Patents by Inventor Naoki Ise

Naoki Ise has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sputtering target-backing plate assembly
    Patent number: 11538673
    Abstract: A sputtering target-backing plate assembly obtained by bonding a sputtering target and a backing plate using a brazing material, wherein a braze bonding layer which bonds the sputtering target and the backing plate contains a material having thermal conductivity that is higher than that of the brazing material in an amount of 5 vol % or more and 50 vol % or less, and a thickness of the braze bonding layer is 100 ?m or more and 700 ?m or less. An object is to prevent the seepage of the brazing material while maintaining the thickness of the braze bonding layer.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: December 27, 2022
    Assignee: JX NIPPON MINING & METALS CORPORATION
    Inventors: Ryosuke Sakashita, Yosuke Endo, Naoki Ise, Hiroshi Takamura
  • SPUTTERING TARGET-BACKING PLATE ASSEMBLY
    Publication number: 20200258724
    Abstract: A sputtering target-backing plate assembly obtained by bonding a sputtering target and a backing plate using a brazing material, wherein a braze bonding layer which bonds the sputtering target and the backing plate contains a material having thermal conductivity that is higher than that of the brazing material in an amount of 5 vol % or more and 50 vol % or less, and a thickness of the braze bonding layer is 100 ?m or more and 700 ?m or less. An object is to prevent the seepage of the brazing material while maintaining the thickness of the braze bonding layer.
    Type: Application
    Filed: January 28, 2020
    Publication date: August 13, 2020
    Inventors: Ryosuke Sakashita, Yosuke Endo, Naoki Ise, Hiroshi Takamura