Abstract: Provided is a semiconductor device capable of maintaining the flatness of a glass substrate and sufficiently protecting an end portion of the glass substrate. A semiconductor device according to one aspect of the present disclosure includes: a glass substrate including a first surface, a second surface opposite to the first surface, and a first side surface between the first surface and the second surface; wirings provided on the first and second surfaces; a first insulating film that covers the first surface; a second insulating film that covers the second surface; and a third insulating film that covers the first side surface, the third insulating film being continuous with at least one of the first and second insulating films.

Abstract: To eliminate influence caused by a difference in coefficient of linear expansion between a substrate and another material, and to secure a stable mounting structure of a semiconductor element. A semiconductor device includes a glass substrate and the semiconductor element. The glass substrate includes a through hole that penetrates front and back surfaces. Furthermore, the glass substrate includes a stepped portion on an outer periphery of the through hole. The semiconductor element is joined to the stepped portion of the glass substrate. For example, in a case where an imaging element is used as the semiconductor element, image quality of an image obtained by imaging is improved by preventing defocus of light incident on the imaging element.

Abstract: An antenna device and a wireless communication apparatus capable of implementing increase in bandwidth and reduction of the manufacturing cost are provided. The antenna device includes a first antenna element and a second antenna element arranged on one face side of the first antenna element. The first antenna element includes a first glass substrate and a first patch antenna provided on the first glass substrate. The second antenna element includes a second glass substrate and a second patch antenna provided on the second glass substrate. At least part of the first patch antenna faces the second patch antenna with an air gap interposed therebetween.

Abstract: Provided is a protection structure that appropriately protects a side surface of a glass substrate in a semiconductor module. A semiconductor module is provided with a glass substrate. The glass substrate is provided with a plurality of straight line portions and a corner portion interposed between the straight line portions on a side surface thereof. A protective material is formed on at least a part of the side surface of the glass substrate. The corner portion of the glass substrate is located on an inner side of a straight line connecting ridges of protective materials formed on the straight line portions (a center side of the glass substrate). Therefore, the corner portion is protected against an impact on the side surface of the glass substrate.

Abstract: Provided is a light reflecting element including a support portion, a hinge portion, and a light reflecting portion, in which the light reflecting portion includes a support layer and a light reflecting layer, the hinge portion includes a torsion bar portion, extending portions extending from side portions of the torsion bar portion, and movable pieces extending from end portions of the extending portions, an end portion of the torsion bar portion is fixed to the support portion, the hinge portion is twistedly deformable around an axis of the torsion bar portion, the support layer is fixed to the movable pieces, and a recessed portion is provided at least at a portion of the support layer facing a space located between the first movable piece and the second movable piece.

Abstract: A light reflecting element includes a support part 21, a hinge part 30, and a light reflecting part 40, in which the light reflecting part 40 includes a support layer and a light reflecting layer 50, the hinge part 30 includes a torsion bar portion 31, extending portions 34A and 34B extending from sides of the torsion bar portion 31, and movable pieces 35A and 35B extending from ends of the extending portions 34A and 34B, an end of the torsion bar portion 31 is fixed to the support part 21, the hinge part 30 is capable of being twisted and deformed around an axis of the torsion bar portion 31, the support layer is fixed to the movable pieces 35A and 35B, a recess 41D is provided at least in a portion of the support layer facing a space 35D located between the first movable piece 35A and the second movable piece 35B, and a stress adjusting layer 91 is provided on the support layer in parallel to the light reflecting layer 50 and separated from the light reflecting layer 50.

Abstract: A pressure sensor includes: a sensor section having one fixed end and first to four gauge resistors arranged on a diaphragm; and a support member fixing the sensor section. A first pair to fourth pair of piezoresistive elements are arranged on the diaphragm. Two piezoresistive elements of each pair have opposite resistance value change directions, and distances to the support member are equal to each other. A distances between each piezoresistive element of the third pair and the fourth pair and the support member is longer than a distance between each piezoresistive element of the first pair and the second pair and the support member. Each gauge resistor includes a combined resistance, which is provided by serially connecting two corresponding piezoresistive elements. The two corresponding piezoresistive elements have a same resistance value change direction.

Abstract: A pressure sensor includes: a sensor section having one fixed end and first to four gauge resistors arranged on a diaphragm; and a support member fixing the sensor section. A first pair to fourth pair of piezoresistive elements are arranged on the diaphragm. Two piezoresistive elements of each pair have opposite resistance value change directions, and distances to the support member are equal to each other. A distances between each piezoresistive element of the third pair and the fourth pair and the support member is longer than a distance between each piezoresistive element of the first pair and the second pair and the support member. Each gauge resistor includes a combined resistance, which is provided by serially connecting two corresponding piezoresistive elements. The two corresponding piezoresistive elements have a same resistance value change direction.

Abstract: A pressure sensor includes: a housing having a pressure introduction port; and a connector case integrated with the housing. The connector case includes: a protruding portion that protrudes in the pressure introduction port along with the introduction direction from one end of the connector case, and has a concavity hollowed in a direction perpendicular to the introduction direction; a sensor chip having a pressure gauge on one surface of the chip in the concavity; a terminal having one end inserted and molded in the connector case; and a bonding wire that electrically connects the sensor chip and the one end of the terminal. The connector case seals a connection portion between the bonding wire and the terminal, a connection portion between the boding wire and the sensor chip, and the bonding wire.

Abstract: A pressure sensor includes: a housing having a pressure introduction port; and a connector case integrated with the housing. The connector case includes: a protruding portion that protrudes in the pressure introduction port along with the introduction direction from one end of the connector case, and has a concavity hollowed in a direction perpendicular to the introduction direction; a sensor chip having a pressure gauge on one surface of the chip in the concavity; a terminal having one end inserted and molded in the connector case; and a bonding wire that electrically connects the sensor chip and the one end of the terminal. The connector case seals a connection portion between the bonding wire and the terminal, a connection portion between the boding wire and the sensor chip, and the bonding wire.