Patents by Inventor Naoki JYO
Naoki JYO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11848346Abstract: An imaging device includes a first semiconductor element including at least one bump pad that has a concave shape. The at least one bump pad includes a first metal layer and a second metal layer on the first metal layer. The imaging device includes a second semiconductor element including at least one electrode. The imaging device includes a microbump electrically connecting the at least one bump pad to the at least one electrode. The microbump includes a diffused portion of the second metal layer, and first semiconductor element or the second semiconductor element includes a pixel unit.Type: GrantFiled: January 29, 2021Date of Patent: December 19, 2023Assignee: Sony Semiconductor Solutions CorporationInventors: Satoru Wakiyama, Kan Shimizu, Toshihiko Hayashi, Takuya Nakamura, Naoki Jyo
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Publication number: 20230005979Abstract: There is provided semiconductor devices and methods of forming the same, the semiconductor devices including: a first semiconductor element having a first electrode; a second semiconductor element having a second electrode; a Sn-based micro-solder bump formed on the second electrode; and a concave bump pad including the first electrode opposite to the micro-solder bump, where the first electrode is connected to the second electrode via the micro-solder bump and the concave bump pad.Type: ApplicationFiled: September 7, 2022Publication date: January 5, 2023Applicant: SONY GROUP CORPORATIONInventors: Satoru WAKIYAMA, Naoki JYO, Kan SHIMIZU, Toshihiko HAYASHI, Takuya NAKAMURA
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Patent number: 11476291Abstract: There is provided semiconductor devices and methods of forming the same, the semiconductor devices including: a first semiconductor element having a first electrode; a second semiconductor element having a second electrode; a Sn-based micro-solder bump formed on the second electrode; and a concave bump pad including the first electrode opposite to the micro-solder bump, where the first electrode is connected to the second electrode via the micro-solder bump and the concave bump pad.Type: GrantFiled: July 3, 2019Date of Patent: October 18, 2022Assignee: SONY CORPORATIONInventors: Satoru Wakiyama, Naoki Jyo, Kan Shimizu, Toshihiko Hayashi, Takuya Nakamura
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Publication number: 20210233946Abstract: The present technology relates to a semiconductor device, a solid-state image pickup element, an imaging device, and an electronic apparatus that can suppress characteristic fluctuations caused by capacitance fluctuations due to a dummy wire, while maintaining an affixing bonding strength by the dummy wire. Two or more chips in which wires that are electrically connected are formed on bonding surfaces and the bonding surfaces opposing each other are bonded to be laminated are included and, with respect to a region where the wires are periodically and repeatedly disposed in sharing units each made up of a plurality of pixels sharing the same floating diffusion contact, a dummy wire is disposed at the center position thereof on the bonding surface at a pitch of the sharing unit. The present technology can be applied to a CMOS image sensor.Type: ApplicationFiled: April 13, 2021Publication date: July 29, 2021Applicant: SONY GROUP CORPORATIONInventors: Rena SUZUKI, Takeshi MATSUNUMA, Naoki JYO, Yoshihisa KAGAWA
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Publication number: 20210225921Abstract: An imaging device includes a first semiconductor element including at least one bump pad that has a concave shape. The at least one bump pad includes a first metal layer and a second metal layer on the first metal layer. The imaging device includes a second semiconductor element including at least one electrode. The imaging device includes a microbump electrically connecting the at least one bump pad to the at least one electrode. The microbump includes a diffused portion of the second metal layer, and first semiconductor element or the second semiconductor element includes a pixel unit.Type: ApplicationFiled: January 29, 2021Publication date: July 22, 2021Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Satoru WAKIYAMA, Kan SHIMIZU, Toshihiko HAYASHI, Takuya NAKAMURA, Naoki JYO
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Patent number: 11004879Abstract: The present technology relates to a semiconductor device, a solid-state image pickup element, an imaging device, and an electronic apparatus that can suppress characteristic fluctuations caused by capacitance fluctuations due to a dummy wire, while maintaining an affixing bonding strength by the dummy wire. Two or more chips in which wires that are electrically connected are formed on bonding surfaces and the bonding surfaces opposing each other are bonded to be laminated are included and, with respect to a region where the wires are periodically and repeatedly disposed in sharing units each made up of a plurality of pixels sharing the same floating diffusion contact, a dummy wire is disposed at the center position thereof on the bonding surface at a pitch of the sharing unit. The present technology can be applied to a CMOS image sensor.Type: GrantFiled: February 19, 2020Date of Patent: May 11, 2021Assignee: SONY CORPORATIONInventors: Rena Suzuki, Takeshi Matsunuma, Naoki Jyo, Yoshihisa Kagawa
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Patent number: 10930695Abstract: An imaging device includes a first semiconductor element including at least one bump pad that has a concave shape. The at least one bump pad includes a first metal layer and a second metal layer on the first metal layer. The imaging device includes a second semiconductor element including at least one electrode. The imaging device includes a microbump electrically connecting the at least one bump pad to the at least one electrode. The microbump includes a diffused portion of the second metal layer, and first semiconductor element or the second semiconductor element includes a pixel unit.Type: GrantFiled: October 7, 2016Date of Patent: February 23, 2021Assignee: Sony Semiconductor Solutions CorporationInventors: Satoru Wakiyama, Kan Shimizu, Toshihiko Hayashi, Takuya Nakamura, Naoki Jyo
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Publication number: 20200185433Abstract: The present technology relates to a semiconductor device, a solid-state image pickup element, an imaging device, and an electronic apparatus that can suppress characteristic fluctuations caused by capacitance fluctuations due to a dummy wire, while maintaining an affixing bonding strength by the dummy wire. Two or more chips in which wires that are electrically connected are formed on bonding surfaces and the bonding surfaces opposing each other are bonded to be laminated are included and, with respect to a region where the wires are periodically and repeatedly disposed in sharing units each made up of a plurality of pixels sharing the same floating diffusion contact, a dummy wire is disposed at the center position thereof on the bonding surface at a pitch of the sharing unit. The present technology can be applied to a CMOS image sensor.Type: ApplicationFiled: February 19, 2020Publication date: June 11, 2020Applicant: SONY CORPORATIONInventors: Rena SUZUKI, Takeshi MATSUNUMA, Naoki JYO, Yoshihisa KAGAWA
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Patent number: 10665623Abstract: The present technology relates to a semiconductor device, a solid-state image pickup element, an imaging device, and an electronic apparatus that can suppress characteristic fluctuations caused by capacitance fluctuations due to a dummy wire, while maintaining an affixing bonding strength by the dummy wire. Two or more chips in which wires that are electrically connected are formed on bonding surfaces and the bonding surfaces opposing each other are bonded to be laminated are included and, with respect to a region where the wires are periodically and repeatedly disposed in sharing units each made up of a plurality of pixels sharing the same floating diffusion contact, a dummy wire is disposed at the center position thereof on the bonding surface at a pitch of the sharing unit. The present technology can be applied to a CMOS image sensor.Type: GrantFiled: February 12, 2016Date of Patent: May 26, 2020Assignee: SONY CORPORATIONInventors: Rena Suzuki, Takeshi Matsunuma, Naoki Jyo, Yoshihisa Kagawa
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Patent number: 10600838Abstract: There is provided semiconductor devices and methods of forming the same, the semiconductor devices including: a first semiconductor element having a first electrode; a second semiconductor element having a second electrode; a Sn-based micro-solder bump formed on the second electrode; and a concave bump pad including the first electrode opposite to the micro-solder bump, where the first electrode is connected to the second electrode via the micro-solder bump and the concave bump pad.Type: GrantFiled: April 15, 2015Date of Patent: March 24, 2020Assignee: SONY CORPORATIONInventors: Satoru Wakiyama, Naoki Jyo, Kan Shimizu, Toshihiko Hayashi, Takuya Nakamura
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Publication number: 20190326344Abstract: There is provided semiconductor devices and methods of forming the same, the semiconductor devices including: a first semiconductor element having a first electrode; a second semiconductor element having a second electrode; a Sn-based micro-solder bump formed on the second electrode; and a concave bump pad including the first electrode opposite to the micro-solder bump, where the first electrode is connected to the second electrode via the micro-solder bump and the concave bump pad.Type: ApplicationFiled: July 3, 2019Publication date: October 24, 2019Applicant: Sony CorporationInventors: Satoru WAKIYAMA, Naoki JYO, Kan SHIMIZU, Toshihiko HAYASHI, Takuya NAKAMURA
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Publication number: 20180308891Abstract: An imaging device includes a first semiconductor element including at least one bump pad that has a concave shape. The at least one bump pad includes a first metal layer and a second metal layer on the first metal layer. The imaging device includes a second semiconductor element including at least one electrode. The imaging device includes a microbump electrically connecting the at least one bump pad to the at least one electrode. The microbump includes a diffused portion of the second metal layer, and first semiconductor element or the second semiconductor element includes a pixel unit.Type: ApplicationFiled: October 7, 2016Publication date: October 25, 2018Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Satoru WAKIYAMA, Kan SHIMIZU, Toshihiko HAYASHI, Takuya NAKAMURA, Naoki JYO
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Publication number: 20180033813Abstract: The present technology relates to a semiconductor device, a solid-state image pickup element, an imaging device, and an electronic apparatus that can suppress characteristic fluctuations caused by capacitance fluctuations due to a dummy wire, while maintaining an affixing bonding strength by the dummy wire. Two or more chips in which wires that are electrically connected are formed on bonding surfaces and the bonding surfaces opposing each other are bonded to be laminated are included and, with respect to a region where the wires are periodically and repeatedly disposed in sharing units each made up of a plurality of pixels sharing the same floating diffusion contact, a dummy wire is disposed at the center position thereof on the bonding surface at a pitch of the sharing unit. The present technology can be applied to a CMOS image sensor.Type: ApplicationFiled: February 12, 2016Publication date: February 1, 2018Inventors: Rena SUZUKI, Takeshi MATSUNUMA, Naoki JYO, Yoshihisa KAGAWA
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Publication number: 20170053960Abstract: There is provided semiconductor devices and methods of forming the same, the semiconductor devices including: a first semiconductor element having a first electrode; a second semiconductor element having a second electrode; a Sn-based micro-solder bump formed on the second electrode; and a concave bump pad including the first electrode opposite to the micro-solder bump, where the first electrode is connected to the second electrode via the micro-solder bump and the concave bump pad.Type: ApplicationFiled: April 15, 2015Publication date: February 23, 2017Applicant: Sony CorporationInventors: Satoru WAKIYAMA, Naoki JYO, Kan SHIMIZU, Toshihiko HAYASHI, Takuya NAKAMURA