Patents by Inventor Naoki Katou

Naoki Katou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7172018
    Abstract: A vehicle air-conditioning system improves a passenger's sensation of cooling by preventing air blown from a foot opening when a cooling load is low, creating a comfortable temperature distribution along the passenger's body. The vehicle air-conditioning system automatically selects a face mode when a target air temperature (TAO) is between a first predetermined temperature and a second predetermined temperature, which is higher than the first predetermined temperature, a bi-level mode when the TAO is higher than the first predetermined temperature and an evaporator air temperature is higher than a predetermined temperature, or a face mode when the TAO is lower than the first predetermined temperature and the evaporator air temperature is lower than the predetermined temperature.
    Type: Grant
    Filed: August 19, 2003
    Date of Patent: February 6, 2007
    Assignee: Denso Corporation
    Inventors: Naoki Katou, Shinichi Yoshida, Makoto Mimoto
  • Patent number: 7015710
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Grant
    Filed: August 2, 2004
    Date of Patent: March 21, 2006
    Assignee: Genesis Technology Incorporated
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Patent number: 6937042
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Grant
    Filed: August 2, 2004
    Date of Patent: August 30, 2005
    Assignee: Genesis Technology Incorporated
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Patent number: 6919732
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Grant
    Filed: August 2, 2004
    Date of Patent: July 19, 2005
    Assignee: Genesis Technology Incorporation
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Patent number: 6917211
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Grant
    Filed: August 2, 2004
    Date of Patent: July 12, 2005
    Assignee: Genesis Technology Incorporated
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Patent number: 6903563
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Grant
    Filed: August 2, 2004
    Date of Patent: June 7, 2005
    Assignee: Genesis Technology Incorporated
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Patent number: 6900647
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Grant
    Filed: February 12, 2004
    Date of Patent: May 31, 2005
    Assignee: Genesis Technology Incorporated
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Publication number: 20050007130
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Application
    Filed: August 2, 2004
    Publication date: January 13, 2005
    Applicant: Genesis Technology Incorporated
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Publication number: 20050001644
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Application
    Filed: August 2, 2004
    Publication date: January 6, 2005
    Applicant: Genesis Technology Incorporated
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Publication number: 20050001643
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Application
    Filed: August 2, 2004
    Publication date: January 6, 2005
    Applicant: Genesis Technology Incorporated
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Publication number: 20040160236
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Application
    Filed: February 12, 2004
    Publication date: August 19, 2004
    Applicant: Genesis Technology Incorporated
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Patent number: 6710608
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Grant
    Filed: February 19, 2002
    Date of Patent: March 23, 2004
    Assignee: Mitsubishi Materials Corporation
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Publication number: 20040035568
    Abstract: A vehicle air-conditioning system improves a passenger's sensation of cooling by preventing air blown from a foot opening when a cooling load is low, creating a comfortable temperature distribution along the passenger's body. The vehicle air-conditioning system automatically selects a face mode when a target air temperature (TAO) is between a first predetermined temperature and a second predetermined temperature, which is higher than the first predetermined temperature, a bi-level mode when the TAO is higher than the first predetermined temperature and an evaporator air temperature is higher than a predetermined temperature, or a face mode when the TAO is lower than the first predetermined temperature and the evaporator air temperature is lower than the predetermined temperature.
    Type: Application
    Filed: August 19, 2003
    Publication date: February 26, 2004
    Inventors: Naoki Katou, Shinichi Yoshida, Makoto Mimoto
  • Publication number: 20020186030
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Application
    Filed: February 19, 2002
    Publication date: December 12, 2002
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Hideaki Yoshida, Toshinori Ishii, Atushi Matsuda, Mituyoshi Ueki, Noriyoshi Tachikawa, Tadashi Nakamura, Naoki Katou, Shou Tai, Hayato Sasaki, Naohumi Iwamoto, Akihumi Mishima, Toshiharu Hiji, Akihiro Masuda
  • Publication number: 20010019276
    Abstract: A probe device having a contact probe including a film, a plurality of wiring patterns formed on the film with each wiring pattern having a front end portion projecting from the film so as to form contact pins, and a metal layer provided on the film. In one embodiment, the contact probe device includes first and second contact probes connected to each other, the first contact probe including a first film, and a plurality of first wiring patterns formed on the first film, each first wiring pattern having a front end portion projecting from the first film so as to form contact pins. The second contact probe includes a second film, and a plurality of second wiring patterns formed on the second film. The plurality of second wiring patterns are connected to the plurality of first wiring patterns, and the second contact probe is formed separately from the first contact probe.
    Type: Application
    Filed: May 23, 1997
    Publication date: September 6, 2001
    Inventors: HIDEAKI YOSHIDA, TOSHINORI ISHII, ATUSHI MATSUDA, MITSUYOSHI UEKI, NORIYOSHI TACHIKAWA, TADASHI NAKAMURA, NAOKI KATOU, SHOU TAI, HAYATO SASAKI, NAOHUMI IWAMOTO, AKIHUMI MISHIMA, TOSHIHARU HIJI, AKIHIRO MASUDA
  • Patent number: D594009
    Type: Grant
    Filed: October 6, 2008
    Date of Patent: June 9, 2009
    Assignees: NEC Corporation, NEC Access Technica, Ltd.
    Inventors: Tomomi Nakano, Hirotoshi Muraki, Shiyuuichi Sugiyama, Kazuhiko Aoyama, Naoki Katou