Abstract: To provide an input device cover member capable of realizing excellent writability in an input operation for an input device even when a member having a high friction coefficient such as an elastomer material is used for a pen tip and said input device. An input device cover member disposed on a front surface side of a display in an input device. At least one main surface of the input device cover member has an uneven shape, and a maximum profile valley depth Rv of roughness profile element is larger than a maximum profile peak height Rp of roughness profile element on the main surface having the uneven shape.

Abstract: A membrane separation method where a reverse osmosis method can be applied as a method for separating or concentrating a to-be-treated liquid having a high osmotic pressure or as a water recovery method. The membrane separation method for a to-be-treated liquid having an osmotic pressure includes a first step of separating the to-be-treated liquid into a first permeate and a first retentate by a reverse osmosis method using a loose RO membrane (50). The to-be-treated liquid satisfies ?Cb?>?Pmax when an osmotic pressure of a to-be-treated liquid side membrane surface concentration Cb? is represented by ?Cb? and a maximum operating pressure difference is represented by ?Pmax, or has an osmotic pressure of 5 MPa or more and 100 MPa or less. The loose RO membrane (50) is a membrane through which at least a part of a solute contained in the to-be-treated liquid passes together with a solvent.

Abstract: The purpose of the present invention is to provide a method of purification and preparation of cultured corneal endothelial cells, and in particular, to provide cell surface markers for use in corneal endothelial cells not including transformed cells. Provided are cell markers for distinguishing normal cells and transformed cells, in particular normal and transformed corneal endothelium cells. These cell markers relate to specific cell surface markers, for example, to a normal corneal endothelial surface marker such as CD166, and a transformed cell surface marker such as CD73. By using the transformed cell surface marker such as CD73 to remove transformed cells by sorting, it becomes possible to improve purity of a normal cultured corneal endothelium. By using normal corneal endothelial surface marker such as CD166, or by combined use with the transformed cell surface marker, it becomes possible to provide a means for verifying the purity of a prepared corneal endothelium.

Abstract: A semiconductor device includes: a chip; a circuit element formed in the chip; an insulating layer formed over the chip so as to cover the circuit element; a multilayer wiring region formed in the insulating layer and including a plurality of wirings laminated and arranged in a thickness direction of the insulating layer so as to be electrically connected to the circuit element; at least one insulating region which does not include the wirings in an entire region in the thickness direction of the insulating layer and is formed in a region outside the multilayer wiring region in the insulating layer; and at least one terminal electrode disposed over the insulating layer so as to face the chip with the at least one insulating region interposed between the at least one terminal electrode and the chip.

Abstract: A semiconductor device includes: a chip; a circuit element formed in the chip; an insulating layer formed over the chip so as to cover the circuit element; a multilayer wiring region formed in the insulating layer and including a plurality of wirings laminated and arranged in a thickness direction of the insulating layer so as to be electrically connected to the circuit element; at least one insulating region which does not include the wirings in an entire region in the thickness direction of the insulating layer and is formed in a region outside the multilayer wiring region in the insulating layer; and at least one terminal electrode disposed over the insulating layer so as to face the chip with the at least one insulating region interposed between the at least one terminal electrode and the chip.

Abstract: A semiconductor device includes: a chip; a circuit element formed in the chip; an insulating layer formed over the chip so as to cover the circuit element; a multilayer wiring region formed in the insulating layer and including a plurality of wirings laminated and arranged in a thickness direction of the insulating layer so as to be electrically connected to the circuit element; at least one insulating region which does not include the wirings in an entire region in the thickness direction of the insulating layer and is formed in a region outside the multilayer wiring region in the insulating layer; and at least one terminal electrode disposed over the insulating layer so as to face the chip with the at least one insulating region interposed between the at least one terminal electrode and the chip.

Abstract: An electronic component testing device which is able to release heat (radiate heat) efficiently from a self-heating electronic component, and is able to carry out an intended test efficiently while keeping the temperature of the electronic component within a predetermined range higher than ordinary temperature.

Abstract: A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

Abstract: A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

Abstract: A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

Abstract: A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

Abstract: A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

Abstract: The ceramic-metal bonding structure in accordance with the present invention includes: a ceramic member of an oxide ceramic; a metallic member which is mainly made of Fe and contains Ni and includes an end; an adhesive layer formed on the ceramic member; and a brazing material. The brazing material bonds the adhesive layer and the end of the metallic member. The adhesive layer contains an active metal capable of reacting with the oxide ceramic and has a thickness of equal to or less than 1.5 ?m. An intermetallic compound of the active metal and the Ni exists inside the brazing material so as to be between the adhesive layer and the end of the metallic member.

Abstract: An electronic component testing device which is able to release heat (radiate heat) efficiently from a self-heating electronic component, and is able to carry out an intended test efficiently while keeping the temperature of the electronic component within a predetermined range higher than ordinary temperature.

Abstract: A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

Abstract: An electric vehicle including a high-voltage power source at least including a first power source is provided. The electric vehicle further includes a low-voltage battery that is supplied with electric power from the high-voltage power source through a converter; an auxiliary vehicle controller for controlling a high-voltage contactor with electric power supplied from the high-voltage power source through the converter and/or with electric power supplied from the low-voltage; and an electric motor driving with electric power supplied from the high-voltage power source. The high-voltage contactor is connectedly provided between the high-voltage power source and the auxiliary vehicle controller, and the auxiliary vehicle controller controls the high-voltage contactor in such a manner that the electric power supply from the high-voltage power source is shut off if the electric power supply from the low-voltage battery to the auxiliary vehicle controller is cut off.

Abstract: The present invention provides an electric vehicle including a high-voltage power source at least including a first power source; a low-voltage battery that is supplied with electric power from the high-voltage power source through a converter; an auxiliary vehicle controller for controlling a high-voltage contactor with electric power supplied from the high-voltage power source through the converter and/or with electric power supplied from the low-voltage; and an electric motor driving with electric power supplied from the high-voltage power source. The high-voltage contactor is connectedly provided between the high-voltage power source and the auxiliary vehicle controller, and the auxiliary vehicle controller controls the high-voltage contactor in such a manner that the electric power supply from the high-voltage power source is shut off if the electric power supply from the low-voltage battery to the auxiliary vehicle controller is cut off.

Abstract: A charge equalizing device for a power storage unit, which equalizes a remaining charge of each cell unit of the power storage unit that includes a plurality of groups of cells formed by a plurality of the cell units which are connected in series. The charge equalizing device includes a connection device which connects the groups of cells in series, the connection device being capable of connecting and disconnecting the groups of cells, a connection terminal provided for each of the cell units, and a switch device which connects one of the connection terminals of one of the groups of cells to another connection terminal of the other group of cells. The switch device is capable of changing the combination of the connection terminals to be connected.

Abstract: A charge equalizing device for a power storage unit, which equalizes a remaining charge of each cell unit of the power storage unit that includes a plurality of groups of cells formed by a plurality of the cell units which are connected in series. The charge equalizing device includes a connection device which connects the groups of cells in series, the connection device being capable of connecting and disconnecting the groups of cells, a connection terminal provided for each of the cell units, and a switch device which connects one of the connection terminals of one of the groups of cells to another connection terminal of the other group of cells. The switch device is capable of changing the combination of the connection terminals to be connected.

Abstract: The present invention relates a battery control apparatus (9) controls charge/discharge processes of a battery (8) installed in a hybrid vehicle, according to the battery temperature so as to prevent degradation of the battery performance.