a resistance (R2) 13 connected between the inverting input terminal of the operational amplifier 14 and an output terminal of the impedance converter 16, and an impedance element (a capacitor) 15 connected between an output terminal of the operational amplifier 14 and an input terminal of the impedance converter 16. A capacitor to be detected 17 is connected between the input terminal of the impedance converter 16 and the specific potential.Type: GrantFiled: September 6, 2002Date of Patent: April 4, 2006Assignee: Tokyo Electron LimitedInventors: Masami Yakabe, Naoki Ikeuchi, Toshiyuki Matsumoto, Koichi Nakano