Patents by Inventor Naoki Katou
Naoki Katou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240101776Abstract: Provided is a prepreg including: a resin composition including a urethane (meth)acrylate (A), a polymerization initiator (B), and an amine catalyst (C); and reinforcement fibers (D). The urethane (meth)acrylate (A) is a reaction product of a polyisocyanate compound (al) and a hydroxyl group-containing compound (a2), the polyisocyanate compound (a1) including polymethylene polyphenyl polyisocyanate and diphenylmethane diisocyanate, the hydroxyl group-containing compound (a2) including a compound having a hydroxyl group and a (meth)acryloyl group.Type: ApplicationFiled: March 17, 2022Publication date: March 28, 2024Applicant: DIC CorporationInventors: Naoki Katou, Tomoaki Shinchi
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Publication number: 20240094452Abstract: A light absorption anisotropic layer in which, when combined with a ?/4 plate to form a circularly polarizing plate, applying the circularly polarizing plate to a display device, and displaying a display screen in black, coloration is suppressed and utilization efficiency of infrared light is high, a laminate including the light absorption anisotropic layer, a display device, an infrared light irradiation device, and an infrared light sensing device. The light absorption anisotropic layer contains an organic dichroic coloring agent, and satisfies expressions (1) to (4). (1) P(450)>99%, (2) P(550)>99%, (3) P(650)>99%, and (4) A(750)<0.2, here, P(450) represents a polarization degree at a wavelength of 450 nm, P(550) represents a polarization degree at a wavelength of 550 nm, P(650) represents a polarization degree at a wavelength of 650 nm, and A(750) represents an average absorbance at a wavelength of 750 nm.Type: ApplicationFiled: October 4, 2023Publication date: March 21, 2024Applicant: FUJIFILM CorporationInventors: Naoya SHIBATA, Takashi KATOU, Naoya NISHIMURA, Naoki KOITO
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Publication number: 20230299548Abstract: A base material at least a surface is made of copper or copper alloy and a silver-nickel-potassium alloy plating layer formed on at least a part of the base material are provided; the silver-nickel-potassium alloy plating layer has a film thickness of 0.5 ?m or more and 20.0 ?m or less, a nickel content of 0.02% by mass or more and 0.60% by mass or less, and a potassium content of 0.03% by mass or more and 1.00% by mass or less; and an average crystal grain size of the silver-nickel-potassium alloy plating layer is preferably 10 nm or more and 150 nm or less.Type: ApplicationFiled: February 24, 2021Publication date: September 21, 2023Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Yoshie Tarutani, Naoki Katou, Kenji Kubota
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Patent number: 11761109Abstract: A terminal material for a connector provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy and formed on a surface of the base material, a silver-nickel alloy plating layer made of silver-nickel alloy and formed on at least a part of the nickel-plating layer, and a silver-plating layer made of silver and formed on the silver-nickel alloy plating layer; the silver-nickel alloy plating layer has a film thickness 0.05 µm or more and less than 0.50 µm and a nickel content 0.03 at% or more and 1.00 at% or less.Type: GrantFiled: January 28, 2021Date of Patent: September 19, 2023Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Yoshie Tarutani, Kenji Kubota, Naoki Katou
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Publication number: 20230111976Abstract: A terminal material for a connector provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy and formed on a surface of the base material, a silver-nickel alloy plating layer made of silver-nickel alloy and formed on at least a part of the nickel-plating layer, and a silver-plating layer made of silver and formed on the silver-nickel alloy plating layer; the silver-nickel alloy plating layer has a film thickness 0.05 µm or more and less than 0.50 µm and a nickel content 0.03 at% or more and 1.00 at% or less.Type: ApplicationFiled: January 28, 2021Publication date: April 13, 2023Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Yoshie Tarutani, Kenji Kubota, Naoki Katou
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Publication number: 20230042045Abstract: Provided is a prepreg containing a urethane (meth)acrylate (A), a polymerization initiator (B), and reinforcement fibers (C), characterized in that the polymerization initiator (B) is an alkyl peroxy ester compound having a 10-hour half-life temperature of 60° C. or higher and lower than 70° C. The prepreg has excellent storage stability and excellent moldability, even under the low-temperature molding condition of 110° C. or lower, and enables to obtain a molded article having excellent physical properties such as interlaminar shear strength. Therefore, the prepreg can be suitably used in automobile components, railway vehicle components, aerospace craft components, ship components, housing equipment components, sporting components, light vehicle components, building and civil engineering components, and casings of OA equipment and the like.Type: ApplicationFiled: December 3, 2020Publication date: February 9, 2023Applicant: DIC CorporationInventors: Naoki Katou, Tomoaki Shinchi
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Patent number: 7172018Abstract: A vehicle air-conditioning system improves a passenger's sensation of cooling by preventing air blown from a foot opening when a cooling load is low, creating a comfortable temperature distribution along the passenger's body. The vehicle air-conditioning system automatically selects a face mode when a target air temperature (TAO) is between a first predetermined temperature and a second predetermined temperature, which is higher than the first predetermined temperature, a bi-level mode when the TAO is higher than the first predetermined temperature and an evaporator air temperature is higher than a predetermined temperature, or a face mode when the TAO is lower than the first predetermined temperature and the evaporator air temperature is lower than the predetermined temperature.Type: GrantFiled: August 19, 2003Date of Patent: February 6, 2007Assignee: Denso CorporationInventors: Naoki Katou, Shinichi Yoshida, Makoto Mimoto
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Patent number: 7015710Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.Type: GrantFiled: August 2, 2004Date of Patent: March 21, 2006Assignee: Genesis Technology IncorporatedInventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
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Patent number: 6937042Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.Type: GrantFiled: August 2, 2004Date of Patent: August 30, 2005Assignee: Genesis Technology IncorporatedInventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
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Patent number: 6919732Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.Type: GrantFiled: August 2, 2004Date of Patent: July 19, 2005Assignee: Genesis Technology IncorporationInventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
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Patent number: 6917211Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.Type: GrantFiled: August 2, 2004Date of Patent: July 12, 2005Assignee: Genesis Technology IncorporatedInventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
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Patent number: 6903563Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.Type: GrantFiled: August 2, 2004Date of Patent: June 7, 2005Assignee: Genesis Technology IncorporatedInventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
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Patent number: 6900647Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.Type: GrantFiled: February 12, 2004Date of Patent: May 31, 2005Assignee: Genesis Technology IncorporatedInventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
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Publication number: 20050007130Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.Type: ApplicationFiled: August 2, 2004Publication date: January 13, 2005Applicant: Genesis Technology IncorporatedInventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
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Publication number: 20050001643Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.Type: ApplicationFiled: August 2, 2004Publication date: January 6, 2005Applicant: Genesis Technology IncorporatedInventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
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Publication number: 20050001644Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.Type: ApplicationFiled: August 2, 2004Publication date: January 6, 2005Applicant: Genesis Technology IncorporatedInventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
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Publication number: 20040160236Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.Type: ApplicationFiled: February 12, 2004Publication date: August 19, 2004Applicant: Genesis Technology IncorporatedInventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
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Patent number: 6710608Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.Type: GrantFiled: February 19, 2002Date of Patent: March 23, 2004Assignee: Mitsubishi Materials CorporationInventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
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Publication number: 20040035568Abstract: A vehicle air-conditioning system improves a passenger's sensation of cooling by preventing air blown from a foot opening when a cooling load is low, creating a comfortable temperature distribution along the passenger's body. The vehicle air-conditioning system automatically selects a face mode when a target air temperature (TAO) is between a first predetermined temperature and a second predetermined temperature, which is higher than the first predetermined temperature, a bi-level mode when the TAO is higher than the first predetermined temperature and an evaporator air temperature is higher than a predetermined temperature, or a face mode when the TAO is lower than the first predetermined temperature and the evaporator air temperature is lower than the predetermined temperature.Type: ApplicationFiled: August 19, 2003Publication date: February 26, 2004Inventors: Naoki Katou, Shinichi Yoshida, Makoto Mimoto
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Patent number: D594009Type: GrantFiled: October 6, 2008Date of Patent: June 9, 2009Assignees: NEC Corporation, NEC Access Technica, Ltd.Inventors: Tomomi Nakano, Hirotoshi Muraki, Shiyuuichi Sugiyama, Kazuhiko Aoyama, Naoki Katou